Photonics Wire Bonding Engineer

5 - 9 years

0 Lacs

Posted:3 weeks ago| Platform: Shine logo

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On-site

Job Type

Full Time

Job Description

As an accomplished Photonics Wire Bonding Engineer, you will be responsible for developing and implementing wire bonding procedures for silicon photonics devices such as silicon dies, laser diodes, optical modulators, and photodiodes. Your role will involve collaborating closely with the global Subject Matter Expert (SME) and R&D team to create new products and optimizing the wire bonding process to achieve high yields and high dependability. Additionally, you will work autonomously and assist in the development of the process until mass production. Key Responsibilities: - Design and develop wire bonding processes for silicon photonics devices using various methodologies such as ribbon bond, ball bond, and wedge bond. - Optimize wire bonding processes including different wire types to ensure high yields and reliability. - Evaluate and select the optimum bond capillary type and wire type for specific applications. - Work closely with global teams to design and develop new products. - Collaborate with manufacturing teams to implement and scale-up wire bonding processes. - Develop and maintain documentation related to wire bonding processes. - Continuously monitor and improve wire bonding processes for consistent quality and performance. - Analyze process data and implement corrective actions to improve yields and reduce defects. - Plan, conduct, evaluate, and optimize critical parameters for an optimized wire bonding process. - Collaborate with quality and reliability teams to ensure processes meet customer requirements and industry standards. - Stay updated with the latest developments in wire bonding technology to improve processes and products. Qualifications: - Bachelor's degree in electrical engineering, materials science, or a related field. - Minimum of 5 years of experience in photonics wire bonding process development and optimization. - Strong understanding of wire bonding materials, processes, and equipment. - Experience with automated wire bonding equipment and processes. - Familiarity with optical alignment techniques and equipment. - Experience in high-volume manufacturing of photonics devices. - Proficiency in statistical process control and process optimization techniques. - Excellent problem-solving skills and ability to troubleshoot complex technical issues. - Strong communication and collaboration skills. - Experience with process documentation and quality control methodologies. - Familiarity with industry standards for photonics device manufacturing.,

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