Job
Description
Key Responsibilities Schematic Capture & PCB Layout Design and optimize complex multi-layer PCBs for high-speed digital and RF applications using tools such as Altium Designer, Cadence Allegro, or OrCAD. Implement controlled-impedance routing, differential-pair tuning, power-integrity planes, and RF transmission lines. High-Speed Signal Integrity Perform SI analysis (eye-diagram, timing, crosstalk) and apply best practices for DDR, PCIe, USB3, Ethernet, HDMI, etc. Collaborate with SI/PI engineers to define stack-ups, copper pours, via types, and decoupling strategies. RF/Microwave Design – Layout antennas, filters, matching networks, baluns, and mixers for frequencies from VHF through UHF (e.g. 13.56 MHz NFC to several GHz Wi-Fi/Bluetooth/GPS). – Ensure low-loss RF paths, minimal parasitics, and effective grounding/EMI shielding. Prototype Validation & Debug – Coordinate board spins, oversee fabrication files (Gerbers, ODB++), and work with board houses on stack-up definitions. – Lead bench-level bring-up, signal probing, VNA/oscilloscope measurements, and cross-section analysis to troubleshoot issues. Documentation & Process Improvement – Produce clear build packages, assembly drawings, and manufacturing notes. – Maintain design libraries, enforce DFM rules, and drive continuous improvement for faster turnaround and higher yield. Cross-Functional Collaboration – Partner with analog/digital/RF hardware engineers, mechanical designers, firmware teams, and test engineers to ensure seamless product development. – Mentor junior designers and share best practices in layout, routing, and design for manufacturability. Required Skills & Qualifications Bachelor’s or Master’s degree in Electrical/Electronics Engineering or related field. 4+ years of hands-on PCB design experience in high-speed digital and RF domains. Proficiency in industry-standard ECAD tools (Altium, Cadence Allegro, OrCAD). Deep understanding of controlled-impedance calculations, SI/PI fundamentals, and RF layout techniques. Experience defining and validating PCB stack-ups, dielectric materials, and copper weights. Skilled in RF test equipment: network/analyzer, spectrum analyzer, VNA, and high-speed oscilloscopes. Strong documentation skills and familiarity with IPC standards (IPC-2221, IPC-7351). Preferred Qualifications Experience in wireless communications (BLE, LTE, GPS, NFC) or aerospace/defense electronics. Familiarity with thermal management, EMI/EMC mitigation, and HDI/microvia technologies. Working knowledge of DFM/DFT principles and vendor-specific fabrication processes. Previous involvement in certification processes (CE, FCC, MIL-STD).
