Job Title: Motherboard Environmental Failure Analysis Engineer Department: Hardware R&D/Reliability Engineering Department Job Responsibilities: 1. Failure Analysis and Root Cause Identification - Conduct systematic root cause analysis (RCA) for mobile phone motherboard failures (e.g., short circuits, open circuits, signal anomalies, component failures) observed during environmental tests, including high-temperature/high-humidity cycling, thermal cycling, and powered humidity/heat testing. - Investigate failure mechanisms (e.g., corrosion, solder joint cracking, material aging, thermal stress failure) using schematics, PCB design files, and production process data. 2. Test Execution and Improvement Recommendations - Lead or assist in post-environmental-test motherboard performance evaluations, develop failure reproduction plans, and validate failure modes. - Propose design optimizations, material selection, or process improvements based on analysis results to enhance motherboard environmental reliability. 3. Tool Utilization and Reporting - Proficiently use at least 3 failure analysis tools (e.g., oscilloscopes, multimeters, DC power supplies, LCR meters, thermal imaging cameras, CT/X-ray, data loggers, EDS, FTIR, metallographic cross-section analysis) for failure localization and verification. - Deliver detailed failure analysis reports, including failure symptoms, analytical processes, root cause conclusions, and improvement measures, to drive issue resolution. 4. Cross-Functional Collaboration - Collaborate closely with hardware design, test engineering, and manufacturing teams to prevent and resolve failure issues. - Support failure case analysis and technical communication with clients or suppliers. Qualifications: 1. Education - Bachelors degree or higher in Electronics and Communication Engineering, Circuit Engineering, Hardware Development, or related fields. 2. Experience - 3+ years of experience in electronic hardware failure analysis, reliability engineering, or PCB design, etc. Experience in consumer electronics/telecommunications/automotive electronics industries preferred. Benefits: - Competitive salary and year-end bonuses - Technical training and career development paths Notes: - Occasional travel to partner factories or client sites for failure analysis support may be required. - Proficiency in reading and writing technical documentation in English is preferred.
