Responsibilities
In this role, you will be responsible for Timing methodology definition and closure of designs using industry standard tools for chiplet designs for custom and domain specific products. The chiplets will be leveraged to enable modular design and support multiple products. As part of this team, the candidate will work with leading edge technologies and solutions across multiple domains including SoC multi-die implementations (2.5 and 3D), power delivery, leading edge memory technologies, innovate thermal solutions, on die clocking, and fabrics. The team will also look at options to enhance product power/performance/area/cost thru improved tools and methodologies. The successful candidate would be expected to:
- Drive PV convergence/signoff, including static timing, ERC checks, ECO flows and power analysis
- Defining clock frequencies, PV guard-banding, signoff PV corners, ERC checks, Clock/Reset domain crossing design constraints
- Develop and recommend design methodologies to enable more efficient and faster design convergence
- Scripting in an interpreted language (TCL, py)
- Ability to work independently and at various levels of abstraction
- Strong analytical ability and problem solving skills
- Ability to work effectively with both internal and external teams/customers is expected.
- Strong written and verbal communication skills
- Ability to mentor other engineers and technically guide them.
Job posting details (such as work model, location or time type) are subject to change.
Minimum Qualifications
- Bachelor/Master degree in CS, CE or EE or equivalent experience
- 10+ years of Physical design experience with a strong understanding of digital circuits and proficiency in static timing analysis (STA) tools like PrimeTime or Innovus.
- Experience with signoff corner selection, PV guard-banding, PV convergence, including static timing and power analysis
- Strong experience in SoC and ASIC design flows on taped out designs
- Expertise in timing closure at block/chip level and ECO flows
- Experience with scripting in an interpreted language
Preferred Qualifications
- Experience with full chip integration, die-to-die and package integration level timing signoff
- Hands-on experience with synthesis, block and chip level implementation with industry standard PnR flows and tools
- Strong experience in CPU and GPU design flows on taped out designs
- Design tools and methods development
- Capable of working in a high performing team to deliver the results required from the organization.
The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel's transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologiesspanning software, processors, storage, I/O, and networking solutionsthat fuel cloud, communications, enterprise, and government data centers around the world.All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel's offices for various positions and further requiring them to deposit money to be eligible for the interviews. We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at https://jobs.intel.com/ and not fall prey to unscrupulous elements.This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
* Job posting details (such as work model, location or time type) are subject to change.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
