Posted:5 hours ago| Platform: Naukri logo

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Job Title: Motherboard Environmental Failure Analysis Engineer  

Department: Hardware R&D/Reliability Engineering Department  


Job Responsibilities: 1. Failure Analysis and Root Cause Identification    - Conduct systematic root cause analysis (RCA) for mobile phone motherboard failures (e.g., short circuits, open circuits, signal anomalies, component failures) observed during environmental tests, including high-temperature/high-humidity cycling, thermal cycling, and powered humidity/heat testing.      - Investigate failure mechanisms (e.g., corrosion, solder joint cracking, material aging, thermal stress failure) using schematics, PCB design files, and production process data.   2. Test Execution and Improvement Recommendations    - Lead or assist in post-environmental-test motherboard performance evaluations, develop failure reproduction plans, and validate failure modes.      - Propose design optimizations, material selection, or process improvements based on analysis results to enhance motherboard environmental reliability.   3. Tool Utilization and Reporting    - Proficiently use at least 3 failure analysis tools (e.g., oscilloscopes, multimeters, DC power supplies, LCR meters, thermal imaging cameras, CT/X-ray, data loggers, EDS, FTIR, metallographic cross-section analysis) for failure localization and verification.      - Deliver detailed failure analysis reports, including failure symptoms, analytical processes, root cause conclusions, and improvement measures, to drive issue resolution.   4. Cross-Functional Collaboration    - Collaborate closely with hardware design, test engineering, and manufacturing teams to prevent and resolve failure issues.      - Support failure case analysis and technical communication with clients or suppliers.   Qualifications: 1. Education    - Bachelors degree or higher in Electronics and Communication Engineering, Circuit Engineering, Hardware Development, or related fields.   2. Experience    - 3+ years of experience in electronic hardware failure analysis, reliability engineering, or PCB design, etc. Experience in consumer electronics/telecommunications/automotive electronics industries preferred.   Benefits: - Competitive salary and year-end bonuses   - Technical training and career development paths   Notes: - Occasional travel to partner factories or client sites for failure analysis support may be required.   - Proficiency in reading and writing technical documentation in English is preferred.

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FOXCONN HON HAI TECHNOLOGY INDIA MEGA DEVELOPMENT PRIVATE  LIMITED
FOXCONN HON HAI TECHNOLOGY INDIA MEGA DEVELOPMENT PRIVATE LIMITED

Electronics Manufacturing

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