2.0 - 6.0 years

0 Lacs

maharashtra

On-site

You should have a good understanding of electronics device fundamentals including MOSFETS, diodes, passive components, voltage regulators, etc. Knowledge of Communication Protocols such as UART, SPI, I2C, CAN is required along with familiarity with Microcontrollers and Microprocessors. Experience in the simulation of circuits using tools like PSpice, LTSpice is essential. You should be able to select BoM based on requirements, power/space/financial budget, and create PCB schematics using tools such as Altium/Eagle. Experience in PCB h/w testing for debugging h/w issues is necessary. You will be responsible for handling new and existing projects independently as well as collaborating effectiv...

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IC Packaging Engineer/Manager Tata Electronics

5.0 - 9.0 years

0 Lacs

karnataka

On-site

As the Wire Bonding/Flip Chip Packaging Engineering, you will be responsible for developing technology and processes related to FOL (Front of Line) and EOL (End of Line) stages. This includes tasks such as back grinding, laser groove, mechanical sawing, SMT & Flip Chip Attach, mass reflow/TCB/fluxless, flux cleaning, plasma clean, underfill, mold underfill, ball attach, saw singulation, O/S, FVI, pick and place, and packing. Your role will involve understanding, integrating, and innovating solutions to meet customer packaging requirements in a cost-effective manner. You will be required to initiate technical discussions with vendors to gather relevant data and complete initial analyses for d...

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