Posted:1 day ago|
Platform:
Work from Office
Full Time
We are looking for a skilled System Failure Analysis Engineer with hands-on experience in mobile phone backend process failure analysis, teardown, and detailed reporting. The candidate should be analytical, methodical, and capable of identifying root causes of failures to drive quality improvements. Key Responsibilities: Perform Failure Analysis (FA) of mobile phones during backend production processes. Conduct teardown and repair activities to identify physical and functional issues in mobile hardware. Analyze backend process parameters impacting product performance and yield. Prepare detailed Failure Analysis and Yield Reports for internal and customer reviews. Utilize structured problem-solving techniques like 4M Analysis and 5W1H to identify root causes. Work closely with cross-functional teams (Production, QA, Engineering) for process improvement. Operate tools such as OMM (Optical Measuring Machine) , VHX (Digital Microscope) , and other measuring instruments. Apply logical thinking and structured diagnostics to detect anomalies in system behavior and design. Required Skills: Hands-on experience with teardown, inspection, and repair of mobile phones or electronic components Strong understanding of Failure Analysis methodologies Proficiency in FA report and yield report preparation Familiarity with 4M/5W1H analysis techniques Experience with measuring tools like OMM, VHX, Vernier, Micrometers Strong analytical and logical thinking skills Basic understanding of backend production processes in electronics Preferred Candidate Profile: Experience in mobile phone, electronics, or semiconductor industries Ability to work under pressure and solve problems independently Good documentation and communication skills
Foxconn
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