PCB Layout Engineer

As an experienced PCB Design Engineer, your role will involve: - Designing and developing multilayer PCBs, ranging from 16 to 20 layers, while ensuring optimal signal integrity, power integrity, and thermal considerations. - Proficiently routing mixed-signal circuits, including FPGA-based mixed signal boards. - Implementing appropriate safety measures for high current and voltage, with ratings between 12-100V and high current ratings ranging from 200 to 500 Amps. - Developing the PCB Layout and Design using CAD software in both Allegro and OrCAD, along with working on Footprint design & validation. - Designing power supplies, DC-DC converters, power traces, and Bus Bar calculations, including component placement and wiring. - Conducting SI (Signal Integrity) and PI (Power Integrity) analysis to ensure reliable PCB performance. - Implementing impedance-controlled board routing, DDR routing, and processor-on-board routing. - Managing design constraints to ensure compliance with project specifications. - Addressing thermal considerations in PCB designs, optimizing heat dissipation and thermal performance. - Implementing Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Testability (DFT) standards, utilizing CAM350 Gerber validation tools for quality assurance. - Applying RF fundamentals guidelines and high-speed digital fundamentals in your designs. - Documenting work as per ISO company guidelines. An ideal candidate should have: - 4 to 6 years of experience in Multilayer (16 to 20 Layers) mixed signal routing, FPGA based mixed signal boards, High-speed layout, EMI/EMC compliant practices. - 2+ years of experience in 12-100V and 200 to 500 Amps rating. - Strong proficiency in both Allegro and OrCAD 17.x. - Experience in power supplies, DC-DC converters, power traces, Bus Bar calculation, High voltage / High current isolation. - Hands-on experience in Impedance controlled board routing, DDR routing, processor on board routing. - Strong knowledge of rules creation in Constraint, SI (Signal Integrity) analysis, and PI (Power Integrity) analysis. - Thorough understanding of thermal considerations in designs, creepage, clearance, and PCB/laminate materials. - Experience in IPC standards Library footprint creation, complex and multi-layer boards, DFx standards (DFM / DFA / DFT). - Working experience in Stacked and complex boards with high layer count, Constraints Driven methodology, and CAM350 Gerber validation tool. - Self-driven, motivated, and highly productive in PCB design and development. Qualifications required: - BE/B Tech in ECE/EEE/EE Experience: - 4-6 years,