Thermal Analysis Lead

Role & responsibilities

• Lead and execute thermal analysis

  for electronic systems at component, PCB, and enclosure levels.
• Develop and validate

  thermal models using simulation tools

  (e.g.,

  ANSYS Icepak, FloTHERM, Simcenter, or equivalent

  ).
• Conduct

  steady-state and transient thermal analyses

  to ensure compliance with design and reliability requirements.
• Collaborate closely with

  electrical, mechanical, and system engineers

  to define thermal requirements early in the design process.
• Optimize

  thermal management strategies

  , including heatsinks, fans, thermal interface materials (TIMs), and airflow designs.
• Perform

  root cause analysis

  for thermal issues observed during prototype or validation testing.
• Define and review

  thermal test setups

  ; interpret and correlate test data with simulation results.
• Provide

  technical leadership

  and mentoring to junior thermal engineers and analysts.
• Support

  DFMEA and reliability assessments

  from a thermal perspective.
• Work with suppliers and vendors to define

  thermal performance specifications

  for components and assemblies.
• Document and present analysis reports, design recommendations, and validation summaries.

Preferred candidate profile

• Bachelors/Masters degree

  in Mechanical Engineering, Thermal Engineering, Aerospace, or related field.

• 6-8+ years of experience

  in thermal design and analysis of electronic products (PCB-level, power electronics, system-level enclosures).
• Strong hands-on experience with

  thermal simulation tools

  such as ANSYS Icepak, FloTHERM, or Simcenter Flotherm XT.
• Solid understanding of

  heat transfer principles

  (conduction, convection, radiation) and

  thermal–fluid interactions

  .
• Experience in

  correlating simulation and experimental data

  for model validation.
• Familiarity with

  CAD tools

  (e.g., Creo, SolidWorks, CATIA, or NX) for geometry preparation and data exchange.
• Knowledge of

  electronic component packaging

  , PCB stack-ups, and cooling methods (passive/active).
• Proven track record of leading thermal design activities in

  complex, multi-disciplinary projects

  .
• Excellent communication, documentation, and presentation skills.

• Experience in

  automotive, aerospace, defense, or consumer electronics

  thermal design.
• Knowledge of

  CFD and multiphysics coupling

  (electro-thermal or thermo-mechanical analysis).
• Familiarity with

  industry standards

  (e.g., JEDEC, MIL-STD, IEC) for thermal testing and qualification.