32 Power Integrity Jobs

Job Posting TitlePRINCIPAL R&D/PRODUCT DVL ENGINEER Business UnitDIGITAL DATA NETWORKS (50461863) BuildingSahasra Shree (N84) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Product Development Engineer for TE Connectivity, you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Roles and Responsibilities: Responsibilities: Subject matter expert in high-speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing and verify SI test results Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelors degree in electrical or electronicsengineering, masters degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high-speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Knowledge on power integrity and PDM analysis is added advantage. Experience with signal conditioning techniques (equalization, amplification, FIRs, CTLEs) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high-speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies

Job Details: : Performs physical design implementation of custom CPU designs from RTL to GDS to create a design database that is ready for manufacturing. Conducts all aspects of the CPU physical design flow including synthesis, place and route, clock tree synthesis, floor planning, static timing analysis, power/clock distribution, reliability, and power and noise analysis. Conducts verification and signoff including formal equivalence verification, static timing analysis, reliability verification, static and dynamic power integrity, layout verification, electrical rule checking, and structural design checking. Analyzes results and makes recommendations to improve current and future CPU microarchitectures closely collaborating with logic, circuit, architecture, and design automation teams. Possesses CPU specific expertise in various aspects of structural and physical design, including physical clock design, timing closure, coverage analysis, multiple power domain analysis, structured placement, routing, synthesis, and DFT. Works intimately with industry EDA vendors to build and enhance tool capabilities to design a highspeed, low power synthesizable CPU. Optimizes CPU design to improve product level parameters such as power, frequency, and area. Participates in the development and improvement of physical design methodologies and flow automation. Qualifications: Qualifications: B.Tech with 3+ years or M.Tech with 2+ Years of hands-on experience with end-to-end SD flow - synthesis to GDS using industry standard EDA tool, with a proven track record of successful projects. Has good understanding on timing methodology, constraints building etc. Experience in floorplaning concepts and actual work, and integration of hierarchical design Good understanding and experience with multiple power domains designs. Have hands on experience on LV flow and clean up. Job Type: Experienced Hire Shift: Shift 1 (India) Primary Location: India, Bangalore Additional Locations: Business group: The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. *

Job Area: Engineering Group, Engineering Group > Hardware Applications Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Job Function Qualcomm is looking for candidates to support its customers in designing solutions using Qualcomm Hardware and Software. The Individual will contribute to the dynamic HW Applications engineering team for end product designs. The Individual will also be responsible for supporting Qualcomm's growing portfolio of platforms/applications and the job involves working closely with internal partners in Product definition as appropriate. The PMIC- H/W application Engineer will be responsible for supporting Qualcomms growing portfolio mobile phone platforms. The job involves working closely with partners and customers of Qualcomm to define the specifications of the mobile phone handset products, part selection, system design, design reviews, support while doing system debug, partner deliverables etc. As a member of Qualcomm customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in mobile, PC, and consumer electronics markets. Individual will be responsible to work closely with cross function teams in Qualcomm, including design engineering, systems engineering, characterization team, ATE test team, SW team, product marketing, program management and peers in customer engineering organization across multiple regions. Individual will be responsible to create chipset documentation, reference schematics, training material, application notes for worldwide customer support. Individual will be responsible to engage with customer designs, assist customers in feature definition and design reviews, provide in-depth technical responses to customer queries, do troubleshooting of customer designs and provide necessary training to customers. Past expertise in interacting with multiple teams in HW, SW domains, skills in Digital/Baseband and sound technical knowledge of Qualcomm PMICs are desirable. . Preferred Qualifications Sound understanding of LDO/SMPS - Must to have Experience on power management for portable devices will be a plus Strong understanding PCB Signal/power integrity- Should be comfortable reviewing schematic/suggest changes for improvement - Experience with Schematic entry will be a plus . Should be fluent with CAD tools like Allegro/PADs to review customer layout . Knowledge on crystals/Clocks - Must to have Knowledge on display backlighting schemes - Must to have Knowledge on LabVIEW/python- Will be a plus Experience on Analog and mixed signal bench validation- Will be a plus Knowledge on battery charging and Fuel gauge will be a plus Good communication skills Keywords Power Management, Applications, Analog, PMIC, SMPS, DC/DC Converter, Buck, Boost, LDO, charger, fuel gauge/gas gauge, LED driver, ADC, oscillator, amplifier, Educational Bachelor's or Masters in Electronics and/or Electrical Engineering with 3 -5 years of relevant industrial experience

Roles and Responsibilities Lead design of high-reliability power electronics PCBs for automotive-grade products Own schematic creation, stack-up definition, and material selection for high-current, high-voltage designs Ensure compliance with EMI/EMC, thermal, and mechanical constraints during layout Conduct architecture reviews and design validation with the hardware team Select components based on electrical, thermal, cost, and reliability trade-offs Review and maintain schematic symbols, footprints, and library standards Lead root cause analysis for validation and production-level PCB issues Release complete production documentation (Gerbers, BoM, pick-and-place, assembly drawings) Guide junior engineers and drive best practices in layout and design Coordinate with suppliers and manufacturers for DFM/DFA compliance Implement cost reduction and continuous improvement based on field feedback Support ICT and FCT processes Skills 3+ years of PCB design experience; proficiency in Altium Designer preferred Strong foundation in electrical engineering and power electronics Expertise in analog, digital, and power layout with good thermal design practices Experience in debugging and testing power electronics systems Familiar with IPC standards (IPC-2221, IPC-2152, IPC-4761) and DFM/DFT guidelines Knowledge of signal/power integrity, impedance control, and EMI/EMC compliance Understanding of mechanical constraints; experience with 3D CAD models (DXF/STEP) Strong documentation and communication skills Leadership abilities to mentor and manage junior team members.

Should have experience on Mixed Signal Design, Analog Circuit Design and Digital Circuit Design Should have experience in working on complete Product Development Life Cycle Should have a strong understanding of Signal and power Integrity phenomena and relevant tools. Should have knowledge of working on micro controllers, microprocessors and FPGAs from various industry manufacturers like TI, STM, Qualcomm, Xilinx, Lattice and others. Should have knowledge of communication protocols like SPI, I2C, USB, UART, CAN, Ethernet, Wi-Fi, RS485 a few to mention. Should possess excellent knowledge of various power regulators like Switching and LDOs. Should have experience of Schematic Design in Altium and Orcad Should have reviewed the layout designs and guided PCB designers for an effective component placement and routing for various designs. Should have worked on Multi-layer board design with minimum 6 layers. Understanding of the layer stack-up definition and its understanding is desired. Should have knowledge of using various electronic tools and instruments like Oscilloscopes, multi meters and others. Should have excellent debugging skills with analytical reasoning. Should have experience in making the designs meet various compliance standards related to safety, ESD, EMI/EMC. Excellent interpersonal, written and verbal communications skills; flexible, self-directed and able to work in a team environment. Knowledge of Change/Configuration Management and ECN processes is a Plus Should possess excellent knowledge of various power regulators like Switching and LDOs. AC to DC Power Supply Design and debugging Should have strong knowledge in working on various motors like BLDC, stepper, etc. Should have strong knowledge of working on Encoders, motor drive........Bold are mandatory skills.

We need an Electronics Engineer to work under the direction of product developers to design new ways of incorporating electronics into our product portfolio. In this role, the person will collaborate with others to offer innovative methods of product development as well as improving existing products. The person will create models and prototypes as well as handle calculations required for manufacturing specifications. The person will test electronics to ensure they function as planned. The person will also be responsible for ensuring that electronics meet the highest standards of safety for our customers. Tasks & Responsibilities: Realization of the development in accordance with the targets defined in the work package with respect to the contents, quality, deadlines and costs of the project Schematic Design Component selection meeting cost and performance Mandatory: Should have experience on Mixed Signal Design, Analog Circuit Design and Digital Circuit Design Should have experience in working on complete Product Development Life Cycle Should have a strong understanding of Signal and power Integrity phenomena and relevant tools. Should have knowledge of working on micro controllers, microprocessors and FPGAs from various industry manufacturers like TI, STM, Qualcomm, Xilinx, Lattice and others. Should have knowledge of communication protocols like SPI, I2C, USB, UART, CAN, Ethernet, Wi-Fi, RS485 a few to mention.

Engineering in ECE or ETC,PCB design using Altium Design Software. Experience in Multi-Layer PCB design,Experience in PCB design with Signal Integrity. Power Integrity and EMI/EMC considerations. Experience in working with Serial protocols such as RS422/485, I2C, SPI, UART etc. Experience in working with Wi-Fi, LoRa and Bluetooth related hardware and antenna selection. Experience in working with Micro controller & Computer Module. Exp in Preparing FEMCA & DFMEA analysis for hardware Design

Job Information Job Opening ID ZR_1777_JOB Date Opened 24/03/2023 Industry Technology Job Type Work Experience 6-10 years Job Title Electronics Engineer City Gurgaon Province Haryana Country India Postal Code 201303 Number of Positions 1 Should have experience on Mixed Signal Design, Analog Circuit Design and Digital Circuit Design Should have experience in working on complete Product Development Life Cycle Should have a strong understanding of Signal and power Integrity phenomena and relevant tools. Should have knowledge of working on micro controllers, microprocessors and FPGAs from various industry manufacturers like TI, STM, Qualcomm, Xilinx, Lattice and others. Should have knowledge of communication protocols like SPI, I2C, USB, UART, CAN, Ethernet, Wi-Fi, RS485 a few to mention. Should possess excellent knowledge of various power regulators like Switching and LDOs. Should have experience of Schematic Design in Altium and Orcad Should have reviewed the layout designs and guided PCB designers for an effective component placement and routing for various designs. Should have worked on Multi-layer board design with minimum 6 layers. Understanding of the layer stack-up definition and its understanding is desired. Should have knowledge of using various electronic tools and instruments like Oscilloscopes, multi meters and others. Should have excellent debugging skills with analytical reasoning. Should have experience in making the designs meet various compliance standards related to safety, ESD, EMI/EMC. Excellent interpersonal, written and verbal communications skills; flexible, self-directed and able to work in a team environment. Knowledge of Change/Configuration Management and ECN processes is a Plus Should possess excellent knowledge of various power regulators like Switching and LDOs. AC to DC Power Supply Design and debugging Should have strong knowledge in working on various motors like BLDC, stepper, etc. Should have strong knowledge of working on Encoders, motor drive........Bold are mandatory skills. check(event) ; career-website-detail-template-2 => apply(record.id,meta)" mousedown="lyte-button => check(event)" final-style="background-color:#2B39C2;border-color:#2B39C2;color:white;" final-class="lyte-button lyteBackgroundColorBtn lyteSuccess" lyte-rendered=""> I'm interested

Job Information Job Opening ID ZR_1720_JOB Date Opened 14/03/2023 Industry Technology Job Type Work Experience 6-10 years Job Title Electronics Engineer City Gurgaon Province Haryana Country India Postal Code 201303 Number of Positions 1 We need an Electronics Engineer to work under the direction of product developers to design new ways of incorporating electronics into our product portfolio. In this role, the person will collaborate with others to offer innovative methods of product development as well as improving existing products. The person will create models and prototypes as well as handle calculations required for manufacturing specifications. The person will test electronics to ensure they function as planned. The person will also be responsible for ensuring that electronics meet the highest standards of safety for our customers. Tasks & Responsibilities: Realization of the development in accordance with the targets defined in the work package with respect to the contents, quality, deadlines and costs of the project Schematic Design Component selection meeting cost and performance Mandatory: Should have experience on Mixed Signal Design, Analog Circuit Design and Digital Circuit DesignShould have experience in working on complete Product Development Life CycleShould have a strong understanding of Signal and power Integrity phenomena and relevant tools.Should have knowledge of working on micro controllers, microprocessors and FPGAs from various industry manufacturers like TI, STM, Qualcomm, Xilinx, Lattice and others.Should have knowledge of communication protocols like SPI, I2C, USB, UART, CAN, Ethernet, Wi-Fi, RS485 a few to mention. check(event) ; career-website-detail-template-2 => apply(record.id,meta)" mousedown="lyte-button => check(event)" final-style="background-color:#2B39C2;border-color:#2B39C2;color:white;" final-class="lyte-button lyteBackgroundColorBtn lyteSuccess" lyte-rendered=""> I'm interested

Job Information Job Opening ID ZR_1991_JOB Date Opened 16/06/2023 Industry Technology Job Type Work Experience 6-10 years Job Title Lead Engineer- Hardware City Krishna Province Andhra Pradesh Country India Postal Code 520001 Number of Positions 1 Engineering in ECE or ETC,PCB design using Altium Design Software. Experience in Multi-Layer PCB design,Experience in PCB design with Signal Integrity. Power Integrity and EMI/EMC considerations. Experience in working with Serial protocols such as RS422/485, I2C, SPI, UART etc. Experience in working with Wi-Fi, LoRa and Bluetooth related hardware and antenna selection. Experience in working with Micro controller & Computer Module. Exp in Preparing FEMCA & DFMEA analysis for hardware Design check(event) ; career-website-detail-template-2 => apply(record.id,meta)" mousedown="lyte-button => check(event)" final-style="background-color:#2B39C2;border-color:#2B39C2;color:white;" final-class="lyte-button lyteBackgroundColorBtn lyteSuccess" lyte-rendered=""> I'm interested

PCB design principles, Software Expertise in Altium Designer for schematic capture, PCB layout, & library management High-speed PCB design Power electronics, SI/PI concepts, & EMI/EMC compliance DFM, DFA, & PCB manufacturing processes IPC standards Required Candidate profile Experience in PCB design, preferably with high-speed and/or complex multilayer boards Effective communication skills Knowledge of Flex PCB and HDI PCB design

Major skills that we need to look for -> Hardware Design, Board design, Digital circuit design, Low power design, Board debug, Board testing, x86, Documentation Detailed JD :- Hardware design engineer with x86 Board design background. Strong fundamentals and experience in Digital circuit design and low power Electronic circuits. Understanding of signal integrity, EMI/EMC concepts for Digital and Power Electronics Experience in at least one complete project starting from the high-level design to the final validation. Should be able to independently handle the schematic design, design analysis and review coordination with peer designers, Layout, SI and EMC teams. Experience in board bring-up and issue investigation & triage, in coordination with firmware and software teams. Experience in preparing and reviewing hardware design documentation and issue investigation reports. Should be able to develop the board bring-up plan, be able to identify the test equipment required and execute independently . Strong communication and interpersonal skills to collaboratively work with various cross functional teams involving post silicon IP Validation, BIOS and Driver Development/QA.

1. Candidate shall have experience in handling multiple end to end product project around RF design, analysis, testing, calibration, regulatory compliances and release of products for commercial deployments 2. Relevant experience of 3+ years in RF Design. Responsibilities 1. Lead the design, simulation, and verification of complex analog and mixed-signal circuits, Signal integrity, power integrity, impedance Analysis. 2. Perform advanced simulations and analyses to ensure exceptional circuit performance and compliance with specifications. 3. Create comprehensive documentation of design methodologies, specifications, and outcomes. 4. Multi radio front end and radio optimisation. 5. Extensive knowledge on RF matching, filter design and antenna matching. 6. Conversant with lab equipment like Spectrum Analyzer, Network analyser, RF Signal generators , IQXEL, MT8852 etc. 7. Experience on EMI/EMC, Antenna design, Signal Integrity and Thermal Analysis will be a key skill. 8. Design and develop Regulatory certified BLE, ZigBee, Wi-Fi modules. 9. Work closely with cross functional teams to derive the design specification for Modules. 10. Prototype Board bring-up, Validation and Characterization. 11. Handover design to manufacturing and help to derive the production test plan. 12. Documentation of design, test plan and test results. 13. Supporting Customer support team in debugging critical customer issues. 14. Radio side design and debugging. 15. RF performance evaluation, calibration and optimisation. 16. Link budget and harmonics analysis. 17. Tuning and optimisation of RF front end. 18. Deep understanding on radio chip, physical layer customisations and its impacts on the radio performance. 19. Understanding of various physical layer standards. 20. Willingness to contribute in global standards committee of next generation wireless systems. 21. Ownership of product level EMI/EMC compliances for global requirements as well. 22. Schematic, Layout and BOM selection. Mandatory Key Skills MT8852,Signal integrity,power integrity,debugging,Spectrum Analyzer*,Network analyzer*,RF Signal generators*,IQXEL*,RF design*

Knowledge of High-Speed Board Design Experience in designing with memories like DDR3 / DDR4 / eMMC / NAND / NOR Flash etc. Experience in designing with High-speed communication protocols like PCIe / SerDes / USB3.0 / SGMII / SFP+ /10G/100G/ Hands-on experience with MII, SGMII, RGMII, HSGMII, QSGMII, XGMII and its PHY interfaces Hands-on experience with Intel or Broadcom or Marvel or MediaTek Quad/Octal port Ethernet PHYs transceivers Should have design experience in Multiport Gigabit Network Switches, Hubs and Gigabit Router Added Advantage for knowledge of PoE 802.3at , PoE+ 802.3bt Type 2 , or PoE++ 802.3bt Type 3 or 4PPoE PoE++ Type 4 Should Have Experience of different Gbit Standard such as 1000Base – SX, 1000Base-LX, 1000Base- CX, and 1000Base-T 1Gb/s SFP(INF-8074i),10Gb/s SFP+ (SFF-8431 4.1) or 25Gb/s SFP28 (SFF-8402) and QSF,QSFP+,QSFP28 would be advantage Experience with High-speed Hardware design, Complex Analog and Digital Hardware System level design, circuit analysis, SI/PI, PSPICE simulation, Boundary scan, EMC/EMI analysis and safety standards Responsibilities include Schematic Capture, Component Selection, Library Creation and Guiding Board Layout. Should Have product development understanding like Enterprise switching, Port extender, Embedded Ethernet fabric, and TSN products Hands-on experience in Telecom/Datacom product design Experience like PDH/SDH/SONET/ and fibre optic products Should Have telecom backhaul Network transmission products design Experience, Experience in working with complex ASSPs, Microprocessors/controllers and FPGAs Experience in Signal Integrity / Power Integrity Should have worked on testing equipment like high-speed Oscilloscope, Network analysers, spectrum analysers etc

Role & responsibilities High-Speed PCB Design: Develop PCB layouts for high-speed systems, including DDR, PCIe, USB, Ethernet, and other high-frequency interfaces. Signal and Power Integrity: Perform signal and power integrity analysis to ensure optimal design performance. Layer Stack-up Design: Define PCB stack-ups and impedance-controlled designs for high-speed and high-density applications. Simulation and Validation: Use simulation tools to validate designs for crosstalk, impedance matching, and high-speed signals. Component Placement and Routing: Optimize placement and routing strategies to meet performance, manufacturability, and cost requirements. Design for Manufacturing (DFM) and Test (DFT): Collaborate with fabrication and assembly teams to ensure manufacturability and testability of designs. Documentation: Generate detailed design files, BOMs, and fabrication documentation. Compliance: Ensure designs adhere to industry standards (e.g., IPC-6012, ISO 9001) and regulatory requirements. Collaboration: Work closely with hardware, firmware, and system engineering teams to meet project requirements. Preferred candidate profile Bachelors degree in Electrical Engineering, Electronics, or a related field. 3+ years of experience in PCB design with a focus on high-speed digital and RF designs. Expertise in Altium for PCB Design Strong knowledge of signal integrity, power integrity, and EMI/EMC design principles. Proficiency in high-speed interfaces (DDR3/DDR4/DDR5, PCIe, SerDes, etc.). Familiarity with simulation tools like HyperLynx, Ansys, or SIwave for signal and power integrity analysis. Hands-on experience with impedance-controlled designs and differential pair routing. Solid understanding of PCB fabrication and assembly processes.

Job Area: Engineering Group, Engineering Group > Hardware Applications Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Application Engineer, you will provide technical expertise of hardware through trainings, product demonstrations, and the design, debug, test, and quality support of customer products. Qualcomm Hardware Application Engineers collaborate with cross-functional teams to assess the potential application of company products that meet and exceed customer needs. Minimum Qualifications: "¢ Bachelor's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 2+ years of Hardware Applications Engineering or Hardware Design experience or related work experience. OR Master's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 1+ year of Hardware Applications Engineering or Hardware Design experience or related work experience. OR PhD in Electrical/Electronics Engineering, Computer Engineering, or related field. IOT JD Title IOT Applications Engineering "“ Senior Engineer Job Function Qualcomm is seeking candidates to assist its customers in designing IoT solutions utilizing Qualcomm hardware and software. The individual will contribute to the dynamic Customer Engineering team for product designs and will be responsible for supporting Qualcomm's expanding portfolio of platforms and applications. This role involves collaborating closely Qualcomm customers to support hardware design sign-offs, system/PCB/chip-level debugging, and ownership of design collaterals that helps customers to bring out products faster. Preferred Qualifications A strong understanding of Digital/baseband HW design and PCB design is required. Good troubleshooting skills with the ability to analyze and debug during board bring up (boot-up) are essential. An understanding of LDO/SMPS is essential, along with experience in power management for portable devices being advantageous. Solid knowledge in High-Speed digital interfaces, such as memory Bus I/F (UFS, eMMC, LPDDR, NAND), Display interfaces (parallel and serial, preferably MIPI DSI), Camera interfaces (parallel and serial, preferably MIPI CSI), High Speed peripherals (USB, SDC, PCIe, Ethernet), and Standard Peripheral interfaces (UART, SPI, I2C, JTAG, HDMI) are necessary. Experience with Digital HW/baseband systems and board-level design, as well as familiarity with Digital ASICs and system design, is important. Understanding of system-level clocking schemes, interface-level handshakes are necessary A strong understanding of mobile and consumer electronics products is needed. Hands-on experience with oscilloscopes, logic analyzers, test and measurement tools are required. Basic knowledge of ARM processors and experience with JTAG emulators, display drivers, and memory is preferable. Knowledge of multi-core system/inter-chip system design is advantageous. A strong understanding of PCB signal/power integrity is necessary Must be comfortable in reviewing schematics and suggesting improvements is required. Experience with schematic entry is a plus. Must have knowledge to review PCB layout in various CAD tools like Cadence Allegro, Siemens Mentor Graphics suite. Knowledge of multi-layer PCB designs, vias, and stack-up configuration is essential. The ability to interact with multi-geography customers and stakeholders is desired. Knowledge of prototyping platforms like Arduino and Raspberry Pi is beneficial. About The Role As a member of Qualcomm's Customer Engineering team, responsibilities include creating chip and chipset documentation, reference schematics, and training materials for global customer support. Candidate will assist with hardware design reviews, respond to technical queries, and troubleshoot designs at the system, SoC, and PCB levels. A minimum of 3 years' relevant experience is required, along with skills in hardware, digital/high speed/power management, and Silicon validation. Keywords Board Design, Board bring up, UFS, LPDDR, NAND, eMMC, MIPI, USB, UART, SPI, I2C, Logic Analyzer, PADS, Allegro, LDO, SMPS, Clocks, Crystal, ARM processor, JTAG Educational Requirements RequiredBachelor's, Electronics and/or Electrical Engineering PreferredMaster's, Electronics and/or Electrical Engineering

Objective We are looking for an experienced System Hardware Design Engineer from Product/Semiconductor industry background. Roles and Responsibilities As a Senior/Lead Hardware Engineer you will be designing innovative and high performance next generation Protocol Analyser products for the semiconductor industry. We are looking for candidates who thrive in a fast paced start-up like environment, you will be engaged In all aspects of hardware design life cycle including high-speed board design, R&D, proof of concept designs and validation. Basic Qualifications Bachelor's or masters degree in Electrical/Electronics/Communication Engineering or related field from reputed institute. 4 to 8 years of board design experience from any product based organization Proficient in high-density/high-speed design (including FPGA's, SerDes, PCIe Gen4/Gen5,UFS 4.0, 10/100 GigE, CPHY/DPHY,USB 3.2) Experience in interfacing high-speed memories such as DDR4/5, RDIMM, SODIMM Modules system integration including schematic and layout using industry-standard capture and design packages such as spice, Altium or Cadence. Hardware validation, troubleshooting, board bring-up, candidate should be good at using high-end laboratory equipment An outstanding teammate with strong interpersonal and communication skills. Collaborate with RTL, SW and quality engineers to integrate and debug the system level issues. Good verbal and written communication skills, design documentation as per organizational standards. Preferred Qualifications Experience in signal integrity and power integrity, High speed board design concepts. Hands-on Signal integrity analysis, PI and high speed analog simulation, SI tools such as HFSS, SIwave, ADS and Hyperlynx. Hands on with 33GHz and 50GHz Oscilloscopes and GHz pattern generators for protocol capture, timing and eye diagram analysis. Inclusion and Diversity We are committed to fostering a workplace that celebrates diversity in all its forms and believe diverse teams drive innovation, creativity, and success. We aim to create an inclusive environment where all employees feel valued and respected.

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } PRINCIPAL R&D/PRODUCT DVL ENGINEER Job Posting TitlePRINCIPAL R&D/PRODUCT DVL ENGINEER Business UnitDIGITAL DATA NETWORKS (50461863) BuildingSahasra Shree (N84) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Product Development Engineer for TE Connectivity, you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Roles and Responsibilities: Responsibilities: Subject matter expert in high-speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing and verify SI test results Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelor’s degree in electrical or electronicsengineering, master’s degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high-speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Knowledge on power integrity and PDM analysis is added advantage. Experience with signal conditioning techniques (equalization, amplification, FIR’s, CTLE’s) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high-speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131404 Alternative Locations: Function: Engineering & Technology Job Segment Six Sigma, R&D Engineer, Electrical, Electronics Engineer, Hardware Engineer, Management, Engineering Apply now »

Job Area: Engineering Group, Engineering Group > Hardware Applications Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Job Function Qualcomm is looking for candidates to support its customers in designing solutions using Qualcomm Hardware and Software. The Individual will contribute to the dynamic HW Applications engineering team for end product designs. The Individual will also be responsible for supporting Qualcomm's growing portfolio of platforms/applications and the job involves working closely with internal partners in Product definition as appropriate. About The Role The PMIC "“ H/W application Engineer will be responsible for supporting Qualcomm"™s growing portfolio mobile phone platforms. The job involves working closely with partners and customers of Qualcomm to define the specifications of the mobile phone handset products, part selection, system design, design reviews, support while doing system debug, partner deliverables etc. As a member of Qualcomm customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in mobile, PC, and consumer electronics markets. Individual will be responsible to work closely with cross function teams in Qualcomm, including design engineering, systems engineering, characterization team, ATE test team, SW team, product marketing, program management and peers in customer engineering organization across multiple regions. Individual will be responsible to create chipset documentation, reference schematics, training material, application notes for worldwide customer support. Individual will be responsible to engage with customer designs, assist customers in feature definition and design reviews, provide in-depth technical responses to customer queries, do troubleshooting of customer designs and provide necessary training to customers. Past expertise in interacting with multiple teams in HW, SW domains, skills in Digital/Baseband and sound technical knowledge of Qualcomm PMICs are desirable. . Preferred Qualifications Sound understanding of LDO/SMPS - Must to have Experience on power management for portable devices will be a plus Strong understanding PCB Signal/power integrity "“ Should be comfortable reviewing schematic/suggest changes for improvement - Experience with Schematic entry will be a plus . Should be fluent with CAD tools like Allegro/PADs to review customer layout . Knowledge on crystals/Clocks - Must to have Knowledge on display backlighting schemes - Must to have Knowledge on LabVIEW/python "“ Will be a plus Experience on Analog and mixed signal bench validation "“ Will be a plus Knowledge on battery charging and Fuel gauge will be a plus Good communication skills Keywords Power Management, Applications, Analog, PMIC, SMPS, DC/DC Converter, Buck, Boost, LDO, charger, fuel gauge/gas gauge, LED driver, ADC, oscillator, amplifier, Educational Requirements Bachelor's or Masters in Electronics and/or Electrical Engineering with 3 -5 years of relevant industrial experience

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. The Power & Signal Integrity Group (PSIG) resides in the CHS (Central Hardware Systems) unit of Qualcomm Technologies, Inc., a leader in wireless communication technology. Engineers in the Power & Signal Integrity Group work with the various business units across Qualcomm to help bring leading edge mobile, AR\VR, IoT, Automotive and various others products to market. The candidate will work in a team-oriented environment with cross functional leads to provide electrical design expertise in the areas of signal integrity and power integrity for the design of wireless products and development systems. The engineer will be located in Bangalore, India and will be closely working with the Product architects, Platform HW teams, IO\PHY, IC Packaging, and other teams. The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Responsibilities Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 2+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models The following experience is a plus: DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Education Requirements: Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree preferred

Knowledge of Power tree build from schematics. Exposure to PI simulation tools. Should have experienced PI projects involving 100Amps load currents. Should have experience in handling Decoupling simulaitons. Capacitor equivalent findings to overcome the Power Integrity constraints.

Role & responsibilities • Defines design requirements and hardware specifications based on customer or user requirements. • Contributes to development and documentation of mechanical system architectures. • Creates and develops designs of complex mechanical assemblies, mechanisms, and component parts for electro-mechanical medical devices meeting performance objectives. • Adept knowledge on Plastics, Sheet metal & casting part designs as per mfg. guidelines. Strong knowledge on DFM, DFA is needed. • Good knowledge on drive mechanisms like gears, leadscrews, fluid mechanics • Performs in-depth mechanical analysis and calculations including tolerance analysis, load and fatigue life analysis, and thermal and heat transfer modeling to ensure consistent performance in safety critical applications. • Good knowledge & experience on FEA tools like Solidworks or( CAD TOOL,or Autocad onany one tool , Simulation, Abacus (Structural- Linear/Non-linear). • Ensures successful integration of mechanical design elements with electrical and consumable components. • Completes deliverables related to integration of designs from sub-system design teams and external partners. • Contributes to troubleshooting and problem solving efforts related to mechanical aspects of the design and interfaces with other design constituents. • Able to effectively transition products to manufacturing and ensure robust products and manufacturing processes. • Improves mechanical and electro mechanical designs to optimize for production, reliability, regulatory compliance and cost. • Resolves competing constraints between interrelated functions (engineering, purchasing, manufacturing, regulatory, marketing, etc.) required to deliver the product to market. • Defines protocols and conduct the necessary testing required to validate the safety and effectiveness of the design(s). Qualifications • A graduate or a postgraduate in Mechanical or related engineering and 8+ years related experience. Prior experience in the infusion pump domain is a plus. • A demonstrated track record in electromechanical hardware development, preferably medical devices or other highly regulated product domain such as aircraft/automotive/defense industries. • A proven track record of effectiveness in a fast-paced environment. • Knowledge and experience using CAD systems for mechanical design and analysis especially surface/solid modelling, Master modelling (Solidworks, preferred). • Knowledge of standards such as IEC 60601, ANSI and ASTM preferred. • Proven ability to create results within budget, timeline, and product/project deliverables.

Experience in the High-Speed Digital domain. Proficiency in signal and power integrity modeling and simulation using EDA tools such as ADS. Familiarity with scripting programming languages like Python. Email id- ta6@nippondata.com

About The Role Come join Intel's highly regarded Devices Development Group, responsible for creating Client SOCs. We envision the future of computing and design for the next generation of laptop and desktop computers. We are looking for a SoC Physical Design Engineer, who is ready to research, design, develop, and test lead Intel designs as we reimagine how to build SoCs at Intel and in the semiconductor industry. Our bold purpose as a company is to create world-changing technology that enriches the lives of every person on earth and this role is instrumental in furthering our mission to shape the future of technology. Your responsibilities may include but not be limited to: Performing physical design implementation of custom IP and SoC designs from RTL to GDS to create a design database that is ready for manufacturing. Physical Synthesis, Floor planning, Place and Route, Clock Tree Synthesis with Synopsys and/or Cadence EDA tools. Multiple Power Domain analysis and handling using standard Power Formats UPF or CPF. Verification and Signoff including Formal Equivalence Verification, Static Timing Analysis, Reliability Verification, Static and Dynamic power integrity, Layout Verification, Electrical rule checking, Noise analysis and Structural Design checking. Analyzes results and makes recommendations to fix violations for current and future product architecture. Participating in the development and improvement of physical design methodologies and flow automation. Driving performance optimization, including co-optimization, work with process teams, to create best-in-class designs. The ideal candidate should exhibit behavioral traits that indicate: Self-motivator with strong problem-solving skills. Excellent interpersonal skills, including written, verbal, and presentation communications. Attention to detail and organizational skills. Ability to work as part of a team and collaborate in a high-paced atmosphere. Qualifications BS/BTech degree with 12 years of experience, or MS/MTech degree with 10 years of experience, in Electronics Computer Engineering, or a related field. Preferred Qualifications: At least 10+ years of experience in physical design using industry EDA tools. Experience in Python/Perl/TCL programming languages Inside this Business Group The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.

About The Role Come join Intel's highly regarded Devices Development Group, responsible for creating Client SOCs. We envision the future of computing and design for the next generation of laptop and desktop computers. We are looking for a SoC Physical Design Engineer, who is ready to research, design, develop, and test lead Intel designs as we reimagine how to build SoCs at Intel and in the semiconductor industry. Our bold purpose as a company is to create world-changing technology that enriches the lives of every person on earth and this role is instrumental in furthering our mission to shape the future of technology. Your responsibilities may include but not be limited to: Performing physical design implementation of custom IP and SoC designs from RTL to GDS to create a design database that is ready for manufacturing. Physical Synthesis, Floor planning, Place and Route, Clock Tree Synthesis with Synopsys and/or Cadence EDA tools. Multiple Power Domain analysis and handling using standard Power Formats UPF or CPF. Verification and Signoff including Formal Equivalence Verification, Static Timing Analysis, Reliability Verification, Static and Dynamic power integrity, Layout Verification, Electrical rule checking, Noise analysis and Structural Design checking. Analyzes results and makes recommendations to fix violations for current and future product architecture. Participating in the development and improvement of physical design methodologies and flow automation. Driving performance optimization, including co-optimization, work with process teams, to create best-in-class designs. The ideal candidate should exhibit behavioral traits that indicate: Self-motivator with strong problem-solving skills. Excellent interpersonal skills, including written, verbal, and presentation communications. Attention to detail and organizational skills. Ability to work as part of a team and collaborate in a high-paced atmosphere. Qualifications BS/BTech degree with 8 years of experience, or MS/MTech degree with 6 years of experience, in Electronics Computer Engineering, or a related field. Preferred Qualifications: At least 8+ years of experience in physical design using industry EDA tools. Experience in Python/Perl/TCL programming languages Inside this Business Group The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.