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Semiconductor Packaging- Thermal Modeler

Semiconductor Packaging- Thermal Modeler

IBM

3 - 8 years

7 - 11 Lacs

bengaluru

Posted:None| Platform:

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Skills Required

applied mathematics fea thermal management cad tools doe c++ cad ansys jmp autocad catia fem ansys workbench hypermesh solid works laser ansa thermal pro-e cfd matlab icepak python minitab labview flotherm dsc modeler creo flash statistics

Work Mode

Work from Office

Job Type

Full Time

Job Description

About the Team:
Join a world-class product development organization at IBM, driving innovation across IBM Z and POWER System servers, Storage and Quantum. The Thermal and Mechanical Design team is seeking a skilled professional in thermal modeling with hands-on experience in building, testing, and validating thermal solutions. You’ll be part of a multidisciplinary team developing high-performance, high-reliability server hardware. Role Overview:
As a Thermal Modeler, you will design and optimize IBM module and server hardware systems to meet thermal and mechanical requirements. You’ll collaborate with cross-functional teams to ensure designs meet performance, safety, and manufacturability standards. Your work will involve simulation, validation, and providing actionable insights to guide engineering decisions. Key Responsibilities:

Develop steady-state and transient CFD-based thermal models using CAD and FVM tools.

Acquire and analyze material properties to enhance model accuracy.

Validate simulation predictions through lab testing and data analysis.

Prepare detailed reports and presentations for stakeholders.

Provide design guidelines for thermal hardware components including laminates, TIMs, cold plates, chips, GPUs, HBMs, and actuation hardware.

Influence design decisions to ensure robust thermal solutions for IBM server systems.

Required education Master's Degree Preferred education Doctorate Degree Required technical and professional expertise

Master’s or PhD in Mechanical Engineering with a focus on Thermal or Structural Mechanics.

3+ years of experience in FEM and/or CFD.

Proficiency in CAD tools (SolidWorks preferred) and simulation tools like Ansys.

Experience with lab tools and design for manufacturability.

Strong communication, problem-solving, and time management skills.

Ability to work independently and in cross-functional teams.

Preferred technical and professional experience

5+ years of experience in thermal modeling and FEA/FVM using tools like FloTherm, SixSigmaET (Celsius), Ansys IcePak, or Fluent.

Experience in structural FEA for stress, strain, and warpage prediction.

Knowledge of moisture diffusion and swelling simulations.

Familiarity with server and computer architecture.

Expertise in thermal management of microelectronic packages.

Hands-on experience with lab tools such as laser flash conductivity and DSC.

Proficiency in applied statistics and DOE using tools like Minitab or JMP.

Programming experience in MATLAB, Python, LabVIEW, or C++.

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Semiconductor Packaging- Thermal Modeler