3 Semiconductor Packaging Jobs

As a Senior Level Semiconductor Product Engineer specializing in the Power Domain, you are expected to have extensive hands-on experience in semiconductor product engineering and new product development, particularly in the power domain. Your proven track record should demonstrate your proficiency in working with Power Management ICs (PMIC). Your skills should include an in-depth understanding of Integrated Circuit (IC) and package qualification, expertise in reliability testing, and meeting qualification requirements. It is essential to be familiar with global quality standards such as AEC-Q, JEDEC, and IPC. Additionally, your proficiency in semiconductor packaging for automotive applications, assembly processes, and collaboration with OSAT (Outsourced Semiconductor Assembly and Test) and subcontractors is crucial. You should possess a strong capability in interfacing with packaging teams to identify appropriate packaging and design solutions. Moreover, competence in performing comprehensive package assessments, including electrical, thermal, and mechanical simulations, is required. As part of your responsibilities, you will be leading the development and qualification of semiconductor products. Working closely with packaging teams to identify and implement the best packaging and design solutions, conducting thorough package assessments, and ensuring compliance with global quality standards such as AEC-Q, JEDEC, and IPC are key aspects of your role. Collaboration with OSAT and subcontractors for assembly processes is also a significant responsibility. The ideal candidate for this position must have extensive hands-on experience in semiconductor product engineering and new product development. A deep understanding of IC and package qualification, reliability testing, and qualification requirements is essential. Knowledge of semiconductor packaging for automotive applications and familiarity with global quality standards like AEC-Q, JEDEC, and IPC are required. Experience with Power Management ICs (PMIC) is a must, along with strong communication and teamwork skills. Preferred qualifications for this role include experience in interfacing with packaging teams and conducting package assessments, a background in electrical, thermal, and mechanical simulations, as well as a proven ability to work effectively with OSAT and subcontractors.,

As a highly skilled and experienced leader in MES, you will be responsible for leading the strategy, development, and operation of Manufacturing Execution Systems across all assembly and test operations. Your primary focus will be on semiconductor packaging and testing processes, with a deep understanding of MES solutions and a commitment to continuous improvement in a fast-paced, customer-driven environment. Your key responsibilities will include: - Leading the MES strategy for semiconductor products" assembly and test operations to improve efficiency, quality, and customer satisfaction. - Overseeing MES deployment, configuration, and support across various assembly, package, and test platforms in a high-mix, high-volume environment. - Collaborating with R&D, engineering, and operations teams to ensure seamless integration of the MES system with automated test equipment, robotic handling systems, and packaging tools. - Ensuring real-time data collection, traceability, and quality compliance through the MES system to meet customer-specific requirements. - Managing system integration between MES, ERP (e.g., SAP), PLM, and test data management systems to ensure smooth data flow across the enterprise. - Implementing equipment automation using SECS/GEM and CPIB for auto tracking, data collection, validations, and recipe management. - Implementing Recipe Management System (RMS) in Assembly and Test manufacturing plants. - Collaborating with QA and process engineering teams to drive yield analysis, failure analysis, and continuous improvement using MES data. - Designing and implementing KPIs to measure system performance, on-time delivery, throughput, and quality metrics. - Optimizing MES systems for equipment utilization, test time reduction, and real-time fault detection to meet customer delivery requirements. - Ensuring MES solutions support regulatory compliance and proper data retention for ISO standards and customer-specific audits. - Leading and mentoring a team of MES professionals, supporting their career development and fostering a culture of innovation and continuous improvement. - Implementing Statistical Process Control (SPC) and OEE dashboards for equipment usage effectiveness. - Overseeing vendor management to ensure the MES platform meets the evolving needs of the assembly/test environment and stays current with industry trends. To qualify for this role, you should have: - A Bachelors or Masters degree in Electrical Engineering, Industrial Engineering, Computer Science, or a related field. - 15+ years of experience in semiconductor assembly, test, and packaging with at least 5 years in a leadership role focused on MES within an OSAT or semiconductor manufacturing environment. - Proficiency in semiconductor assembly and testing processes, MES platforms, real-time data acquisition, and data integration with equipment and enterprise systems. - Demonstrated ability to drive yield improvement, cycle time reduction, and cost control through MES initiatives. - Strong leadership, team management, and communication skills. - Preferred qualifications include experience with data analytics tools, test data management, process automation, and customer interaction. In this role, you can expect to work in a fast-paced, dynamic environment with a focus on continuous improvement. You will collaborate across multiple sites with cross-functional teams and occasionally travel to customer sites or external vendors for system integration, audits, or troubleshooting.,

As a Senior Level Semiconductor Product Engineer specializing in the Power Domain, you will leverage your extensive hands-on experience in semiconductor product engineering and new product development. Your primary focus will be on Power Management ICs (PMIC) and ensuring a proven track record in this area. Your role will require an in-depth understanding of Integrated Circuit (IC) and package qualification, along with expertise in reliability testing to meet stringent qualification requirements. You should be well-versed in global quality standards such as AEC-Q, JEDEC, and IPC, particularly in the context of semiconductor packaging for automotive applications. Collaboration will be key as you work closely with packaging teams to identify optimal packaging and design solutions. Your strong capability in interfacing with various stakeholders, including OSAT (Outsourced Semiconductor Assembly and Test) and subcontractors, will be crucial in ensuring the successful development and qualification of semiconductor products. Responsibilities: - Lead the development and qualification of semiconductor products, with a focus on Power Management ICs. - Collaborate with packaging teams to implement effective packaging and design solutions. - Conduct comprehensive package assessments, including electrical, thermal, and mechanical simulations. - Ensure adherence to global quality standards such as AEC-Q, JEDEC, and IPC. - Partner with OSAT and subcontractors for assembly processes. Requirements: - Extensive hands-on experience in semiconductor product engineering and new product development, with a specific emphasis on Power Management ICs. - Deep understanding of IC and package qualification, reliability testing, and qualification requirements. - Knowledge of semiconductor packaging for automotive applications and familiarity with global quality standards. - Experience in interfacing with packaging teams and conducting package assessments. - Strong communication and teamwork skills. Preferred Qualifications: - Background in electrical, thermal, and mechanical simulations. - Proven ability to work effectively with OSAT and subcontractors. Join our team and utilize your expertise to drive innovation and quality in semiconductor product engineering within the power domain.,