Silicon Packaging Architect

10 - 15 years

22 - 27 Lacs

Posted:2 weeks ago| Platform: Naukri logo

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Job Type

Full Time

Job Description

  • Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements.
  • Leads technology tradeoff decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones.
  • Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks.
  • Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets.
  • Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions.
  • Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.
Qualifications:
  • Bachelor Degree in relevant engineering/science domain with minimum 10 years of experience in the package design and/or architecture.
  • Prior leadership role in package technology readiness development, design tape-out and/or innovation.

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Intel

Semiconductors

Santa Clara

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