49 Power Integrity Jobs

As a Hardware Lead at Phoenix Medical Systems Private Limited, you will be responsible for the design and development of Medical grade PCBs, focusing on creating innovative products to address complications in newborns. Your expertise in microcontroller based hardware design, sensors, drivers, Power electronics, Battery management, and EMI/EMC compliance for medical devices will play a crucial role in this position. You will be involved in developing schematics and layouts according to design requirements and manufacturing feasibility, along with managing the Bill of Materials (BOM) using standard ECR/ECN processes. Your responsibilities will also include working on Embedded Hardware (Electronics) for Digital, Analog, and Mixed Signal Processing, as well as handling component suppliers and PCB Fabricators. To excel in this role, you must possess strong hardware development and electronics hardware design skills, with experience in high-speed digital design, signal and power integrity, and EMI/EMC. Knowledge of processor and RTOS architecture, as well as familiarity with PCB design tools and simulation software, will be essential. A Bachelor's or Master's degree in Electrical/Electronics Engineering or a related field is required, along with excellent communication skills and the ability to collaborate effectively in a team environment. Prior experience with medical standards such as IEC60601 and EMI/EMC compliance will be advantageous in fulfilling the responsibilities of this position. If you are passionate about leveraging your hardware design expertise to contribute to the development of cutting-edge neonatal and maternal-care equipment, we encourage you to apply and be a part of our mission to provide affordable and innovative solutions for newborn care.,

As an Electronics Design Engineer at Antigone Solutions Pvt Ltd, you will play a crucial role in our product development team. Your primary responsibility will be the comprehensive design and development of electronic hardware, starting from the initial concept phase to the final production stage. This includes tasks such as schematic design, coordination of PCB layout, component selection, prototyping, testing, and documentation. Working in close collaboration with various cross-functional teams including embedded software, mechanical, and test engineering, you will be at the forefront of creating innovative solutions that push the boundaries of technology. Your key responsibilities will involve designing analog, digital, and mixed-signal circuits tailored to project requirements. You will develop schematics, oversee PCB layout to ensure signal integrity and other key considerations like power integrity, thermal management, and EMI/EMC constraints. The selection of appropriate components based on functionality, availability, cost, and lifecycle will also be a key part of your role. Building and testing prototypes, validating designs through simulation, bench testing, and integrations will be a significant aspect of your day-to-day tasks. Collaboration with embedded, mechanical, and test engineers is essential to ensure seamless system-level integration and final product approval. Additionally, generating detailed design documentation including BOMs, schematics, Compliance of PCBs, and test procedures will be part of your routine. Participation in design reviews, debugging, improvements in design validations, and ensuring compliance with relevant standards such as MIL-STD, EMC/EMI, and safety regulations will be critical. Effective coordination with the procurement team for the fabrication and assembly of PCBs and mechanical parts is also a key responsibility. To be successful in this role, you should possess a Bachelor's or Master's degree in Electronics, Electrical, or a related Engineering discipline. Previous hands-on experience of [1-5] years in electronics hardware design is required. Proficiency in schematic capture tools like Altium, OrCAD, KiCAD, etc., is essential. A strong understanding of analog/digital circuit design, power supplies, microcontrollers, and communication protocols is crucial. Experience in using lab instruments such as oscilloscopes, multimeters, logic analyzers, RF Test equipment, and embedded tools will be beneficial. Your ability to debug hardware issues and provide support for cross-functional troubleshooting will be indispensable. Strong documentation and communication skills are also highly valued in this role.,

Qualcomm India Private Limited is a leading technology innovator that pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, your responsibilities will include planning, designing, optimizing, verifying, and testing electronic systems. You will work on circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems to launch cutting-edge, world-class products. Collaboration with cross-functional teams is essential to develop solutions and meet performance requirements. In order to be considered for this role, you must have a Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or a related field with at least 3 years of Hardware Engineering or related work experience. Alternatively, a Master's degree with 2+ years of experience or a PhD with 1+ year of experience will also be considered. As a Physical Design Electrical Analysis Engineer, you will be responsible for driving the electrical analysis and closure at both the block and top level. The ideal candidate should have 4 to 7 years of experience in EM/IR/PDN. Key responsibilities include performing various electrical analyses at block and top levels, including static/dynamic IR, power/signal EM, and ESD. You will also drive block and top-level electrical verification closure, develop power grid specs based on power/performance/area targets of different SOC blocks, and work closely with the PI team to optimize the overall PDN performance. Additionally, you will collaborate with CAD and tool vendors to develop and validate new flows and methodologies. Preferred qualifications for this role include a BS/MS/PhD degree in Electrical Engineering with 4+ years of practical experience, in-depth knowledge of EMIR tools such as Redhawk and Voltus, experience in developing and implementing power grids, good knowledge of system-level PDN and power integrity, practical experience with PnR implementation, verification, power analysis, and STA, proficiency in scripting languages (TCL/Perl/Python), experience with industry-standard EMIR tools, basic knowledge of the physical design flow and industry-standard PnR tools, and the ability to communicate effectively with cross-functional teams. Qualcomm is an equal opportunity employer committed to providing accessible processes for individuals with disabilities. If you require accommodations during the application/hiring process, you can contact Qualcomm via email at disability-accommodations@qualcomm.com or through their toll-free number. Qualcomm expects its employees to adhere to all applicable policies and procedures, including security and confidentiality requirements. Please note that unsolicited submissions from staffing and recruiting agencies are not accepted. Individuals seeking a job at Qualcomm should use the Careers Site for applications. For more information about this role, you can contact Qualcomm Careers directly.,

The role at Synopsys is at the core of groundbreaking innovations that shape the future of technology in various industries. From self-driving cars to Artificial Intelligence, the cloud, 5G, and the Internet of Things, these advancements mark the Era of Smart Everything. Synopsys drives this revolution with cutting-edge technologies in chip design and software security, fostering a culture of innovation that welcomes individuals who share the same passion. In the Silicon IP business, the focus lies on enhancing System-on-Chip (SoC) capabilities swiftly. Synopsys boasts the most comprehensive portfolio of silicon IP, comprising predesigned logic blocks, memory, interfaces, analog, security, and embedded processors. This diverse range aids customers in integrating more features, meeting specific performance, power, and size criteria for their applications, and expediting product launches with reduced risks. Currently, Synopsys is seeking forward-thinking leaders for the development of next-generation DDR/HBM/UCIe PHY IPs. The responsibilities associated with this role include supervising the development of these IPs, showcasing leadership qualities, fostering new technology advancements, offering guidance to employees, leading projects, managing schedules, working collaboratively across functions, and demonstrating proficiency in design and verification. Requirements for this position include a BTech/MTech qualification, a minimum of 8 years of relevant experience, knowledge of CMOS processes and challenges in deep submicron process technologies, familiarity with CMOS circuit design and layout methodology, a deep understanding of analog/mixed-signal circuitry, awareness of basic ESD concepts, experience with analog mixed-signal simulation strategies, knowledge of Signal Integrity and/or Power Integrity, familiarity with ASIC design flow, understanding of JEDEC requirements for DDR interfaces and standards, proficiency in DDR Timing, ODT, and SDRAM functionality, ability to lead projects ensuring top product quality and efficiency, and excellent written and verbal communication skills to effectively lead development teams.,

Experience in PCB design, including high-speed, RF, and mixed-signal designs Expertise in EMC/EMI mitigation, signal integrity, and power integrity Proficiency with PCB design software Altium, Allegro, KiCad Strong in DFM, DFA and material selection

TechiesDesigns Electronics is looking for PCB Design Engineer to join our dynamic team and embark on a rewarding career journey Design and develop printed circuit board (PCB) layouts for electronic products and systems Collaborate with cross-functional teams, including electrical engineers, mechanical engineers, and product managers, to gather requirements and specifications Create schematics and circuit designs based on system requirements and electrical design principles Perform component selection, considering factors such as functionality, cost, availability, and manufacturability Generate PCB layouts using design software tools such as Altium Designer or Cadence Allegro Ensure proper placement and routing of components to meet electrical, mechanical, and thermal constraints Conduct design reviews and collaborate with engineers to optimize PCB designs for performance and manufacturability Incorporate design considerations for signal integrity, power integrity, and electromagnetic compatibility (EMC) Generate and review manufacturing files, including Gerber files, assembly drawings, and bill of materials (BOM) Collaborate with PCB fabrication and assembly vendors to ensure successful production and assembly of PCBs Perform design verification and validation activities, including design rule checks (DRC), electrical simulations, and prototyping Troubleshoot and debug PCB issues during development, testing, and production phases Stay updated with industry trends, standards, and technologies related to PCB design Contribute to process improvement initiatives to enhance design efficiency and quality Maintain accurate documentation and revision control of PCB designs and associated files Ensure compliance with regulatory requirements and industry standards in PCB design

Hi, Greetings from Thales India Pvt Ltd.....! We are hiring for Technical Lead - Mixed Signal Design Engineer for our Engineering competency center for Bangalore location . JOB Description: Thales India Engineering Competency Center in Bangalore is seeking a Tech Lead Engineer role. In this role you will be responsible for generating reliable, cost effective, customized Electronics systems design, Obsolescence redesign for Defense products to meet the customer requirements as well as governing regulatory standards (DO-160, DO-254, MIL-STD, etc.). You also perform trade analysis of design approaches, engineering simulations & modeling, derating analysis before finalizing the design. Qualifications: B.Tech in Electronics & Communication or Electrical engineering or equivalent with 8 to 12 years of relevant experience. Higher qualifications of Post-graduation and PhD are desirable. Working experience in Avionics and Defense systems design is desirable Location: Thales India Private Limited, Richmond Town, Bengaluru, Karnataka 560025. Technical Skills and Competencies: Must have strong experience in Product design and development from requirements to Conceptual design to architectural design to detailed design and analysis Must have strong experience in designing low to high power analog electronic boards (for example, power supply, signal processing etc) for Defense / avionics Industry Must have Strong knowledge in Specification, design and verification of electronic boards (including digital functions) Must have strong knowledge of using simulation tools (SPICE, ANSYS etc) for functional simulation signal integrity and power integrity analyses Must have working experience of product performance evaluation (Hardware Verification) and product qualification to comply to DO-160 and DO-254 standards Must have excellent troubleshooting skills on Electrical / Electronic boards to find the root cause and to propose the best solution Should have experience of working with multi-disciplinary team (Mechanical team for thermal analysis & enclosures design, PCB layout team and suppliers) Should have an understanding and use of DFMEA, DFT and DFM tools Definition and choice of components (including derating) Definition of electrical schematics and building blocks Boards place&route (including signal integrity) Manufacturing failures analysis / Root cause analysis Test procedures definition and execution Component obsolescence treatment : alternative solution identification, definition/design of the solution, verification Profile/Skills Analog Electronic Engineering Skills and ability. Mastering of electronic simulation and design software (Cadence, Allegro, ANSYS, PSPICE/LTSPICE) Knowledge or Defense, aeronautics constraints (MIL-STD, DO160, DO254) Design for manufacturing Design for environmental requirements including EMC General understanding of Engineering Development lifecycles including design, development, testing, verification and validation phaseshales India Engineering Competency Center in Bangalore is seeking a Technical Lead role to be part of Hardware engineering team. In this role he/she will be responsible for generating reliable, cost effective, customized Electronics systems design, Obsolescence redesign for avionics products to meet the customer requirements as well as governing regulatory standards (DO-160, DO-254, MIL-STD, etc.).

Hi, Greetings from Thales India Pvt Ltd.....! We are hiring for Senior Engineer/Technical Lead - Digital Circuit design for our Engineering competency center for Bangalore Richmond Road location. JOB Details: Thales India Engineering Competency Center in Bangalore is seeking a Technical Lead engineer role to be part of Hardware engineering team. In this role you will be responsible for design and development of reliable, cost effective, customized products for Defense & avionics applications. Electronics systems design, Obsolescence redesign for Defense / avionics products to meet the customer requirements as well as governing regulatory standards (DO-160, DO-254, MIL-STD, etc.). You also perform trade analysis of design approaches, engineering simulations & modeling, derating analysis before finalizing the design. Qualifications: B.Tech in Electronics & Communication or Electrical engineering or equivalent with 5 to 10 years of relevant experience. Higher qualifications of Post-graduation and PhD are desirable. Working experience in Defense / Avionics domain is desirable Technical Skills and Competencies: Must have strong experience in Electronic design and development from requirements to Conceptual design to architectural design to detailed design and analysis Must have strong experience in the hardware design, development and testing of high speed digital electronic circuits including microprocessors, microcontrollers, FPGA and embedded firmware. Must have hands on experience in product design, board level testing, integration and validation testing including development of test plans and Pass/fail criteria. Must have strong knowledge of using Design and simulation tools Must have working experience of product performance evaluation (Hardware Verification) to comply to DO-160 or MIL-STD standards Must have excellent troubleshooting skills on Electrical / Electronic boards to find the root cause and to propose the best solution Should have experience of working with multi-disciplinary team ( Mechanical, PCB layout, Systems engineering and suppliers) Should have an understanding and use of DFMEA, DFT and DFM tools Definition and choice of components (including derating) Definition of electrical schematics and building blocks Boards place&route (including signal integrity) Manufacturing failures analysis / Root cause analysis Test procedures definition and execution Component obsolescence treatment : alternative solution identification, definition/design of the solution, verification Profile/Skills Digital Electronic Engineering Skills and ability. VHDL coding, Timing analysis Mastering of electronic simulation and design software (Cadence, Allegro, ANSYS, PSPICE/LTSPICE) Knowledge or Defense & aeronautics constraints (MIL-STD, DO160, DO254) General understanding of Engineering Development lifecycles including design, development, testing, verification and validation phases

As a Mechatronics Engineer in the Automotive industry based in Bangalore, you will be expected to possess a Bachelor's or advanced degree in Electrical/Electronics/Mechatronics Engineering with 2 to 6 years of relevant work experience. Your responsibilities will include working on electronic and electrical systems for automotive applications. You should have a strong background in circuit design and electronics circuit analysis, with the ability to identify optimization and failures in circuits. Your expertise should extend to automotive design and automotive EMC standards, along with a basic understanding of automotive EMC compliant PCB and circuit design. It is essential to have a clear understanding of technical datasheets of electronics components and the capability to design circuits according to the datasheet. Proficiency in electronic simulation tools such as Saber RD, LT Spice, ORCAD PSpice, or similar tools is required. Experience in Electronic design tools like Altium Designer or any other tool for circuit and PCB design is highly preferred. Additionally, familiarity with working on firmware for standard microcontrollers is expected. You will be responsible for hardware board design, debugging, and testing in the embedded hardware domain. Your role will involve designing high-speed digital boards according to requirements, schematic entry, PCB layout review, power analysis, DC analysis, power integrity, thermal analysis, board bring-up, testing, debugging, and capturing design documentations. Effective communication with team members and stakeholders is crucial for successful project execution. If you meet these requirements and are eager to contribute your skills to a dynamic automotive environment, we encourage you to apply for this position. Immediate to 30 days" notice period is preferred.,

As a Lead Hardware Design Engineer at TVSM Software Research & Development Organization, you will play a crucial role in defining and designing state-of-the-art hardware products that meet cost, reliability, and global standards by following best industry practices. You will collaborate with cross-functional teams to define hardware requirements for infotainment systems, VCU, and Telematics units, ensuring the development of cutting-edge architecture for hardware components that meet cost, reliability, and regulatory requirements. Your responsibilities will include working alongside hardware design engineers to create schematics, reviewing PCB layout plans and design, as well as Gerber files for thermal, EMI/EMC, signal integrity, and power integrity. You will also collaborate with PCB design engineers and mechanical engineers to deliver hardware according to customer requirements, perform reliability and costing analysis, and create design verification plans. Your role will involve conducting DFMEA with stakeholders, reviewing test reports, and collaborating with testing engineers for verification and validation of the designed hardware. To excel in this role, you must possess 8-12 years of expertise in automotive instrument cluster hardware design, with proven experience across all stages of the Hardware Product Development Lifecycle. You should be familiar with processors/controllers such as Renesas, NXP, ST, Microchip, TI, Qualcomm, MediaTek, and NXP, and have expertise in high-speed board design, multi-layer board design, signal integrity, power integrity, SMPS designs, high-voltage power design, analog and mixed-signal design. Furthermore, proficiency in interfaces like CAN, LIN, USB, I2C, UART, LVDS, MIPI, Automotive Ethernet, RF designs, SOC-based designs, and Chip on board designs is essential. Experience in homologation and RF certifications (EMI/EMC compliance) in Domestic and International markets, along with proficiency in tools like ORCAD, ALLEGRO, and ALTIUM, is required. Competency in using lab instruments like multi-meters, oscilloscopes, function generators, and logic analyzers, as well as ISO26262 certification and experience in AGILE methodologies, are important qualifications for this role. Advantageous experiences include design of functional safety ECUs meeting ISO26262 requirements, as well as experience in advanced technology projects like ARAS and Sensor fusion. Your behavioral competencies should include effective communication, assertiveness, innovation, creative problem-solving, and system-level thinking, while your leadership competencies should encompass leading innovation and diverse teams, adaptability, and strategic thinking. If you are looking to be a part of a technology-first organization dedicated to transforming consumer experience and increasing perceived value of products and services, this role offers a unique opportunity to drive innovation and excellence in hardware design for connected, safer, sustainable, and comfortable mobility solutions at TVSM Software Research & Development Organization.,

As a Senior Application Engineer at Ansys, you will play a crucial role in deploying Ansys EDA products, with a primary focus on RedHawk-SC for Power Integrity and EMIR signoff across top Semiconductor companies. Your responsibilities will involve collaborating with Software developers, Architects, and Product Specialists to develop the product and implement it on cutting-edge SoCs in Semiconductor companies. Your key focus areas will include addressing challenges related to IP/SoC/3DIC Power Integrity, Signal Integrity, Reliability aspects such as EM/ESD/Thermal, Advanced timing/jitter, and Packaging on advanced nodes like 7/5/3/2 nm. As a senior member of the Application Engineering Team, you will: - Collaborate with Global Customers, IP-providers, and Foundries to understand design challenges of advanced SoCs & 3DICs and create EDA product specifications. - Work with the Product development team to develop state-of-the-art EDA products. - Utilize Ansys-Seascape platform, the Semiconductor Industry's First and Only True Big-Data design Platform. - Engage with top Semiconductor companies globally to deploy EDA products for addressing Power/Signal/Reliability challenges across Chip-Package-System. - Work on RedHawk and RedHawk-SC for assisting users and conducting EMIR/power-integrity sign-off analysis. - Provide expert guidance and consultation to Customers worldwide in resolving design challenges. To qualify for this role, you should possess: - A Bachelor's or Master's degree in Electrical or Electronics Engineering. - Minimum 3 years of industry experience in Power Integrity / Signal Integrity / EMIR signoff with hands-on knowledge of Redhawk-SC. - Strong problem-solving and programming skills. - Excellent verbal and written communication skills. Preferred qualifications include a passion for learning and deploying new technologies, along with the ability for minimal travel. At Ansys, we are committed to powering innovation that drives human advancement. Our culture is built on core values of adaptability, courage, generosity, and authenticity, which drive us to achieve audacious goals, work seamlessly as a team, demonstrate mastery, and deliver outstanding results. We believe in creating a workplace that supports diversity and welcomes talents from all backgrounds, fostering higher team performance and greater innovation. If you are ready to join a team of visionary leaders and push the boundaries of simulation technology to empower customers in creating innovative products, Ansys is the place for you. Explore the possibilities of what's next in your career at Ansys and be part of a workplace where respect, autonomy, and ethics are valued and encouraged. Visit www.ansys.com for more information.,

As a PHY Hardening Engineer at Ampere, you will play a pivotal role in the development of cutting-edge expertise in high-speed digital design. You will collaborate with various teams including architects, RTL designers, packaging and PCB design teams, and post-silicon validation groups to optimize layouts, ensure signal and power integrity, and perform chip-level physical design tasks. Your expertise in managing high-speed signals and advanced packaging techniques will be crucial in delivering reliable designs that meet timing, power, and manufacturability requirements. The ideal candidate for this role is a self-motivated individual with a Bachelor's degree and 8 years of related experience or a Master's degree and 6 years of related experience. You should have a strong background in floor planning, bump planning, routing, power grid design, clock design/distribution, and optimization for high-speed digital circuits. Experience in developing high-speed digital layouts, handling chip assembly, and using EDA tools for chip-level physical verification is essential. Additionally, familiarity with signal and power integrity concepts, advanced packaging technologies, and DFT structures will be advantageous. In return, Ampere offers a comprehensive benefits package including premium medical, dental, and vision insurance, parental benefits, retirement plans, and generous paid time off. You will also enjoy fully catered lunches, healthy snacks, and energizing beverages in the office. At Ampere, we nurture an inclusive culture that encourages personal and professional growth, empowering employees to innovate and contribute to a more sustainable future through industry-leading cloud-native designs. Join us at Ampere and be part of our journey to invent the future of computing.,

As a Senior Engineer, Signal Integrity at Micron Technology, you will be part of the inclusive culture that drives the innovation of memory and storage solutions. Your role within the Signal Integrity Research and Development (SI R&D) group will involve supporting various product developments, including DRAM, LPDRAM, NAND, CXL, LPCAMM, DIMM modules, and SSDs across different business sectors. Your responsibilities will include analysis of end-to-end systems solutions, circuit level IO and Power Distribution, integrated circuit packages, printed circuit boards, and measurements to ensure optimal Signal Integrity (SI) and power integrity (PI) performance for Micron's memory solutions. Working within the Signal Integrity team, you will be tasked with various aspects of SI and PI for high-speed interfaces, including modeling at silicon, package, and board levels, time and frequency domain analysis, electrical performance evaluation, and correlation to measurements for different products. You will collaborate with global teams for the development and optimization of methodologies, represent the SI R&D team in cross-functional groups, and integrate with various departments to ensure overall product performance. Successful candidates for this position will possess a Bachelor's or Master's degree in Electrical/Electronics Engineering with 4-8 years of experience. You should have a strong background in SI/PI/EMI theory and application, modeling, analysis, simulation, and a deep understanding of electromagnetic and transmission line theory. Experience with E.M. field solvers, simulation tools, and lab equipment is required. Additionally, familiarity with statistical analysis tools and experience in high-speed interface design and analysis are beneficial. The ideal candidate will be proactive in identifying gaps and opportunities, collaborate effectively with global teams and customers, and communicate complex issues and solutions clearly in both written and verbal formats. If you are ambitious, possess strong problem-solving skills, and enjoy taking ownership of projects, this role at Micron Technology may be the perfect fit for you. Micron Technology, Inc. is a leading industry player in memory and storage solutions, committed to transforming how information enriches life for all. With a focus on technology leadership and operational excellence, Micron delivers high-performance DRAM, NAND, and NOR memory and storage products that power innovations in artificial intelligence and 5G applications. For more information about Micron Technology and potential career opportunities, please visit micron.com/careers. If you require assistance during the application process or need reasonable accommodations, please contact hrsupport_india@micron.com. Micron strictly prohibits the use of child labor and adheres to all applicable labor laws and standards.,

Skills requried: • In-depth knowledge and hands-on experience on Netlist2GDSII Implementation i.e. Floorplanning, Power Grid Design, Placement, CTS, Routing, STA, Power Integrity Analysis, Physical Verification, Chip finishing. Should have experience on Physical Design Methodologies and sub-micron technology of 16nm and lower technology nodes. - Should have experience in Analog and Mixed Signal Design • Should have experience in handling >5M instance count , 1.5GHz frequency designs . • Should have experience on programming in Tcl/Tk/Perl to automate design process and improve efficiency. • Must have hands-on experience on PnR Suite from Cadence & Synopsys (Innovus & ICC2) • Strong experience on Static Timing Analysis (PrimeTime - SI) , EM/IR-Drop analysis (PT-PX, Redhawk), Physical Verification (Calibre). • Understanding the practical application of methodologies and Physical Design Tools, Flow Automation, and Improvements. • Experience in complex SOC integration, Low Power and High-Speed Design and Advanced Physical Verification Techniques.

As an Electrical Engineer with 1-3 years of experience, you will be responsible for designing circuit board assemblies, including MCU, SOC, high voltage, high power, HDI, and high-speed components. You will collaborate with electrical engineers to ensure that the printed circuit boards meet the design for manufacture requirements. Additionally, you will work closely with mechanical engineers to integrate the electrical components into mechanical packaging. Your role will involve designing high-speed PCBs and routing DDR3/4 memory interfaces, PCIe, and other components. You should have experience with schematic capture tools such as Altium Designer, OrCAD, Cadence Concept, or Mentor. Knowledge of Mentor Hyperlynx for Signal Integrity & Power Integrity tools is preferred. Your ability to work effectively in a team within a complex global organization is crucial. Strong oral and written communication skills are necessary to facilitate collaboration with cross-functional technical teams. You should also be able to influence outcomes and drive initiatives in complex environments. In this role, you will be expected to manage 3rd party layout services and participate in schematic and design reviews. A detailed understanding of high-speed digital PCB routing constraints and multilayer PCB construction is advantageous. You will support quick-turn board builds with PCBA contract manufacturers and release technical documents such as BOMs, design procedures, and design for manufacture guidelines. If you meet these qualifications and are looking for an opportunity to contribute to the design and development of cutting-edge electronic products, we encourage you to apply.,

As a Mechatronics Engineer in the automotive industry located in Bangalore, you will be responsible for designing and analyzing electronic and electrical systems for automotive applications. With a Bachelor's or advanced degree in Electrical, Electronics, or Mechatronics Engineering, along with 2 to 6 years of relevant work experience, you will play a key role in circuit design, electronics circuit analysis, and automotive design while adhering to automotive EMC standards. Your primary responsibilities will include designing circuits based on technical datasheets of electronics components, utilizing tools like Saber RD, LT Spice, ORCAD PSpice, or similar for electronics simulation, and working with Electronic design tools such as Altium Designer for circuit and PCB design. Additionally, you will be involved in firmware development for standard microcontrollers, hardware board design, debugging, and testing in the embedded hardware domain. You must possess a clear understanding of automotive EMC compliant PCB and circuit design, and be proficient in designing high-speed digital boards, schematic entry, PCB layout review, power analysis, DC analysis, power integrity, thermal analysis, board bring-up, testing, debugging, and documenting designs. If you meet these qualifications and have a passion for Mechatronics Engineering, we invite you to apply for this exciting opportunity. Immediate joiners or those with a notice period of up to 30 days are preferred. Contact Details: Prakyath P Mobile No: 9900024945 Email: Prakyath@inspirationmanpower.co.in Sheetal Mobile No: 9900073503 Email: sheetal.b@inspirationmanpower.co.in,

Responsibilities: * Collaborate with cross-functional teams on project delivery * Ensure compliance with industry standards and customer requirements * Lead analog design projects from concept to production

Oscilloscope, BERT, logic analyzer usage Signal/power integrity testing Board bring-up and hardware debugging PCIe / Ethernet interface validation Python scripting for test automation Validation test plan creation Router/Switch hardware

About the Role This leadership position is pivotal within a global digital data business, contributing to the development of next-generation connectors, cable assemblies, and radio system components. Youll steer a specialized engineering team focused on Signal Integrity, guiding end-to-end product lifecycle activitiesfrom concept to high-volume manufacturing qualificationthrough rigorous design, simulation, and testing. This is more than managementit's strategic direction in a fast-evolving tech space where innovation and precision meet performance. Click to Apply - (https://forms.gle/fqb29wUvjNuV82C57) Responsibilities Strategic Leadership: Lead a globally distributed team of experienced SI engineers. Align design activities with organizational goals, customer expectations, and technical standards. Create and manage work plans, project schedules, budgets, and resource allocation. Technical Oversight: Define signal integrity performance parameters for innovative products. Guide complex simulations for multiple protocols: PCIe, USB, Ethernet, etc. Oversee connector design reviews using electromagnetic simulation tools and test validation data. Ensure adherence to qualification processes for high-speed connector interfaces and cable assemblies. Innovation & Execution: Integrate market trends and customer needs into technical roadmaps. Advocate a data-driven design culture through structured simulation reviews and continuous improvement. Lead advanced packaging and PCB layout exploration to support emerging high-speed protocols. Team Development: Build a cohesive, skilled team through talent assessments, structured onboarding, and continuous upskilling. Foster collaboration across geographies and functional disciplines (mechanical, process, materials, product). Provide clear coaching, feedback, and career development plans. Balance workloads and promote wellbeing through flexible, effective leadership. Key Technologies & Tools Signal Integrity Tools: Agilent ADS, Ansys HFSS, CST CAD Platforms: SpaceClaim, AutoCAD, Creo PCB Design: Altium, layout/fabrication validation Test Equipment: VNA, TDR, BERT Data Analysis: Statistical interpretation, tolerance modeling Simulation Interpretation: Channel modeling, S-parameter validation Ideal Candidate Profile 10+ years in electrical or RF design with progressive experience 3+ years of people management and cross-functional leadership Strong grasp of physical layer system architecture and packaging interfaces Skilled communicator able to present to technical and executive audiences Experienced in high-volume manufacturing qualification and risk analysis Proven success building high-performance teams with global collaboration

Job Title: System-in-Package (SiP) Engineer - Semiconductor IC Package Design Location: Whitefield, Bangalore, India Tools Experience : Cadence APD/SIP MUST HAVE HAVE SYSTEM-IN-PACKAGE DESIGN EXPERIENCE. Company Overview: izmo Microsystems Pvt. Ltd. (www.izmomicro.com) is a pioneering semiconductor and systems company specializing in System-in-Package (SiP) miniaturization. With state-of-the-art facilities in Bangalore, we offer advanced 3D packaging solutions to meet the demands of high-density, high-performance systems across various industries, including consumer electronics, automotive, telecommunications, and green energy. Position Overview: We are seeking an experienced System-in-Package Engineer to lead the design and development of innovative SiP solutions. The ideal candidate will have a strong background in advanced packaging technologies and a proven track record of delivering high-performance SiP designs from concept to production. Key Responsibilities: Lead the design and layout of complex SiP solutions, including FCBGA and FCCSP packages, from initial concept through to tape-out. Collaborate with cross-functional teams, including digital designers, SI/PI engineers, and manufacturing teams, to define package requirements and ensure design integrity. Develop and optimize package layer stack-ups, padstacks, and design constraints to meet electrical and mechanical performance targets. Conduct feasibility studies, including fan-out analysis, mock-up designs, and package size reduction initiatives. Perform design rule checks (DRC), design verification, and ensure compliance with manufacturing and reliability standards. Drive continuous improvement in design methodologies and workflows, leveraging scripting and automation where applicable. Basic Qualifications: Bachelors or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field. Minimum of 5 years of experience with Cadence APD/SIP, with demonstrated ability to independently design and layout FCBGA/FCCSP packages. In-depth understanding of BGA package substrate technologies, assembly processes, and high-speed design principles. Familiarity with bill of materials (BOM), layer stack-ups, and design rules for high-speed applications. Working knowledge of package reliability, signal integrity (SI), and power integrity (PI) considerations. Strong problem-solving skills, with an entrepreneurial mindset and hands-on work ethic. Excellent teamwork and communication skills, with the ability to thrive in a dynamic, cross-functional environment. Preferred Qualifications: Experience with multi-chip modules, interposers, 2.5D, or heterogeneous package designs. Proficiency in scripting languages for design automation and reporting. Understanding of transmission line theory and SI/PI fundamentals. Why Join Us: At izmo Microsystems, you'll be at the forefront of semiconductor packaging innovation, working in a cutting-edge facility equipped with advanced technologies such as 3D die stacking and fine-pitch wire bonding. We offer a collaborative environment where your expertise will contribute to the development of next-generation electronic devices.

Key Responsibilities: Actively gather the necessary models and input to run the simulation from datasheets, supplier contacts, and websites. Perform PCB level SI and PI (DC & AC Drop) analysis and provide layout optimization recommendations based on the results. Perform S-parameter simulation and bench verification to verify and control matched impedances. Perform high-frequency Signal Integrity testing, including compliance and debugging required for product development. Needs to be detail-oriented, be able to document test plans, execute test procedures, and generate reports. Job Requirements and Skills Experience in the PCB design process: schematic capture, layout, generation of design files, BOMs, and release. Worked with schematic capture tools like OrCAD & Allegro PCB. Experience in the generation of Gerber files and PCB fabrication processes. Expert in the PCB layout process conforming to IPC standards and electrical and mechanical constraints of printed circuit board design, fabrication, and assembly. Componenet footprint/library creation. Experience in reading component datasheets. Experience in PCB stack-up analysis Hands-on experience in PCB modeling and Package modeling. Working knowledge of High-Speed design and RF principles (S-parameters, Impedance, etc.). Strong Signal/Power Integrity fundamentals Experience in simulating (FD/TD) memory interfaces for Board and Package is required (DDR3/DDR4, LPDDR3/4) Experience in simulating (FD/TD) High-Speed Serial IO interfaces for Board and Package is required (PCIe Gen3/4, RGMII...etc) Simultaneous switching output analysis Simulations of device I/O to reduce overshoot and undershoot (which can cause increased noise on power planes due to return currents). Crosstalk analysis of signals to reduce noise Good knowledge of Power Delivery Network, impedance profile analysis, IR Drop Analysis, modeling of PCB and Package Shapes, and time- domain Analysis. Experience 3 - 6 Years . Industry Engineering / Engineering Design / R&D / Quality Qualification B.E Key Skills PCB Designing PCB Designer Simulation Process

About Euler : Euler Motors is an automotive OEM focused on transforming transportation in the country with Indias most powerful commercial electric vehicles. Today, Euler Motors stands as the front runner in the commercial EV space, building industry-leading EV technology for India, from India. We work towards building the best commercial EVs and a robust EV ecosystem to encourage faster EV adoption in India. Role: Hardware Design Engineers Location: Mohan Estate, Delhi Working - Monday to Saturday Technical Skills Required: Requirements 4-8 years of experience in hardware design or related fields. Strong knowledge of analog, digital & power electronics circuit design principles. Proficiency in ECAD software for schematic creation, PCB designing, and BOM management. Experience with hardware testing, debugging, and validation. Knowhow to use lab equipments like bench supplies, oscilloscopes, multimeters, logic analyzers etc Strong understanding of SI(signal integrity)/PI(power integrity), power distribution & thermal impacts, and EMI/EMC considerations. - Go to have Excellent problem-solving skills and attention to detail. Strong communication and collaboration abilities. Roles and Responsibilities : Design complex digital, analog & power circuits using ECAD tools. Extensive experience with Altium net classes, high voltage rules, variants and rooms Familiarity with Altium Designer PCB layout tools and schematic capture A good understanding of the PCB layout process and IPC Standards. Familiarity with PCB fabrication, design for manufacturing techniques for high volume designs Collaborate with cross-functional teams to ensure successful product development. Conduct EMI/EMC testing and analysis to meet industry standards. Ensure signal integrity through simulation-based design verification. Perform simulations and analyses to ensure design robustness. Familiarity with high voltage circuit board creepage and clearance requirements, with voltages up to 1500V Mentor junior engineers and provide technical guidance Regards Jerrin Jacob Assistant Manager-HR Euler Motors jerrin.jacob@eulermotors.com +91 9654358259

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Job Function Qualcomm seeks candidates to help design reference designs and solutions for customers using Qualcomm hardware and software. The role involves working with the Customer Engineering team on product designs, supporting Qualcomm's platforms and applications, and collaborating with internal stakeholders. Responsibilities include creating reference designs, supporting hardware design sign-offs, system/PCB/chip-level debugging, and managing design collaterals to accelerate product development for customers. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Preferred Qualifications A strong understanding of Digital/baseband HW design and PCB design is required. Good troubleshooting skills with the ability to analyze and debug during board bring up (boot-up) are essential. An understanding of LDO/SMPS is essential, along with experience in power management for portable devices being advantageous. Solid knowledge in High-Speed digital interfaces, such as memory Bus I/F (UFS, eMMC, LPDDR, NAND), Display interfaces (parallel and serial, preferably MIPI DSI), Camera interfaces (parallel and serial, preferably MIPI CSI), High Speed peripherals (USB, SDC, PCIe, Ethernet), and Standard Peripheral interfaces (UART, SPI, I2C, JTAG, HDMI) are necessary. Experience with Digital HW/baseband systems and board-level design, as well as familiarity with Digital ASICs and system design, is important. Understanding of system-level clocking schemes, interface-level handshakes are necessary A strong understanding of mobile and consumer electronics products is needed. Hands-on experience with oscilloscopes, logic analyzers, test and measurement tools are required. Basic knowledge of ARM processors and experience with JTAG emulators, display drivers, and memory is preferable. Knowledge of multi-core system/inter-chip system design is advantageous. A strong understanding of PCB signal/power integrity is necessary Reviewing schematics and suggesting improvements is required. Experience with schematic entry is necessary; must have knowledge to review PCB layout in various CAD tools like Cadence Allegro, Siemens Mentor Graphics suite. Hands-on with PCB layout edit tools is advantageous Knowledge of multi-layer PCB designs, vias, and stack-up configuration is essential. The ability to interact with multi-geography customers and stakeholders is desired. Knowledge of prototyping platforms like Arduino and Raspberry Pi is beneficial. Coding skills with Python or C is advantageous. As a member of Qualcomm's Customer Engineering team, responsibilities include creating reference designs, chip and chipset documentation, reference schematics, and training materials for global customer support. Candidate will assist with hardware design reviews, respond to technical queries, and troubleshoot designs at the system, SoC, and PCB levels. A minimum of 3 years' relevant experience is required, along with skills in hardware, digital/high speed/power management, and Silicon validation. Keywords Board Design, Board bring up, UFS, LPDDR, NAND, eMMC, MIPI, USB, UART, SPI, I2C, Logic Analyzer, PADS, Allegro, LDO, SMPS, Clocks, Crystal, ARM processor, JTAG Job Function Qualcomm seeks candidates to help design reference designs and solutions for customers using Qualcomm hardware and software. The role involves working with the Customer Engineering team on product designs, supporting Qualcomm's platforms and applications, and collaborating with internal stakeholders. Responsibilities include creating reference designs, supporting hardware design sign-offs, system/PCB/chip-level debugging, and managing design collaterals to accelerate product development for customers.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Title: PMIC Reference Board Design Engineer Location: Bangalore, India : The QCT PMIC Systems group has an opening for a PMIC Reference Board Design Engineer. This group owns PMIC PCB design guidelines for Qualcomm chipset-based phone design. This includes design and optimization of PMIC PCB Floorplan, Schematic, Layout, phone thermal solution and eBOM selection for test platforms and customer reference design and evaluation kits. Qualcomm PMIC hardware design typically consists of modules such as switch-mode power supplies and linear voltage regulators for a variety of cores and peripherals, battery chargers, low noise clocks, ADCs, user interfaces such as display, camera flash and haptics, Power-on and Reset hardware. Responsibilities: ** NOT A LAYOUT POSITION** Job responsibilities for this position include design of Qualcomm PMIC Reference Board design and evaluation kits and working closely with PMIC IC designers and Test HW platform teams for optimizing performance and cost on test hardware platforms. The engineer will develop PMIC PCB reference design consisting of schematics, PCB layout, eBOM selection, layout guidelines and specs (by working closely with CAD engineer) based on interaction with chipset architecture, chip design and test teams. Experience in Mentor PADs Logic and PADs Layout, DxDesigner and Expedition is desirable but not essential. The engineer is required to perform the required board level simulations (based on Power Integrity and Signal Integrity tools) to review and sign off on hardware designs developed by various test teams. The engineer will be responsible for characterizing and publishing performance and cost optimized reference BOM lists (power inductors, capacitors, third party components etc) based on component characterization and BOM reduction and optimization tests in lab. Skills/Experience: ** NOT A LAYOUT POSITION** Understanding and ability to apply electrical engineering concepts and circuit solving skills. Able to work with common lab test equipments (oscilloscope, spectrum analyzer, logic analyzer, network and impedance analyzer, etc.). Experience in Power Management (SMPS, LDO, battery chargers, Clocks, ADC) PCB design and component selection including CAD interface. Experience in high layer count multilayer boards (6/8/10 layers) preferred. Good understanding of common Signal and Power Integrity issues on test hardware and ability to identify and provide alternate solutions using Signal and Power Integrity simulators (eg. powerSI, SIWave, Ansys) is also a plus. It is important the candidate has ability to communicate technical understandings and project status clearly. Also important is the ability to organize effectively and document work thoroughly and follow required procedures and methodologies . Ability to contribute seamlessly as a member of the reference HW design team across multiple chipsets. Education: RequiredB.E/ M.Tech /MS with 1 to 7 years of relevant experience. Keywords PMIC Reference Board Design, Power Electronics, PCB Design, Power Delivery, Power Integrity

About the Role: We're looking for an experienced PCB Design Engineer Module Lead to lead innovative projects in high-speed digital and RF PCB layouts for advanced electronic systems, including radar and electronic warfare systems. As a Module Lead, you will: Oversee the design, development, and implementation of RF and digital PCB layouts. Lead end-to-end design processes, ensuring technical excellence and quality standards. Mentor and guide a dynamic team of engineers to deliver outstanding results. Key Responsibilities Design and develop RF and digital PCB layouts from concept to production. Collaborate with cross-functional teams to gather and evaluate design requirements. Optimize PCB designs for signal integrity, power integrity, and thermal performance. Ensure adherence to industry standards (IPC, MIL-STD) and organizational guidelines. Guide component selection, ensuring compatibility and cost-effectiveness. Perform DFM (Design for Manufacturability), DFT (Design for Testability), and EMI/EMC compliance checks. Conduct simulations and testing to validate PCB performance. Mentor junior engineers and drive team success. Maintain project timelines, allocate resources, and ensure on-time delivery.