Engineer BGA Package Design

Rarr Technologies

3 - 6 years

4 - 8 Lacs

Bengaluru

Posted:2 months ago| Platform:

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Skills Required

Electrical engineering Project development Semiconductor Mechatronics Simulation Packaging thermal packaging design SIP Assembly design

Work Mode

Work from Office

Job Type

Full Time

Job Description

Main tasks:

Carry out multi-layer BGA substrate designs (wire-bond, Flip-chip or System-in-Package)
meeting signal/power/thermal requirements and assembly design rules on package level within Infineon s product development projects
Recommend packaging solutions and
conduct feasibility studies
to advise optimum pad layout, interconnect types and substrate parameters for a specific IC device or application
Co-work with simulation engineers
to verify the electrical/thermal package performance

Candidate profile:

A degree in electrical engineering, mechatronics, physics or a comparable education
Min. 3-5 years of experience in semiconductor package design
Know how in design of different package technologies
(lead frame, BGA, FCIP ) preferably with focus on microcontroller applications
Solid working experience
with the package design tool
Cadence SIP
Experience in assembly engineering or production would be beneficial
Self-organized
and independent
working style
Very good English language skills

Bga, Cadence, Multilayer Design

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