Flip Chip Packaging Sr Eng/ Sect Manager Tata Electronics

4.0 - 8.0 years

0 Lacs

karnataka

On-site

You will be responsible for the technology and process development of Flip Chip product packaging, including tasks such as Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill, Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing. Your role will involve understanding, integrating, and innovating to meet customers" packaging requirements with a cost-competitive DFM solution. You will initiate and participate in technical discussions with vendors to gather relevant data, conduct initial analysis, and submit final decision submissions. Your involvement will also include selecting 4Ms based on performance and previous experience, installing, buying-off, and qualifying processes and products for development, NPI, and LVM. Your primary focus will be on meeting the highest degree of packaging difficulty, ensuring ease of DFM, achieving the best customer desired outputs, best-in-class Yield, and maintaining industry-best Quality. You will offer a wide range of BOM selections to meet different customer requirements and execute multiple department projects. You will be responsible for identifying all process controls requirements, using BKM for inputs & outputs data gathering/controls, and assisting in the MES, Automation of material, process, and recipe controls. The position requires a minimum relevant engineering or Science degree, with a minimum of 4 years of total experience for Sr Engineer or 8 years for Section Manager. Experience in leading a group or team of employees to achieve organizational goals is essential, along with exposure to MS Office, 8D writing, DOE, SPC, FMEA, OCAP, and Control Plan. A passion for achieving the seemingly impossible through innovation and continuous learning is highly valued.,

Posted 4 days ago

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