As a IC packaging engineer, you will work in the Packaging R&D group on package deign, modeling and simulation across semiconductor packaging, flash memory product, and host levels. (
mainly on BGA / system in packages
)
In this position, you will be responsible for influencing package and product design and advancing the technology of semiconductor packaging generally.
Scope is to address all design aspects of packaging technology and associated material and process interactions.
Knowledge of semiconductor assembly process is required ( back grinding , dicing , Die attach , wire bonding, molding , laser marking , laser cutting , singulation , solder ball attach , reflow , SMT, testing )
Higher Die stacking and its wire bonding / molding concept to be known
Focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects and higher power.
Candidate will be responsible for the modeling and simulation of mechanical responses of the IC package and flash products using analytical and computational tools.
Working knowledge on AI/ML , data science must
This position will interface with package & product design, electrical and physical characterization, lab testing, failure analysis, assembly R&D and other process teams.
Interacting with internal engineering departments, vendors and customers to develop high performance leadership package
Ability to daily multi-tasking in different projects, manage and meet tight deadlines of packaging deliverables as a part of multidisciplinary team as well as excellent communication and interpersonal skills required.
Knowledge of Package signal integrity and power integrity principles would be good. Knowledge of EMI, HFSS, HSPICE is a plus. Hands-on with oscilloscopes, network analyzers and spectrum analyzers also a plus
Skills in
AutoCAD
, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques are good.

Qualifications

B.Tech or M.Tech in mechanical / microelectronics / mechatronics / Thermal/ electronics engineering
Solid knowledge through academic coursework subjects
Background in applied mechanics wi

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