Job
Description
Job Summary: We are looking for skilled and motivated engineers to join our upcoming Power Semiconductor Packaging Facility. You will be involved in the assembly, testing, and quality assurance of power semiconductor devices including MOSFETs, IGBTs, Diodes, and SCRs in TO220, TO252, TO263, D2PAK, and QFN packages. Candidates with a background in semiconductor device packaging, power electronics, or microelectronics are encouraged to apply. Key Responsibilities: Oversee and perform power semiconductor packaging using TO220, TO252, TO263, and QFN formats. Handle die bonding, wire bonding, mold packaging, and surface mount processes. Conduct failure analysis and quality assurance of packaged devices. Optimize packaging process parameters to ensure reliability and cost-effectiveness. Collaborate with design and production teams to align packaging processes with device specifications. Operate and maintain automated and semi-automated packaging equipment. Prepare detailed reports and documentation related to yield, defects, and process improvements. Educational Qualifications: Diploma / B.E. / B.Tech in one of the following disciplines: Electronics and Communication Engineering Electrical and Electronics Engineering Mechatronics Microelectronics Applied Electronics Materials Science Mechanical (with electronics exposure) Preferred for Senior Roles: M.E. / M.Tech in Microelectronics / VLSI / Embedded Systems / Power Electronics Training or certification in semiconductor packaging or SMT processes Experience with semiconductor packaging (TO, QFN, D2PAK formats) Understanding of electrical characteristics of power semiconductor devices Familiarity with SMT, cleanroom procedures, and ESD safety standards Knowledge in thermal management and power device reliability Use of tools like X-ray inspection, die shear testers, or wire pull testers Exposure to Six Sigma, SPC, or ISO standards is a plus Desired Skills & Experience: Experience with semiconductor packaging (TO, QFN, D2PAK formats) Understanding of electrical characteristics of power semiconductor devices Familiarity with SMT, cleanroom procedures, and ESD safety standards Knowledge in thermal management and power device reliability Use of tools like X-ray inspection, die shear testers, or wire pull testers Exposure to Six Sigma, SPC, or ISO standards is a plus Job Types: Full-time, Permanent Pay: ₹25,000.00 - ₹30,000.00 per month Benefits: Paid time off Schedule: Fixed shift Supplemental Pay: Performance bonus Yearly bonus Work Location: In person
