6 Ansys Hfss Jobs

Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. What your background should look like: Job Overview As a Hardware Engineer for TE Connectivity you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Responsibilities: Subject matter expert in high speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelors degree in Electrical Engineering, Masters degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Experience with signal conditioning techniques (equalization, amplification, FIRs, CTLEs) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS.

Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Required Skills Bachelors degree in Electrical Engineering or equivalent work experience; Master's Degree preferred Minimum of 10 years of relevant work experience in electrical Design, RF design or PCB design, 12-15+ preferred Minimum of 5 years of progressive leadership and people management experience in a multi-national or regional environment A solid understanding of electromagnetic theory and electrical circuit behavior Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) Expert with printed circuit board layout and design (Altium and/or Cadence preferred), fabrication and assembly, especially as associated with connector and card-edge interfaces Strongly proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration Proficient with high-speed test equipment (VNA, TDR, BERT) Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification. Familiar with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent) Familiar with high-volume manufacturing processes Familiar with signal conditioning techniques (equalization, amplification) Practiced analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Exposure to physical layer communications systems and architectures Fluent in English (both verbal and written) Ability to work in a global environment able to accommodate varying time zones and capable of collaborating with individuals across geographies. Expert problem solver able to solve high complexity situations with little to no direction. Proactive in identifying complex issues, providing solutions, and driving improvements to evolve procedures Proficient in presenting technical solutions to customers and upper management Demonstrated experience leading/developing a team of 5+ experienced professionals who exercise latitude and independence in their assignments with accountability for team performance, project delivery, and resource allocation. Proficient in building and leading a solid team - assessing talent fit (current team and future hires), aligning skills to business needs, identifying skillset gaps needed to strengthen the team, and taking actions necessary to maintain solid team performance. Proficient at leading cross-functional new product development projects which require strong collaboration and influencing skills to achieve the right outcome for the business. Proficient in driving a data analytics mindset across the team identifying the most meaningful data to collect, analyzing it, drawing conclusions, and presenting those conclusions as data intelligence to provide insight and drive innovative solutions for the business. Proficient at driving continuous improvement with demonstrated experience implementing best practices to enhance engineering efficiency Responsiblities Manage and lead a team of regional signal integrity engineers in establishing signal integrity design performance and functional requirements for new products Lead the team to perform signal integrity simulations for multiple high-speed standards 56G/112G/224G/ and faster, on each product. This includes determining the correct simulation methodology and setup to use, as well as working with global engineering teams to both gather inputs and provide results. Guide the team in product design and analysis from a signal integrity standpoint with a focus on making data driven decisions about the product functionality and areas for improvement. Create actionable recommendations based upon design reviews and simulation results. Align the technology roadmap with the market trends, customer needs, and implement accordingly. Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions. Effectively build and lead a regional team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures. Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability. And track performance through metrics to demonstrate productivity and growth. Manage employee wellbeing by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives.

Role & responsibilities As an RF Engineer (PhD), you will help develop, test, and validate our next-generation air pollution and carbon capture products using novel RF systems. This is a unique opportunity to publish research, obtain patents, and work alongside our seasoned engineering team. You will get hands-on experience with the latest tools and high-value projects that enhance your expertise. Our best performers progress into leadership roles rapidly. Design, simulate, prototype mm Wave systems, phased arrays, and other RF components Perform complex EM/circuit simulations using tools like Ansys HFSS, Keysight ADS, Cadence Fabricate and test GaN /Si RFICs, antennas, filters using network/signal analyzers, wafer probers Research, innovate, and publish papers on new RF architectures that enhance our products Select ideal RF components and materials to optimize system performance and efficiency Ensure RF systems meet all regulatory and design specifications Travel occasionally to vendors/partners for design reviews, evaluations, and knowledge sharing. Mentor and guide junior engineers on RF fundamentals, modeling, layout, measurements, and documentation. Ideal Candidate: - Ph. D in ECE or related fields from IIT or IISC 3+ years relevant work experience after PhD in industry Should have experience with hardware for the Wi-Fi spectrum Should have good experience in developing, testing and validating next-generation air pollution and carbon capture products using novel RF systems. Should have experience in Designing, simulation of prototype mm Wave systems, phased arrays, and other RF components Should have experience in EM/circuit simulations using tools like Ansys HFSS, Keysight ADS, Cadence Should have adequate experience in Fabrication and testing of GaN /Si RFICs, antennas, filters using network/signal analyzers, wafer probers Should have research and innovate experience and publish papers on new RF architectures Experience in selection of ideal RF components and materials to optimize system performance Prior experience in companies like Intel, TP Link, etc. Preferred candidate profile Perks and benefits

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsbilties: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Should have total work experience of 3-8+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork

DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Bachelors degree in Electrical Engineering. Should have total work experience of 3-5+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design(high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork

Job Overview As a manager in the Signal Integrity team you will lead the SI engineers focusing on aspects of electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industrytargeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to drive development teams in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will assign resources to work on the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will be expected to coordinate to drive the advancement of simulation tools and capabilities, identifying potential areas of process improvement, and solving complex problems and ensuring product development success. Responsibilities: Align the technology roadmap with front end / customer, and implement accordingly Familiar with signal integrity design, simulation and validation activities through product development cycles Coordinate to define signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers Guide the team to preform signal integrity simulations for multiple high-speed standards on each product, including determining the correct simulation methodology, as well as a good understanding of the criteria for each interface. Driving product development for business success Engaging in innovative simulation and test tool improvement and process enhancement Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint. Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positions Mandate Skills: Bachelors degree in electrical engineering or equivalent work experience; Masters degrees highly recommended Minium of 10 years of relevant work experience in electrical design, RF design, or PCB design, with 3+ years managerial experience in leading an electrical or SI engineering team Familiar with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Good analytical capabilities to interpret simulation and lab data to identify issues and provide guidance to team to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Strong background to work in a global environment able to accommodate varying time zones and capable of collaborating with individuals across geographies. Ability to, and experience with, teaching and training peers in applying software tools and methodologies, and in the use of electrical test equipment, including VNAs and TDRs Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/ connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/ projects simultaneously with limited direction. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques.