Semiconductor Product Engineer

As a Senior Level Semiconductor Product Engineer specializing in the Power Domain, you are expected to have extensive hands-on experience in semiconductor product engineering and new product development, particularly in the power domain. Your proven track record should demonstrate your proficiency in working with Power Management ICs (PMIC). Your skills should include an in-depth understanding of Integrated Circuit (IC) and package qualification, expertise in reliability testing, and meeting qualification requirements. It is essential to be familiar with global quality standards such as AEC-Q, JEDEC, and IPC. Additionally, your proficiency in semiconductor packaging for automotive applications, assembly processes, and collaboration with OSAT (Outsourced Semiconductor Assembly and Test) and subcontractors is crucial. You should possess a strong capability in interfacing with packaging teams to identify appropriate packaging and design solutions. Moreover, competence in performing comprehensive package assessments, including electrical, thermal, and mechanical simulations, is required. As part of your responsibilities, you will be leading the development and qualification of semiconductor products. Working closely with packaging teams to identify and implement the best packaging and design solutions, conducting thorough package assessments, and ensuring compliance with global quality standards such as AEC-Q, JEDEC, and IPC are key aspects of your role. Collaboration with OSAT and subcontractors for assembly processes is also a significant responsibility. The ideal candidate for this position must have extensive hands-on experience in semiconductor product engineering and new product development. A deep understanding of IC and package qualification, reliability testing, and qualification requirements is essential. Knowledge of semiconductor packaging for automotive applications and familiarity with global quality standards like AEC-Q, JEDEC, and IPC are required. Experience with Power Management ICs (PMIC) is a must, along with strong communication and teamwork skills. Preferred qualifications for this role include experience in interfacing with packaging teams and conducting package assessments, a background in electrical, thermal, and mechanical simulations, as well as a proven ability to work effectively with OSAT and subcontractors.,