IC Packaging Engineer/Manager

Role Overview: You will be responsible for the technology and process development for Wire Bonding/Flip Chip packaging engineering. This includes FOL processes such as Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill, and EOL processes like Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing. Your role will involve understanding, integrating, and innovating to meet customers" packaging requirements into a cost-competitive DFM solution. You will initiate and engage in technical discussions with vendors to gather relevant data, review and complete initial analysis for final decision submission. Additionally, you will be involved in the selection of 4Ms based on the latest performance and previous experience/learnings. Installing, buying-off, and qualifying processes and products for development, NPI, and LVM will also be part of your responsibilities. Continuous striving for meeting the highest degree of packaging difficulty, ease of DFM, best customer desired outputs, best-in-class Yield, and best Quality in the industry will be expected. You will also offer a wide range of BOM selections to cater to different customer requirements and execute multiple department projects. Identifying all process controls requirements and using the BKM for inputs & outputs data gathering/controls, as well as assisting in the MES, Automation of material, process, and recipe controls, will be crucial to your role. Key Responsibilities: - Responsible for technology and process development for Wire Bonding/Flip Chip packaging engineering - Initiate and engage in technical discussions with vendors - Select 4Ms based on performance and previous experience - Install, buy-off, and qualify processes and products for development, NPI, and LVM - Strive for meeting the highest degree of packaging difficulty, ease of DFM, best customer desired outputs, best-in-class Yield, and best Quality - Offer a wide range of BOM selections - Execute multiple department projects - Identify process controls requirements and use BKM for data gathering/controls - Assist in MES, Automation of material, process, and recipe controls Qualification Required: - Minimum relevant engineering or Science degree - Experience in leading a group or team of employees in achieving organizational goals - Exposure in MS Office, 8D writing, DOE, SPC, FMEA, OCAP, and Control Plan - Passionate about achieving the impossible through innovation and continuous learning,