Manufacturing Engineer Staff

Juniper Networks

7 - 10 years

15 - 20 Lacs

Bengaluru

Posted:1 day ago| Platform:

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Skills Required

Fabrication Networking Compliance Failure analysis international travel CAD Packaging SEM New product development Signal integrity

Work Mode

Work from Office

Job Type

Full Time

Job Description

Supports assigned NPI products as key DFM engineer responsible for PCBA manufacturability including compliance with EMS or other DFM guidelines in areas including SMT, BGA repair processes, wave solder, press fit, component package and new part qualification
Works with signal integrity teams and PCB suppliers to develop PC board stack-ups
Performs DFM reviews of new designs in execution with responsibility for resolving PCBA and PCB manufacturability issues
Attends program teams, EMS partner reviews, DFM council or other meetings related to PCBA/PCB DFM issues
Uses strong knowledge of interconnect, SMT, solder process/materials and new component packaging as it applies to PCBA manufacturing to improve designs for high yields and ease of assembly
In coordination with factory teams, monitors or develops DOE s to identify and confirm process parameters related to PCBA
Manages/leads specific mfg. technology related projects as required in collaboration with outside suppliers and internal subject matter experts
Provides guidance/support to quality and sustaining mfg. engineering teams for critical quality or manufacturing problems on assigned products

REQUIREMENTS

BSEE/BSME or higher degree with at least 7-10 years of electronics manufacturing experience
Proven track record in supporting new product development teams as an NPI mfg. engineer with responsibility for complex PCBA and/or PCB manufacturability
Prefer candidates with both OEM PCBA NPI development and EMS partner factory experience
Prefer good/strong knowledge of PCB CAD design and fabrication processes including stack-up analysis and development and understanding of PCB fabrication challenges encountered with complex PCBA s associated with aspect ratios, padstacks, backdrills, and POFV technologies
Requires solid knowledge of interconnect and electronic assembly applications and technologies including soldering, press fit, and rework with knowledge of IPC-A-610.
Understanding of complex failure mechanisms in PCBA process and or PCB fabrication and knowledge of standard failure analysis techniques (SEM, EDX, X-section, Die and Pry, CSAM)
Demonstrated ability to work independently in a fast-paced growth environment
Must have excellent English communications skills, both verbal and written.
Excellent problem-solving/analytical skills with strong aptitude for teamwork
Willingness to travel including domestic and international travel as necessary (estimated 5-10%)

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