IC Packaging Engineer/Manager

As the Wire Bonding/Flip Chip Packaging Engineering, you will be responsible for developing technology and processes related to FOL (Front of Line) and EOL (End of Line) stages. This includes tasks such as back grinding, laser groove, mechanical sawing, SMT & Flip Chip Attach, mass reflow/TCB/fluxless, flux cleaning, plasma clean, underfill, mold underfill, ball attach, saw singulation, O/S, FVI, pick and place, and packing. Your role will involve understanding, integrating, and innovating solutions to meet customer packaging requirements in a cost-effective manner. You will be required to initiate technical discussions with vendors to gather relevant data and complete initial analyses for decision-making. Additionally, you will participate in the selection of methodologies, materials, manpower, and machines based on performance and past experiences. Installing, verifying, and qualifying processes and products for development, New Product Introduction (NPI), and Low Volume Manufacturing (LVM) will also be part of your responsibilities. Your continuous focus should be on achieving the highest degree of packaging difficulty while ensuring ease of Design for Manufacturability (DFM) to meet customer expectations for quality, yield, and output. You will need to offer a diverse range of Bill of Materials (BOM) selections to accommodate various customer requirements and execute multiple department projects effectively. To excel in this role, you should hold a relevant engineering or science degree and have experience in leading teams to achieve organizational goals. Proficiency in MS Office, 8D writing, Design of Experiments (DOE), Statistical Process Control (SPC), Failure Modes and Effects Analysis (FMEA), Out of Control Action Plan (OCAP), and Control Plan is essential. A strong passion for innovation and continuous learning to achieve the seemingly impossible will be crucial for success in this position.,