Fabrication Manager - PVD Process

Role Overview: You will be leading and managing the PVD process engineering team at Tata Electronics to ensure stable, high-yield, and cost-effective manufacturing of metal and barrier film deposition processes. Your role will involve providing technical mentorship and leadership development to engineers within the team, driving continuous improvement initiatives, and overseeing the development, optimization, and qualification of PVD processes for key interconnect metals and barrier layers. Key Responsibilities: - Lead and manage the PVD process engineering team to ensure stable, high-yield, and cost-effective manufacturing of metal and barrier film deposition processes - Provide technical mentorship and leadership development to engineers within the team - Drive continuous improvement initiatives targeting film quality, process stability, tool uptime, and overall module efficiency - Oversee the development, optimization, and qualification of PVD processes for key interconnect metals and barrier layers - Support technology transfer and ramp-up activities for new fabs - Collaborate closely with integration, yield, equipment engineering, and upstream/downstream module teams - Lead the evaluation and introduction of new PVD tools and hardware platforms - Ensure all PVD operations comply with corporate safety, quality, and environmental standards - Deep understanding of fab processing, particularly in BEOL/FEOL metallization and advanced logic node integration Qualifications: - Bachelors or Masters degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field - Minimum 5+ years of hands-on experience in a semiconductor wafer fab, with a strong focus on PVD processes and equipment - Solid understanding of metal film deposition and barrier/liner processes used in logic technology nodes - Experience with PVD equipment from major vendors including recipe development, troubleshooting, and hardware optimization - Proven ability to lead process qualifications, improvements, and technology transfers across fabs - Strong analytical, problem-solving, and project management skills - Excellent communication and leadership abilities - Familiarity with semiconductor integration flows, particularly in FEOL/BEOL metallization - Capable of handling multiple priorities under time constraints while ensuring high standards of quality and compliance,