Fabrication Manager - PVD Process

You will be responsible for leading and managing the PVD process engineering team at Tata Electronics to ensure stable, high-yield, and cost-effective manufacturing of metal and barrier film deposition processes. As a leader, you will provide technical mentorship and leadership development to engineers within the team. Your role will involve driving continuous improvement initiatives focusing on film quality, process stability, tool uptime, and overall module efficiency to support production and yield targets. Additionally, you will oversee the development, optimization, and qualification of PVD processes for key interconnect metals and barrier layers, aligning them with the technology roadmap and integration requirements. Your responsibilities will also include supporting technology transfer and ramp-up activities for new fabs, such as process installation, tool qualification, and ensuring production readiness during fab startup in India. Collaboration with integration, yield, equipment engineering, and upstream/downstream module teams will be crucial to implement new materials, tool configurations, and process capabilities. Leading the evaluation and introduction of new PVD tools and hardware platforms, working closely with major equipment vendors to ensure performance meets production and process specifications, will be a part of your role. It is essential to ensure that all PVD operations comply with corporate safety, quality, and environmental standards. Moreover, a deep understanding of fab processing, particularly in BEOL/FEOL metallization and advanced logic node integration, is required for this position. Qualifications: - Bachelors or Masters degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field. - Minimum 5+ years of hands-on experience in a semiconductor wafer fab, with a strong focus on PVD (Physical Vapor Deposition) processes and equipment. - Solid understanding of metal film deposition (e.g., Ti, TiN, W, Cu) and barrier/liner processes used in logic technology nodes. - Experience with PVD equipment from major vendors (e.g., AMAT, ULVAC, LAM) including recipe development, troubleshooting, and hardware optimization. - Proven ability to lead process qualifications, improvements, and technology transfers across fabs. - Strong analytical, problem-solving, and project management skills with the ability to drive cross-functional collaboration. - Excellent communication and leadership abilities to mentor engineers and align with manufacturing, integration, and equipment teams. - Familiarity with semiconductor integration flows, particularly in FEOL/BEOL metallization, is required. - Capable of handling multiple priorities under time constraints while ensuring high standards of quality and compliance.,