IC Packaging Engineer/Manager Tata Electronics

5.0 - 9.0 years

0 Lacs

karnataka

On-site

Role Overview: You will be responsible for the technology and process development for Wire Bonding/Flip Chip packaging engineering. This includes FOL processes such as Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill, and EOL processes like Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing. Your role will involve understanding, integrating, and innovating to meet customers" packaging requirements into a cost-competitive DFM solution. You will initiate and engage in technical discussions with vendors to gather relevant data, review and complete initial analysis for final deci...

Posted 1 month ago

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IC Packaging Engineer/Manager Tata Electronics

5.0 - 9.0 years

0 Lacs

karnataka

On-site

As the Wire Bonding/Flip Chip Packaging Engineering, you will be responsible for developing technology and processes related to FOL (Front of Line) and EOL (End of Line) stages. This includes tasks such as back grinding, laser groove, mechanical sawing, SMT & Flip Chip Attach, mass reflow/TCB/fluxless, flux cleaning, plasma clean, underfill, mold underfill, ball attach, saw singulation, O/S, FVI, pick and place, and packing. Your role will involve understanding, integrating, and innovating solutions to meet customer packaging requirements in a cost-effective manner. You will be required to initiate technical discussions with vendors to gather relevant data and complete initial analyses for d...

Posted 4 months ago

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Flip Chip Packaging Sr Eng/ Sect Manager Tata Electronics

4.0 - 8.0 years

0 Lacs

karnataka

On-site

You will be responsible for the technology and process development of Flip Chip product packaging, including tasks such as Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill, Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing. Your role will involve understanding, integrating, and innovating to meet customers" packaging requirements with a cost-competitive DFM solution. You will initiate and participate in technical discussions with vendors to gather relevant data, conduct initial analysis, and submit final decision submissions. Your involvement will also include selecting 4Ms ...

Posted 5 months ago

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