406 Floor Planning Jobs - Page 17

Hands-on experience of implementing digital block using state of the art gate to GDSII ASIC flows mainly including Design Initialization, Power planning, Floor planning/Macro placement, Scan-chain reordering, CTS, Route and chip finishing steps Perform Physical Implementation of blocks starting from gate netlist till gds out Perform signoff verifications including Layout verifications (DRC, LVS, Antenna) and Reliability verifications (EMIR, ESD) of the implemented blocks Ownership of writing MCMM and UPF for the block designs Provide handoff data to other signoff closure like STA, Formality, Layout and Reliability verification Job Requirements In-depth understanding of the ASIC Physical design flow steps of starting from Gate netlist Experience in Testchip implementation and testing exposure is a plus Exposure to Synopsys Tool set (such as FC/ICC2, Primetime, Formality, ICV) is highly desirable Exposure to FinFET designs is desirable Experience in working on IO integration with Wire-bond or Flip-chip design would be big plus Experience : Min 5 years of Relevant Physical design domain Education : B.E/B.Tech/M.Tech in ECE/EE

The position will involve working with a very experienced physical design team of Server SOC and is responsible for delivering the physical design of tiles and FullChip to meet challenging goals for frequency, power and other design requirements for AMD next generation processors in a fast-paced environment on cutting edge technology. THE PERSON: The ideal candidate has significant experience in industry, with good attitude who seeks new challenges and has good analytical and problem-solving skills. You have excellent communication and presentation skills, demonstrated through technical publications, presentations, trainings, executive briefings, etc You are highly adept at collaboration among top-thinkers and engineers alike, ready to mentor and guide, and help to elevate the knowledge and skills of the team around you. KEY RESPONSIBILITIES: RTL to GDS2 flow Handling Floor-plan, Physical Implementation of Power-plan, Synthesis, Placement, CTS, , Routing, Extraction, Timing Closure (Tile level, Full chip), Physical Verification (DRC & LVS), Crosstalk Analysis, EM/IR Handling different PNR tools - Synopsys FusionCompiler, Cadence Innovus, PrimeTime, StarRC, Mentor Graphics Calibre, Apache Redhawk Identify and implement opportunities for improving PPA PREFERRED EXPERIENCE: 12+ years of professional experience in physical design, preferably with high performance designs. Experience in automated synthesis and timing driven place and route of RTL blocks for high speed datapath and control logic applications. Experience in automated design flows for clock tree synthesis, clock and power gating techniques, scan stitching, design optimization for improved timing/power/area, and design cycle time reduction. Experience in floorplanning, establishing design methodology, IP integration, checks for logic equivalence, physical/timing/electrical quality, and final signoff for large IP delivery Strong experience with tools for logic synthesis, place and route, timing analysis, and design checks for physical and electrical quality, familiarity with tools for schematics, layout, and circuit/logic simulation Experience in STA, full chip timing Versatility with scripts to automate design flow. Proficiency in scripting language, such as, Perl and Tcl. Strong communication skills, ability to multi-task across projects, and work with geographically spread out teams Experience in FinFET & Dual Patterning nodes such as 16/14/10/7/5nm/3nm Excellent physical design and timing background. Good understanding of computer organization/architecture is preferred. Strong analytical/problem solving skills and pronounced attention to details. ACADEMIC CREDENTIALS: Qualification: Bachelors or Masters in Electronics/Electrical Engineering

The position will involve working with a very experienced physical design team of Server SOC and is responsible for delivering the physical design of tiles and FullChip to meet challenging goals for frequency, power and other design requirements for AMD next generation processors in a fast-paced environment on cutting edge technology. THE PERSON: The ideal candidate has significant experience in industry, with good attitude who seeks new challenges and has good analytical and problem-solving skills. You have excellent communication and presentation skills, demonstrated through technical publications, presentations, trainings, executive briefings, etc You are meticulous about Power, Performance and Area while driving schedule and managing cost. You are highly adept at collaboration among top-thinkers and engineers alike, ready to mentor and guide, and help to elevate the knowledge and skills of the team around you. KEY RESPONSIBILITIES: RTL to GDS2 flow Handling Floor-plan, Physical Implementation of Power-plan, Synthesis, Placement, CTS, , Routing, Extraction, Timing Closure (Tile level, Full chip), Physical Verification (DRC & LVS), Crosstalk Analysis, EM/IR Handling different PNR tools - Synopsys FusionCompiler, Cadence Innovus, PrimeTime, StarRC, Mentor Graphics Calibre, Apache Redhawk Identify and implement opportunities for improving PPA PREFERRED EXPERIENCE: 16+ years of professional experience in physical design, preferably with high performance designs. Experience in automated synthesis and timing driven place and route of RTL blocks for high speed datapath and control logic applications. Experience in automated design flows for clock tree synthesis, clock and power gating techniques, scan stitching, design optimization for improved timing/power/area, and design cycle time reduction. Experience in floorplanning, establishing design methodology, IP integration, checks for logic equivalence, physical/timing/electrical quality, and final signoff for large IP delivery Strong experience with tools for logic synthesis, place and route, timing analysis, and design checks for physical and electrical quality, familiarity with tools for schematics, layout, and circuit/logic simulation Experience in STA, full chip timing Versatility with scripts to automate design flow. Proficiency in scripting language, such as, Perl and Tcl. Strong communication skills, ability to multi-task across projects, and work with geographically spread out teams Experience in FinFET & Dual Patterning nodes such as 16/14/10/7/5nm/3nm Excellent physical design and timing background. Good understanding of computer organization/architecture is preferred. Strong analytical/problem solving skills and pronounced attention to details. ACADEMIC CREDENTIALS: Qualification: Bachelors or Masters in Electronics/Electrical Engineering

The position will involve working with a very experienced physical design team of Server SOC and is responsible for delivering the physical design of tiles and FullChip to meet challenging goals for frequency, power and other design requirements for AMD next generation processors in a fast-paced environment on cutting edge technology. THE PERSON: The ideal candidate has significant experience in industry, with good attitude who seeks new challenges and has good analytical and problem-solving skills. You have excellent communication and presentation skills, demonstrated through technical publications, presentations, trainings, executive briefings, etc You are highly adept at collaboration among top-thinkers and engineers alike, ready to mentor and guide, and help to elevate the knowledge and skills of the team around you. KEY RESPONSIBILITIES: RTL to GDS2 flow Handling Floor-plan, Physical Implementation of Power-plan, Synthesis, Placement, CTS, , Routing, Extraction, Timing Closure (Tile level, Full chip), Physical Verification (DRC & LVS), Crosstalk Analysis, EM/IR Handling different PNR tools - Synopsys FusionCompiler, Cadence Innovus, PrimeTime, StarRC, Mentor Graphics Calibre, Apache Redhawk Identify and implement opportunities for improving PPA PREFERRED EXPERIENCE: 12+ years of professional experience in physical design, preferably with high performance designs. Experience in automated synthesis and timing driven place and route of RTL blocks for high speed datapath and control logic applications. Experience in automated design flows for clock tree synthesis, clock and power gating techniques, scan stitching, design optimization for improved timing/power/area, and design cycle time reduction. Experience in floorplanning, establishing design methodology, IP integration, checks for logic equivalence, physical/timing/electrical quality, and final signoff for large IP delivery Strong experience with tools for logic synthesis, place and route, timing analysis, and design checks for physical and electrical quality, familiarity with tools for schematics, layout, and circuit/logic simulation Experience in STA, full chip timing Versatility with scripts to automate design flow. Proficiency in scripting language, such as, Perl and Tcl. Strong communication skills, ability to multi-task across projects, and work with geographically spread out teams Experience in FinFET & Dual Patterning nodes such as 16/14/10/7/5nm/3nm Excellent physical design and timing background. Good understanding of computer organization/architecture is preferred. Strong analytical/problem solving skills and pronounced attention to details. ACADEMIC CREDENTIALS: Qualification: Bachelors or Masters in Electronics/Electrical Engineering

Role & responsibilities 1.Job description - Analog Layout: Exciting Opportunity for Analog Layout Engineers ! Elevate your career with Digicomm Semiconductor Private Limited and take the next leap in your professional journey. Join us for unparalleled growth and development. Responsibilities:- Excellent work experience in Analog / Mixed Signal Layout design in advanced FinFET processes like 16nm, 12nm, 10nm, 7nm, 5nm, 3nm Expertise on complete PNR flow CTS,routing, Timing Closure. Hands on experience in any or multiple critical blocks such as SERDES, PHY, HDMI, PLL, ADC, DAC, LDO, Bandgap, Ref Generators, Charge Pump, Current Mirrors, Comparator, Differential Amplifier etc. Excellent understanding of CMOS / Bi-CMOS / SOI / FinFET process Excellent understanding of CMOS / Bi-CMOS / SOI / FinFET process Experience in AMS IP integration in full chip according to the guidelines demanded by the Full Chip needs Excellent problem-solving skills in Routing Congestion, Physical Verification in Custom Layout Qualifications:- BTECH/MTECH Location: Bangalore & Noida Experience:- The Engineers with 5 to 10 years of Experience 2.Job description - Physical Verification- Exciting Opportunity for Physical Verification Engineers ! Elevate your career with Digicomm Semiconductor Private Limited and take the next leap in your professional journey. Join us for unparalleled growth and development. Responsibilities:- Design Rule Checking (DRC): Run DRC checks using industry-standard tools to identify violations of manufacturing design rules. Collaborate with layout designers to resolve DRC issues. Layout vs. Schematic (LVS) Verification: Perform LVS checks to ensure that the physical layout accurately matches the schematic and that there are no electrical connectivity discrepancies. Electrical Rule Checking (ERC): Verify that the layout adheres to electrical constraints and requirements, such as voltage and current limitations, ensuring that the IC functions as intended. Design for Manufacturing (DFM): Collaborate with design and manufacturing teams to optimize the layout for the semiconductor fabrication process. Address lithography and process variation concerns. Process Technology Calibration: Calibrate layout extraction tools and parameters to match the specific process technology used for fabrication. Resolution Enhancement Techniques (RET): Implement RET techniques to improve the printability of layout patterns during the photolithography process. Fill Insertion: Insert fill cells into the layout to improve planarity and reduce manufacturing-related issues, such as wafer warping and stress. Multi-Patterning and Advanced Nodes: Deal with challenges specific to advanced process nodes, including multi-patterning, coloring, and metal stack variations. Hotspot Analysis: Identify and address potential hotspot areas that may lead to manufacturing defects or yield issues. Post-Processing Simulation: Perform post-processing simulations to verify that the layout is compatible with the manufacturing process and does not introduce unwanted parasitics. Process Integration Checks: Collaborate with process integration teams to ensure the smooth integration of the design with the semiconductor fabrication process. Documentation: Maintain detailed documentation of verification processes, methodologies, and results. Qualifications:- BTECH/MTECH Experience:- The Engineers with 5 to 10 years of Experience Location:- Bangalore/ Noida

• Physical Design of blocks & handle Complex block implementation. • Floorplan optimization for area, Power & Timing. • Block-level PnR & close Design to meet Timing, area & Power constraints. • Implement ECOs to fix timing, noise & EM-IR violations. Required Candidate profile * Exp in RTL Synthesis for PnR using small geometry FinFET. * Strong in Physical Design incl. physically aware Synthesis, floor-planning, PnR * Logic equivalency RTL2Synthesis & Synthesis2APR netlist.