Staff Thermal/Mechanical Engineer (Platforms)

10 - 15 years

16 - 20 Lacs

Posted:2 weeks ago| Platform: Naukri logo

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Job Type

Full Time

Job Description

We seek a creative and innovative Thermal/Mechanical Engineer with experience of designing custom hardware test solutions for high-performance embedded systems, and high-speed peripheral interfaces to join Arm s Hardware Platform team. The team works at the forefront of embedded design focusing on prototyping Arms latest IP products. We develop physical hardware platforms, based around Arms system-on-chip (SoC) and FPGAs used for software development and validation activities for external partners/customers and Arms internal development teams.

Responsibilities:

The System Thermal and Mechanical Engineer will be responsible for the end-to-end development and delivery of thermal and/or mechanical solutions for the ARM SoC and associated platforms. The successful candidate will have a thermal and mechanical development background with silicon level or system level experience. They will integrate into a global development team in delivering commercially viable products (silicon to systems) to the marketplace in a timely and cost-effective manner.
  • Identifying innovative technologies that maximize the mechanical and thermal performance of Arm systems
  • Design thermal solutions to enable ARMs SoCs
  • Collaborate with silicon design engineering, board engineering, power engineering and other cross-functional teams to buil thermal-mechanical solutions from chip level to system level
  • Contribute to the overall product cycle from conceptualization through mass production
  • Work in a multifaceted and fast-paced product development environment
  • Thermal validation of thermal-mechanical hardware at chip, card and system level
  • Identify and investigate novel thermal technologies and work with vendors and internal teams to evaluate the technologies for alignment
  • Drive process efficiency while delivering fast time-to-market on products.
  • Driving design strategies for performance and manufacturability in packaging and boards
  • Working closely with external partners for driving successful assembly prototypes and mechanical test vehicles

Required Skills and Experience:

  • Bachelors or Masters in Mechanical Engineering
  • Expert in finite element analysis using Ansys Mechanical
  • Expertise in systems such as servers
  • A strong understanding of package failure mechanisms and causes
  • Minimum 10 years of experience in package and/or systems engineering
  • Excellent interpersonal skills, strong initiative and open in engaging and learning new concepts and sharing with collaborators
  • Understanding of electronics cooling technologies; Air cooling and liquid cooling.
  • CAD - Experience with SolidWorks and/or Creo is required. Ability to implement liquid cooling systems in Creo or SolidWorks

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ARM Embedded Technologies logo
ARM Embedded Technologies

Technology / Embedded Systems

San Jose

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