Job Title: Motherboard Environmental Failure Analysis Engineer Department: Hardware R&D/Reliability Engineering Department Job Responsibilities: 1. Failure Analysis and Root Cause Identification - Conduct systematic root cause analysis (RCA) for mobile phone motherboard failures (e.g., short circuits, open circuits, signal anomalies, component failures) observed during environmental tests, including high-temperature/high-humidity cycling, thermal cycling, and powered humidity/heat testing. - Investigate failure mechanisms (e.g., corrosion, solder joint cracking, material aging, thermal stress failure) using schematics, PCB design files, and production process data. 2. Test Execution and Improvement Recommendations - Lead or assist in post-environmental-test motherboard performance evaluations, develop failure reproduction plans, and validate failure modes. - Propose design optimizations, material selection, or process improvements based on analysis results to enhance motherboard environmental reliability. 3. Tool Utilization and Reporting - Proficiently use at least 3 failure analysis tools (e.g., oscilloscopes, multimeters, DC power supplies, LCR meters, thermal imaging cameras, CT/X-ray, data loggers, EDS, FTIR, metallographic cross-section analysis) for failure localization and verification. - Deliver detailed failure analysis reports, including failure symptoms, analytical processes, root cause conclusions, and improvement measures, to drive issue resolution. 4. Cross-Functional Collaboration - Collaborate closely with hardware design, test engineering, and manufacturing teams to prevent and resolve failure issues. - Support failure case analysis and technical communication with clients or suppliers. Qualifications: 1. Education - Bachelors degree or higher in Electronics and Communication Engineering, Circuit Engineering, Hardware Development, or related fields. 2. Experience - 3+ years of experience in electronic hardware failure analysis, reliability engineering, or PCB design, etc. Experience in consumer electronics/telecommunications/automotive electronics industries preferred. Benefits: - Competitive salary and year-end bonuses - Technical training and career development paths Notes: - Occasional travel to partner factories or client sites for failure analysis support may be required. - Proficiency in reading and writing technical documentation in English is preferred.

Job Title: Software Testing Engineer Department: WGT (White Glove Test) Work Environment: Laboratory & Strict security control. Department introduction: WGT is mainly focused (Phone Operating System) software testing and its relevant accessories and little bit UI automation. It is a kind of black box testing and function testing, can also say it is manual testing. Daily work includes validate defects on latest Phone with the latest software provided by client, hunt for software defects as many as possible, perform function testing and performance testing and so on. Program language skills like Python and Shell can helps much in our work. Requirement: Around 3-5 years experience in software testing or related domain experience, better have mobile/application software testing experience. Have good communication skills Proficient in basic Python/Shell Be positive for cooperation Good power of execution Role: Mobile Software Testing engineer

Job Title: Software Testing Engineer Department: WGT (White Glove Test) Work Environment: Laboratory & Strict security control. Department introduction: WGT is mainly focused on mobile software testing and its relevant accessories and little bit UI automation. It is a kind of black box testing and function testing, can also say it is manual testing. Daily work includes validate defects on latest technology with the latest software provided by apple client, hunt for software defects as many as possible, perform function testing and performance testing and so on. Program language skills like Python and Shell can helps much in our work. Requirement: Around 10 years experience in software testing or related domain experience, better have mobile/application software testing experience. Good management experience Have good communication skills Proficient in basic Python/Shell Be positive for cooperation Good power of execution Role: Testing leader & responsibility for specific testing & help supervisor manage local team

PD - Thermal Design EngineerJob Type: Full-timeCompany: Foxconn Summary We are seeking an experienced of product designer. We sincerely invite you to join our Foxconn product design team in an exciting and fast-paced organization. This is an exciting job. You can learn the latest design through work, and then provide design feedback to customers based on your past work experience. With the goal of creating experiences that influence the industry, as well as peoples lives. By constantly focusing on the clients. Key QualificationsEssential skills or experiences:Bachelors degree in electronics, automation or computer science related engineering3-5 years experience in Testing/Thermal design (preferably consumer electronic products i.e. Handheld/portable device)Proficient in written English (95%@work) and experience collaborate with overseas clientsStrong work ethic with a high degree of flexibility to collaborate cross function teamComfort working in a quickly changing environment within product development phases and buildsExcellent problem-solving and analytical skills and strong communication and interpersonal skillsExperience with review customer specification and clarify customer requirement, conduct thermal test and release test report. Preferred (or what we offer for training):Proven ability in data modeling and coding, proficient in C/Python/Perl/ Shell or other program languages are desirableunderstanding knowledge of Linux/Unix operation system, proficient in common Linux commandExperience in debug testing script and equipmentproficient in Windows office softwareCompetitive salary and opportunities for career advancement and professional developmentA dynamic and fast-paced work environment Description As a member of thermal design team at Foxconn, you will help to build the next generation of the world's most innovative mobile devices. We're seeking for someone who is passionate about engineering and thrives on innovation to optimize the thermal design. You will be responsible for design closed thermal control system(CLTM) for thermal performance, driving failure analysis, organizing DOEs as we study new designs, studying analytical models and testing data, developing automatic test or data process scripts to make our work more convenient. Not only the engineer sitting at the back of a screen and click buttons, but a dynamic communicational bridge between vendor and client designer and product. Self-driven with the desire and ability to become an integral part of Foxconn PD, also taken gained thermal design & program experience with you in future career.Education & ExperienceBS/MS in thermal design or EE/ECE/AE/CS related fieldsProficient in speak/written EnglishWork experience with C/python/Shell/Perl

Role & responsibilities 1. Material planning / Inventory mangement/Team management 2. EOL Management 3. Supportability of system/ MRP execution 4. Ensure ontime escalation and resolve hurdles for smooth operation 5. Responsible for planning the materials as per demand well in time to ensure availability of 100% materials on time to production 6. Zero delays in execution due to non-availability of materials and maintain the Optimum level of Stock 7. Defince SOP and ensure the process is carried as per procedure 8. Planning EoL & ECN parts in such a way to keep Zero liability Key Skills 1. MRP (Material Requirement Planning) 2. CTB 3. Data analysis 4. Material Planning 5. New product introduction 6. Customer handling 7. Good in communication and Microsoft 8. SAP