4 - 6 years
4 - 5 Lacs
Posted:5 hours ago|
Platform:
Work from Office
Full Time
Job Title: Motherboard Environmental Failure Analysis Engineer
Department: Hardware R&D/Reliability Engineering Department
Job Responsibilities: 1. Failure Analysis and Root Cause Identification - Conduct systematic root cause analysis (RCA) for mobile phone motherboard failures (e.g., short circuits, open circuits, signal anomalies, component failures) observed during environmental tests, including high-temperature/high-humidity cycling, thermal cycling, and powered humidity/heat testing. - Investigate failure mechanisms (e.g., corrosion, solder joint cracking, material aging, thermal stress failure) using schematics, PCB design files, and production process data. 2. Test Execution and Improvement Recommendations - Lead or assist in post-environmental-test motherboard performance evaluations, develop failure reproduction plans, and validate failure modes. - Propose design optimizations, material selection, or process improvements based on analysis results to enhance motherboard environmental reliability. 3. Tool Utilization and Reporting - Proficiently use at least 3 failure analysis tools (e.g., oscilloscopes, multimeters, DC power supplies, LCR meters, thermal imaging cameras, CT/X-ray, data loggers, EDS, FTIR, metallographic cross-section analysis) for failure localization and verification. - Deliver detailed failure analysis reports, including failure symptoms, analytical processes, root cause conclusions, and improvement measures, to drive issue resolution. 4. Cross-Functional Collaboration - Collaborate closely with hardware design, test engineering, and manufacturing teams to prevent and resolve failure issues. - Support failure case analysis and technical communication with clients or suppliers. Qualifications: 1. Education - Bachelors degree or higher in Electronics and Communication Engineering, Circuit Engineering, Hardware Development, or related fields. 2. Experience - 3+ years of experience in electronic hardware failure analysis, reliability engineering, or PCB design, etc. Experience in consumer electronics/telecommunications/automotive electronics industries preferred. Benefits: - Competitive salary and year-end bonuses - Technical training and career development paths Notes: - Occasional travel to partner factories or client sites for failure analysis support may be required. - Proficiency in reading and writing technical documentation in English is preferred.
FOXCONN HON HAI TECHNOLOGY INDIA MEGA DEVELOPMENT PRIVATE LIMITED
Upload Resume
Drag or click to upload
Your data is secure with us, protected by advanced encryption.
Browse through a variety of job opportunities tailored to your skills and preferences. Filter by location, experience, salary, and more to find your perfect fit.
We have sent an OTP to your contact. Please enter it below to verify.
Sriperumbudur
2.0 - 5.0 Lacs P.A.
4.75 - 5.5 Lacs P.A.
Chennai
2.25 - 5.0 Lacs P.A.
Bengaluru
2.25 - 3.25 Lacs P.A.
5.0 - 10.0 Lacs P.A.
Devanahalli, Bengaluru
2.5 - 4.0 Lacs P.A.
Bengaluru
4.0 - 8.0 Lacs P.A.
4.75 - 5.5 Lacs P.A.
Hyderabad
Experience: Not specified
2.0 - 7.0 Lacs P.A.
Noida
9.0 - 19.0 Lacs P.A.