Staff Electronics SI/PI Engineer

Responsibilities:

Required Skills and Experience :

• 8+ Years of Experience with strong understanding of hardware architectures, electronics and embedded compute
• Deep knowledge of high-speed Signal and Power Integrity and timing analysis techniques, across silicon, package and board. Electromagnetic modeling of 3-D structures
• Expertise in SI analysis of high density SoCs. Optimize signal paths for signal quality and prevent signal degradation. Verify routing strategy with a particular stack-up and rule set
• Deep understanding of multi-port matrixes (S, Y, Z parameters)
• Detailed understanding of high-speed interface standards e.g. PCIe Gen 5/6/7 and DDR4/5 and LPDDR4/5/5x/6 memory technologies, USB, Ethernet
• Familiarity with different IC packaging technologies and their impact on PCB design to ensure seamless integration of SoCs, ensuring proper signal routing and power delivery
• Experience of collaborating with chip packaging teams. Ability to influence SoC device pin-outs for performance optimization, routing feasibility and layer trade-off analysis
• Understanding of the PCB fabrication process (PTH and HDI), stackup/via topologies and substrate materials
• Proficiency in the use of Signal Integrity tools from ANSYS, Siemens EDA and PCB Layout specifically Cadence Allegro PCB suite and OrCAD CIS
• Good communication and interpersonal skills. Positive can-do attitude and attention to detail

Nice To Have Skills and Experience :

• Good understanding of SoC implementations and models (IBIS models, power models, impedance profiles of power delivery networks)
• Experience of design automation and scripting
• Embedded hardware debug using laboratory test equipment (e.g. oscilloscopes, VNAs)
• Enjoy collaborating across geographies with multiple teams

In Return:

Equal Opportunities at Arm