91 Power Integrity Jobs

As an engineer, your involvement will be critical in the entire lifecycle of a product - right from ideation-development-production-deployment. Get to feel the sense of accomplishment that comes with creating something that solves a real and pressing problem and is used by scores of customers. Who are you You are an energetic and passionate PCB/CAD Design Engineer with a strong background in PCB layout design. You have experience working on high-speed and complex boards, and you excel at using CAD tools to create precise and efficient designs. Your expertise and enthusiasm drive you to tackle challenging projects and deliver high-quality results. Experience : 2+ Years Qualification : B.E/ B.tech/ M.E/ M.tech (EC, Electronics & Communication) OR MSc (EC/Electronics) Technical Skills Required : Good understanding of Datasheets, Library creation for Complex Logical and Footprints. IPC Standards for Footprint Creation and Layout process Exposure to all relevant IPC standards & MIL Standard design practices PCB Designing flow from Library creation to Gerber release to FAB. High speed Constraints setting and routing. Should have worked on High Speed signal routing . Hands-on experience in Designing High-speed, Multilayer PCB designs DFM checks,DFx (DFA, DFM & DFT) checks Should have hands-on expertise on standard High Speed Digital, Analog & Mixed signal Design ,I2C,SPI, USB2.0/3.0, Ethernet, PoE, BLE, Wi-fi, GSM, TFT LCD, DDR2/DDR3/DDR4, SD Card, NAND, MIPI ,Optical interface etc. DRC and Post-processing (Gerber Settings, FAB & Assembly files generation) Quality checks for Footprints, PCB Layout file,FAB & Assembly files Interaction with Design, Mechanical, SI, PI, Thermal, FAB, Assembly house for Clarification and Reviews Good communication skills and should be able to handle projects independently EDA Tools: Mentor Expedition. Valor Gerber tools for reviews How Your Day Might Look Like Check datasheets to update and create accurate PCB component libraries. Design and adjust PCB layouts following industry standards. Handle the entire PCB design process, from creating libraries to preparing files for manufacturing. Set up and test high-speed signals to ensure everything works properly. Work on complex, multilayer PCB designs, focusing on signal integrity and layout. Perform Design for Manufacturing (DFM) checks to make sure designs are ready for production. Check design rules and finalize files for fabrication and assembly. Review and verify designs with design, mechanical, signal integrity, power integrity, thermal, and assembly teams. Manage your projects, making sure everything stays on track from start to finish. What we offer Opportunity to work for an Indian Tech Company creating incredible products for the world, right from India Be part of a challenging, encouraging, and rewarding environment to do the best work of your life Competitive salary and other benefits Generous leave schedule of 21 days in addition to 9 public holidays, including holiday adjustments to convert weekends into long weekends 5-day workweek with 8 flexi-days months, allowing you to take care of responsibilities at home and work Company-paid Medical Insurance for the whole family (Employee+Spouse+Kids+Parents). Company paid Accident Insurance for the Employee On-premise meals, subsidized by the company If you are an Innovative Tech-savvy individual, Look no further. Click on Apply and we will reach out to you soon!

Role Overview: As a Hardware Engineering Intern at Google, you will be part of a team shaping the future of Google Cloud Silicon, including TPUs, Arm-based servers, and network products. You will collaborate with hardware and software architects and designers to architect, model, analyze, define, and design next-generation Cloud Silicon. Your responsibilities will be dynamic and multi-faceted, focusing on product definition, design, and implementation. You will work closely with Engineering teams to achieve the optimal balance between performance, power, features, schedule, and cost. Key Responsibilities: - Work with hardware and software architects and designers to architect, model, analyze, define, and design next-generation Cloud Silicon - Collaborate with Engineering teams to drive the optimal balance between performance, power, features, schedule, and cost - Have responsibilities in areas such as product definition, design, and implementation - Contribute to shaping the future of Google Cloud Silicon, including TPUs, Arm-based servers, and network products Qualifications Required: - Currently pursuing a PhD degree in Computer Engineering, Computer Science, Electronics and Communication Engineering, Electrical Engineering, or a related technical field - Experience in Hardware System Integration, Signal and Power Integrity, System Validation, Wireless Communications, Product Design, Computer Architecture, Digital Design Verification, Digital Circuits, ASIC Physical Design, FPGAs, Embedded Systems, Memory Systems - Experience in programming languages such as C++, Python, Verilog, UVM, Synopsys, and Cadence tools - Experience with wireless communication interfaces and sensors - Experience with performance modeling tools, C++, Python, Silicon design tools in Front End/Design Verification/Physical Design - Knowledge of arithmetic units, bus architectures, accelerators, or memory hierarchies, computer architecture, linear algebra, ML/DL background - Knowledge of high performance and low power design techniques - Currently attending a degree program in India and available to work full time for 12 weeks outside of university term time Additional details of the company: Google is an engineering company that prioritizes security, efficiency, and reliability. The ML, Systems, and Cloud AI (MSCA) organization at Google designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all Google services. Their end users are Googlers, Cloud customers, and people who use Google services around the world. The company focuses on developing the latest Cloud Si products and running a global network while driving towards shaping the future of hyperscale computing. Google engineers work on various technical challenges to make an impact on millions of users and revolutionize technology. (Note: The section "Additional details of the company" has been included based on the information provided in the job description),

Good understanding of signal integrity and power integrity principles Signal integrity extraction/3D models generation experience Cadence, HFSS and Siemens Advanced Solvers Expertise in circuit simulation with different tools such as Hspice, ADS, Cadence TopXp System level SI simulation using simulation tools Tools Used : Cadence PowerSI/ Agilent ADS/ Siemens Advanced Solver/Allegro SIP/Ansys SI wave, HFSS Expertise in circuit simulation with different tools such as Hspice and ADS. Experience Requirements 5-7 years of experience in SI/PI area Experience in board/package design SI/PI analysis Proven ability to use modern tools for S-parameter extraction of board/package Additional skills Programming language perl, tcl Ability to work in multi team environment

Physical Deisgn Lead Location: Bangalore / Hyderabad / Pune Experience - 8+ YoE In-depth knowledge and hands-on experience on Netlist2GDSII Implementation i.e. Floor planning, Placement, CTS, Routing, STA, Power Integrity Analysis, Physical Verification. Should have experience on Physical Design Methodologies and submicron technology of 28nm and lower technology nodes. Should have experience on programming in Tcl/Tk/Perl. Must have hands-on experience on Synopsys/Cadence tools. (Innovus, ICC2, Primetime, PT-PX, Calibre). Well versed with timing constraints, STA and timing closure. Should have experience on Physical Design Methodologies and submicron technology of 28nm and lower technology nodes. Should have experience on programming in Tcl/Tk/Perl Well versed with timing constraints, STA and timing closure. Mandatory Skills: VLSI Physical Place and Route. Experience: 5-8 Years.

We aspire to be world-leader in innovative telecom and security solutions by offering cutting-edge, high-performance telecom and security solutions to business customers. Why work at Matrix Matrix fully integrates software and hardware across its products. Engineers here collaborate more effectively to create solutions that solve real problems and make an impact. We are responsible for every nut, bolt, and line of code in our products! As an engineer, your involvement will be critical in the entire lifecycle of a product - right from ideation-development-production-deployment. Get to feel the sense of accomplishment that comes with creating something that solves a real and pressing problem and is used by scores of customers. About The Role Role Hardware Design Engineer/ Sr. Engineer - (PCB/ CAD) Function Hardware Design - (PCB/ CAD) Work Location Vadodara, Gujarat Who are you You are an energetic and passionate PCB/CAD Design Engineer with a strong background in PCB layout design. You have experience working on high-speed and complex boards, and you excel at using CAD tools to create precise and efficient designs. Your expertise and enthusiasm drive you to tackle challenging projects and deliver high-quality results. Experience 2+ Years Qualification B.E/ B.tech/ M.E/ M.tech (EC, Electronics & Communication) OR MSc (EC/Electronics) Technical Skills Required : Good understanding of Datasheets, Library creation for Complex Logical and Footprints. IPC Standards for Footprint Creation and Layout process Exposure to all relevant IPC standards & MIL Standard design practices PCB Designing flow from Library creation to Gerber release to FAB. High speed Constraints setting and routing. Should have worked on High Speed signal routing . Hands-on experience in Designing High-speed, Multilayer PCB designs DFM checks,DFx (DFA, DFM & DFT) checks Should have hands-on expertise on standard High Speed Digital, Analog & Mixed signal Design ,I2C,SPI, USB2.0/3.0, Ethernet, PoE, BLE, Wi-fi, GSM, TFT LCD, DDR2/DDR3/DDR4, SD Card, NAND, MIPI ,Optical interface etc. DRC and Post-processing (Gerber Settings, FAB & Assembly files generation) Quality checks for Footprints, PCB Layout file,FAB & Assembly files Interaction with Design, Mechanical, SI, PI, Thermal, FAB, Assembly house for Clarification and Reviews Good communication skills and should be able to handle projects independently EDA Tools: Mentor Expedition. Valor Gerber tools for reviews How Your Day Might Look Like Check datasheets to update and create accurate PCB component libraries. Design and adjust PCB layouts following industry standards. Handle the entire PCB design process, from creating libraries to preparing files for manufacturing. Set up and test high-speed signals to ensure everything works properly. Work on complex, multilayer PCB designs, focusing on signal integrity and layout. Perform Design for Manufacturing (DFM) checks to make sure designs are ready for production. Check design rules and finalize files for fabrication and assembly. Review and verify designs with design, mechanical, signal integrity, power integrity, thermal, and assembly teams. Manage your projects, making sure everything stays on track from start to finish. What we offer Opportunity to work for an Indian Tech Company creating incredible products for the world, right from India Be part of a challenging, encouraging, and rewarding environment to do the best work of your life Competitive salary and other benefits Generous leave schedule of 21 days in addition to 9 public holidays, including holiday adjustments to convert weekends into long weekends 5-day workweek with 8 flexi-days months, allowing you to take care of responsibilities at home and work Company-paid Medical Insurance for the whole family (Employee+Spouse+Kids+Parents). Company paid Accident Insurance for the Employee On-premise meals, subsidized by the company If you are an Innovative Tech-savvy individual, Look no further. Click on Apply and we will reach out to you soon!

As a Senior Engineer, Package Design based in Milpitas, CA, you will primarily focus on signal and power integrities analyses and routing analyses of package substrates. You will report to the Director of Package Design in the USA and collaborate closely with the Package design team at our parent company's headquarters in Japan, as well as with the Marketing and Engineering teams based in Milpitas during the pre/post sales process. Your role will require a comprehensive understanding of package technology and design, particularly in areas such as high-performance build-up substrates, flip chip assembly, and 2.5D packaging. Proficiency in extracting/simulating package designs for Signal and Power integrities using tools like HFSS and/or ADS tools is crucial for this position. To qualify for this role, you should hold a Bachelor's degree in Electrical Engineering or a related semiconductor packaging discipline, with a preference for candidates with a Master's degree. You must have 8 to 10 years of experience in semiconductor packaging design, modeling, extraction, and simulations, along with a proven track record of success in a cross-functional team environment. Ideal candidates will possess hands-on experience in high-speed signal integrity and power integrity, package decoupling caps optimizations, PCB design, and routing analyses. Proficiency in high-speed Serdes, PCIe, LPDDR, and Ethernet technologies, as well as expertise in time domain analyses, jitter budgeting, and multi-physics electro-thermal analysis, will be advantageous. Additionally, familiarity with package manufacturing and assembly rules, chip and package reliability analyses, die+Pkg+pcb PDN model time and frequency, IR drop, and CPM die model using Redhawk are desirable skills for this role. Strong presentation and communication skills, the ability to work with Package Layout engineers, and a collaborative approach to problem-solving are also essential for success in this position.,

As a Hardware Design Engineer, you will be responsible for working in a team environment to capture hardware requirements and create hardware designs. Your role will involve leading circuit design, schematic net-list design, and layout design based on various technical aspects such as electrical guidance, signal integrity, power integrity, ID and mechanical integrity, EMC and safety standards, manufacturing industry specifications, and end-user usability requirements. Additionally, you will be tasked with creating and managing PCB documentation, including fabrication and assembly drawings, as well as Gerber files. You will also be required to prepare Bills of Materials (BOM) and fabrication documentation while following revision control procedures. Your expertise will be essential in assisting with the fabrication, bring-up, and testing of the PCB. To qualify for this role, you should hold a Bachelor's degree in Electrical or Electronics Engineering. In addition, you must have experience working with Altium, Cadence, or KiCad PCB & Integrity Software Products. Proficiency in designing 8+ layer PCBs will be a significant advantage for this position.,

You are an experienced PCB Design Engineer with 2-6 years of experience in designing schematic and PCB layout for automotive products. You will be collaborating with electrical engineers to create schematics and build part libraries following IPC standards. Your role involves designing high-quality PCB layouts, communicating with HW and mechanical engineering departments, and conducting design reviews to ensure best practices are implemented. Your responsibilities also include generating Gerber files, assembly drawings, and documentation for manufacturing, working with vendors for PCB fabrication and assembly, and optimizing designs for performance and cost. You will be performing electrical testing and troubleshooting, staying updated on industry trends, and conducting design feasibility studies to identify trade-offs on packaging, cost, manufacturing, and system performance. To qualify for this position, you should have a Bachelor's or Master's degree in Electrical/Electronics Engineering, Computer Engineering, or a related field. You must have 2-6 years of experience in PCB design using ORCAD, with a strong understanding of PCB layout techniques, signal integrity, power integrity, thermal considerations, and EMC/EMI considerations. Experience with high-speed digital design and RF/microwave PCB layouts is a plus. Familiarity with industry standards, manufacturing processes for PCB fabrication and assembly, impedance-controlled circuits, layer stack-up trade-offs, and panel optimization is required. Knowledge of IPC standards, IPC certification, DFx standards, and signal/power integrity tools like Hyperlynx are advantageous. Strong problem-solving skills, attention to detail, and excellent communication and collaboration skills are essential for this role.,

Job Posting TitlePRINCIPAL R&D/PRODUCT DVL ENGINEER Business UnitDIGITAL DATA NETWORKS (50461863) BuildingSahasra Shree (N84) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Product Development Engineer for TE Connectivity, you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Roles and Responsibilities: Responsibilities: Subject matter expert in high-speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing and verify SI test results Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelors degree in electrical or electronicsengineering, masters degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high-speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Knowledge on power integrity and PDM analysis is added advantage. Experience with signal conditioning techniques (equalization, amplification, FIRs, CTLEs) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high-speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies

Job Posting TitlePRINCIPAL R&D/PRODUCT DVL ENGINEER Business UnitDIGITAL DATA NETWORKS (50461863) BuildingSahasra Shree (N84) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Product Development Engineer for TE Connectivity, you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Roles and Responsibilities: Responsibilities: Subject matter expert in high-speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing and verify SI test results Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelors degree in electrical or electronicsengineering, masters degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high-speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Knowledge on power integrity and PDM analysis is added advantage. Experience with signal conditioning techniques (equalization, amplification, FIRs, CTLEs) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high-speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies

As a Sr. Signal & Power Integrity Engineer at AjnaLens in Thane (Maharashtra-India), you will be an integral part of the Electronics R&D team. We are seeking highly motivated individuals who thrive in a dynamic team environment. The ideal candidate will possess a diverse skill set and be driven to solve complex problems with simple solutions. Your primary focus will be on designing and simulating high-speed signal interfaces and power distribution networks for advanced SoC packages, interfaces such as USB 3.0, MIPI CSI-2, MIPI DSI-2, LPDDR3/LPDD4/LPDDR5, PCIe, and eMMC, as well as PCBs. Your daily tasks will include simulating, testing, and evaluating new designs to ensure compliance with Electronics specification requirements, as well as conducting Pre and Post layout SIPI analysis. A minimum of 5 years of experience in SI/PI Background and a Bachelor's or Master's Degree in Electronics/Electrical Engineering, Physics, or Mathematics are required. Hands-on experience in Thermal simulation would be advantageous. Key skills required for this role include a strong understanding of Signal Integrity and Power Integrity fundamental concepts, electromagnetic theory, transmission line theory, I/O design, timing budgets, jitter analysis, signal integrity, S-parameter modeling, and differential and single-ended interface technologies. You should also have experience in designing and simulating signal and power integrity solutions for high-speed system components, as well as analyzing high-speed single-ended or differential buses. Additionally, hands-on experience with electronic test equipment such as Oscilloscope, Power Supply, Functional generator, Logic analyzer, VNA, signal generator, and spectrum analyzer is necessary. Proficiency in simulation tools like Hyperlynx, Flowtherm, Sigrity, Ansys SIwave, and thermal simulation tools would be advantageous. In this role, you will be expected to make data-driven decisions, adapt quickly to new requirements, support in Pre-compliance tests, and contribute to the development of new technologies in AR/VR/MR products.,

TechShlok is expanding its design team and looking to add a PCB Design Engineer to the R&D unit to accelerate the development across multiple projects. As a PCB Design Engineer at TechShlok, your main responsibility will be to perform end-to-end PCB layout, including component placement, routing, and generating manufacturing files. You will design multi-layer boards (4 layers and above) with adherence to industry standards, signal integrity, and EMI/EMC best practices. It is essential to ensure optimal routing of high-speed signals (e.g., DDR, PCIe, USB, high-speed LVDS) and differential pairs. You will also be responsible for generating comprehensive documentation, including Gerber files, assembly drawings, and BOMs. Collaboration with cross-functional teams (electrical, mechanical, and test engineers) is crucial to align design requirements and constraints. Effective communication with fabrication and assembly vendors to address DFM (Design for Manufacturability) and DFT (Design for Test) issues is required. During your first 30 days at TechShlok, you will complete onboarding, learn team workflows, and familiarize yourself with PCB design tools, libraries, and version control. You will review existing designs, standards, and DFM/DFT guidelines, and assist in simple board modifications under senior guidance. In the next 30 days (Day 31-60), you will take on a small-to-medium complexity PCB design project, participate in design reviews, refine routing and stack-up skills, and engage with manufacturing partners for DFM insights. You will also focus on enhancing workflow efficiency and documentation methods. During the final 30 days (Day 61-90), you will independently handle a complex 4-layer board design project, collaborate with QA/testing to ensure reliability and testability, recommend improvements in processes and design tools, and contribute to the technical strategy while mentoring junior team members. The ideal candidate for this role should have a Bachelor's degree in Electronics Engineering or a related field, 3 to 5 years of experience in PCB designing, proficiency in tools like Kicad, Eagle, or Altium, and a strong understanding of PCB stack-up design, impedance control, and high-speed routing constraints. Familiarity with IPC standards and best practices for PCB fabrication and assembly, excellent written and verbal communication skills, and the ability to collaborate effectively in a cross-functional team setting are essential. Experience working with various PCB materials and advanced technologies, familiarity with power distribution network analysis and thermal management techniques, and exposure to simulation tools for signal integrity and EMI/EMC considerations are considered good-to-have skills.,

You should have a Bachelor of Science degree in Electrical Engineering or an equivalent qualification from an ABET accredited university. Your experience should include working on the layout of high-speed PCBs and routing interfaces such as DDR3/4 memory, PCIe, etc. It is essential for you to be proficient in using schematic capture tools like Altium Designer, OrCAD, Cadence Concept, Mentor, etc. Additionally, experience in Mentor Hyperlynx for Signal Integrity & Power Integrity tools or similar software is highly desirable. Being able to collaborate effectively within a team and across a complex global organization is crucial for this role. You should possess strong oral and written communication skills and have the ability to influence outcomes and drive initiatives in challenging environments.,

The Staff Signal and Power Integrity Engineer position at Lattice in India requires a candidate with an MS or PhD in Electrical Engineering and a minimum of 6 years of recent Signal Integrity experience. The responsibilities include performing pre-layout and post-layout simulations, executing SI/PI/EMC design optimization, developing system integration design guidelines, creating simulation models, and using simulation data for troubleshooting and proposing corrective actions. The qualified candidate must have expertise in package level signal and power integrity, package-level system architecture, I/O structures & topologies, and experience with signal integrity modeling tools such as Ansys HFSS and simulation software like Agilent ADS. Strong communication skills are essential as the role involves interaction with engineers from different disciplines and management. Lattice is a global community of engineers, designers, and manufacturing specialists dedicated to developing programmable logic solutions that drive industry innovation. The company values employee contributions and offers a competitive compensation and benefits program to attract and retain top talent. As a service-driven developer of low-cost, low-power design solutions, Lattice emphasizes customer success and a commitment to excellence. For more information about Lattice's products and services, visit www.latticesemi.com. Lattice fosters a diverse and inclusive workplace where all qualified candidates are encouraged to apply for available positions. Feel the energy at Lattice.,

Role & responsibilities High-Speed PCB Design: Develop PCB layouts for high-speed systems, including DDR, PCIe, USB, Ethernet, and other high-frequency interfaces. Signal and Power Integrity: Perform signal and power integrity analysis to ensure optimal design performance. Layer Stack-up Design: Define PCB stack-ups and impedance-controlled designs for high-speed and high-density applications. Simulation and Validation: Use simulation tools to validate designs for crosstalk, impedance matching, and high-speed signals. Component Placement and Routing: Optimize placement and routing strategies to meet performance, manufacturability, and cost requirements. Design for Manufacturing (DFM) and Test (DFT): Collaborate with fabrication and assembly teams to ensure manufacturability and testability of designs. Documentation: Generate detailed design files, BOMs, and fabrication documentation. Compliance: Ensure designs adhere to industry standards (e.g., IPC-6012, ISO 9001) and regulatory requirements. Collaboration: Work closely with hardware, firmware, and system engineering teams to meet project requirements. Preferred candidate profile Bachelors degree in Electrical Engineering, Electronics, or a related field. 3+ years of experience in PCB design with a focus on high-speed digital and RF designs. Expertise in Altium for PCB Design Strong knowledge of signal integrity, power integrity, and EMI/EMC design principles. Proficiency in high-speed interfaces (DDR3/DDR4/DDR5, PCIe, SerDes, etc.). Familiarity with simulation tools like HyperLynx, Ansys, or SIwave for signal and power integrity analysis. Hands-on experience with impedance-controlled designs and differential pair routing. Solid understanding of PCB fabrication and assembly processes.

As an Engineer in the Signal Integrity team at Micron Technology, you will play a crucial role in supporting all current and future product development, encompassing a wide range of memory and storage solutions. Your responsibilities will involve working on various aspects of Signal Integrity (SI) and Power Integrity (PI) for high-speed interfaces, including modeling at silicon, package, and board levels. You will conduct time and frequency domain analysis for SI and PI electrical performance evaluation of Micron products, correlating them with measurements. It is essential to ensure the effective and accurate execution of processes for different methodologies and collaborate with teams within the global Signal Integrity Research and Development (SI R&D) group for continuous optimization. Your role will also include representing the SI R&D team in technical cross-functional collaborative groups and integrating with various departments to ensure overall product performance. Additionally, you will occasionally provide support to FAEs, applications engineers, and engage in path-finding activities through modeling support. Successful candidates for this position should hold a Bachelor's or Master's degree in Electrical/Electronics Engineering with 8-15 years of industry experience. You must have a strong background in SI/PI/EMI theory and application, along with experience in using E.M. field solvers and simulation tools. Deep understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, and timing budgets is required. Expertise in PCB layout or electrical package design techniques, as well as experience in designing high-speed single-ended or differential buses, are essential. Familiarity with lab measurement equipment and statistical analysis tools is beneficial. Moreover, candidates with Memory industry experience will be highly desirable. Ambitious candidates who enjoy taking ownership of projects, possess excellent written and verbal communication skills, and can work effectively in a team environment are encouraged to apply. Successful candidates for this position will be proactive in identifying gaps and opportunities, collaborating effectively with global teams, and communicating complex issues and solutions clearly in written and verbal formats. Micron Technology, Inc. is a leader in innovative memory and storage solutions, dedicated to transforming how information enriches lives globally. With a focus on technology leadership, operational excellence, and customer-centric approach, Micron offers a diverse portfolio of high-performance memory and storage products. The relentless innovation and dedication of Micron's team drive advancements in artificial intelligence and 5G applications, shaping the data economy and unlocking opportunities across various sectors. For more information, please visit micron.com/careers. If you require assistance during the application process or need reasonable accommodations, please contact hrsupport_india@micron.com. Micron strictly prohibits the use of child labor and adheres to all applicable laws, rules, regulations, and international labor standards.,

As a PCB Engineer with Zuken experience, you will be responsible for designing and developing complex multilayer PCBs for electronic products. With at least 6 years of experience in PCB design, including high-speed digital and mixed-signal designs, you will bring expertise in high-speed, mixed-signal design, power board, and RF board design for single, double, multilayer, and Flex PCBs. Your role will involve creating PCB footprints and symbols, monitoring and reviewing library deliverables, and taking ownership of schematics design, library, multi-layer PCB layout, BOM generation, until Gerber release. You will collaborate with hardware engineers to understand design requirements and constraints, ensuring signal integrity, power distribution, and thermal management considerations are met. A good understanding of PCB manufacturing processes, industry standards, DFM, DFA, and best design practices will be essential for success in this role. You will work closely with manufacturing partners to facilitate a seamless transition from design to production, conducting design reviews and implementing improvements based on feedback and analysis. Proficiency in PCB design software such as Cadence Allegro, Mentor Graphics PADs Layout, CAM350, Hyperlynx Signal Integrity, Power Integrity, and thermal analysis tools is required. Your problem-solving and communication skills will be crucial in a fast-paced, collaborative environment. It is important to stay updated with the latest PCB design tools, technologies, and industry trends. Additionally, having basic knowledge of mechanical design tools like AutoCAD and SolidWorks will be beneficial. If you hold a B.E./B.Tech./Diploma in Electronics and Communication, Electronics, and are looking to leverage your expertise in PCB design and engineering, this role offers an opportunity to contribute as an individual contributor and make a significant impact in the field.,

Job Title: PCB Design Engineer Job Summary: We are seeking a skilled PCB Design Engineer to join our team. The ideal candidate will be responsible for designing and developing high-quality multi-layer PCB layouts while collaborating with hardware engineers, embedded engineers, and manufacturing teams. This role requires expertise in PCB design software, signal integrity analysis, and knowledge of industry standards. Key Responsibilities: Design, develop, and optimize PCB layouts for electronic circuits, ensuring compliance with electrical and mechanical requirements. Work closely with hardware engineers to understand circuit design requirements and convert schematics into PCB layouts. Perform component placement, routing, and optimization to ensure signal integrity, power distribution, and thermal management. Generate and review Gerber files, Bill of Materials (BOM), and assembly drawings for manufacturing. Conduct Design for Manufacturability (DFM) and Design for Testability (DFT) reviews to ensure quality and ease of production. Collaborate with vendors and PCB manufacturers to resolve fabrication and assembly-related issues. Perform signal integrity, power integrity, and electromagnetic interference (EMI/EMC) analysis to meet design specifications. Develop and maintain PCB design documentation, design guidelines, and best practices. Participate in prototyping, testing, and debugging of PCB designs to validate performance and reliability. Stay up to date with industry trends, standards, and advancements in PCB design technology. Required Skills and Qualifications: Bachelor&aposs or Masters degree in Electronics Engineering, Electrical Engineering, or a related field. 3+ years of experience in PCB design and layout for analog, digital, and mixed-signal circuits. Proficiency in PCB design software like Altium Designer, Cadence Allegro/OrCAD, Eagle, or KiCad. Strong understanding of signal integrity, power integrity, and EMI/EMC considerations in PCB design. Experience with high-speed PCB design, RF circuits, and multi-layer PCB design. Familiarity with IPC standards (IPC-2221, IPC-7351, IPC-A-600, IPC-A-610) and PCB manufacturing processes. Hands-on experience with schematic capture, component libraries, and PCB footprint creation. Knowledge of flex PCBs, HDI PCBs, and rigid-flex PCBs is a plus. Strong problem-solving skills and ability to work in a team-oriented environment. Preferred Qualifications: Experience with automotive, aerospace, medical, or industrial PCB designs. Knowledge of embedded systems, microcontrollers, and FPGA-based designs. Hands-on experience with hardware debugging, soldering, and PCB rework. Understanding of thermal simulation and mechanical constraints in PCB design. Show more Show less

Job Summary: We are seeking a highly skilled and detail-oriented PCB Design Engineer with extensive experience in industrial product design and development involving electronic circuits. The ideal candidate will be responsible for developing, validating, and supporting PCB designs from concept through to manufacturing. You will collaborate closely with cross-functional teams to ensure seamless integration and performance of electronic systems. Key Responsibilities: Design Creation: Develop and optimize schematic diagrams and PCB layouts using industry-standard CAD tools. Ensure proper component placement, routing, and adherence to signal integrity and design best practices. Design Validation: Conduct design rule checks (DRC), layout vs. schematic (LVS) verification, and validate designs using simulation tools. Troubleshoot and resolve design issues to ensure first-pass success. Cross-Functional Collaboration: Work with hardware, firmware, and mechanical engineering teams to translate system requirements into functional PCB designs. Manufacturing Support: Prepare and release comprehensive design documentation including Gerber files, Bill of Materials (BOM), assembly drawings, and specifications. Support prototype builds and transition to production. Documentation & Continuous Improvement: Maintain thorough design documentation. Evaluate existing designs and processes, suggesting improvements for performance, cost, and manufacturability. Mandatory Skills: Expertise in OrCAD Schematic Capture Proficiency in PCB layout tools such as: Mentor Graphics (PADS/Xpedition) Cadence Allegro Strong understanding of electronic circuit design , signal integrity, EMC/EMI considerations, and DFM/DFT principles. Preferred Tools & Technologies: Altium Designer (Added Advantage) MS Office Suite for documentation and reporting Familiarity with simulation tools for electrical validation Key Attributes: Strong analytical and problem-solving skills Attention to detail and quality-oriented approach Effective communication and teamwork abilities Capability to handle multiple projects in a fast-paced environment

As a Senior/Lead Hardware Engineer at Prodigy Technovations, you will have the opportunity to design innovative and high-performance next-generation Protocol Analyzer products for the semiconductor industry. In this role, we are seeking candidates who excel in a fast-paced startup-like environment and will be involved in all aspects of the hardware design life cycle. This includes high-speed board design, R&D, proof of concept designs, and validation. To qualify for this position, you should hold a Bachelor's or Master's degree in Electrical/Electronics/Communication Engineering or a related field from a reputable institute. Additionally, you should have 4 to 8 years of board design experience from any product-based organization. Proficiency in high-density/high-speed design, including FPGAs, SerDes, PCIe Gen4/Gen5, UFS 4.0, 10/100 GigE, CPHY/DPHY, USB 3.2, and experience in interfacing high-speed memories such as DDR4/5, RDIMM, SODIMM Modules, is required. Your responsibilities will also include system integration, schematic and layout using industry-standard capture and design packages like spice, Altium, or Cadence. Hardware validation, troubleshooting, board bring-up, and proficiency in using high-end laboratory equipment are essential skills for this role. You should be an outstanding team player with strong interpersonal and communication skills to collaborate effectively with RTL, SW, and quality engineers to integrate and debug system-level issues. Preferred qualifications for this role include experience in signal integrity and power integrity, high-speed board design concepts, hands-on signal integrity analysis, PI, and high-speed analog simulation using tools such as HFSS, SIwave, ADS, and Hyperlynx. Experience with 33GHz and 50GHz Oscilloscopes and GHz pattern generators for protocol capture, timing, and eye diagram analysis is a plus. At Prodigy Technovations, we are committed to fostering a workplace that celebrates diversity in all its forms. We believe that diverse teams drive innovation, creativity, and success. Our goal is to create an inclusive environment where all employees feel valued and respected. If you are looking to be part of an organization that drives innovation in the semiconductor landscape and offers challenging opportunities in hardware design, Prodigy Technovations is the place for you. Join us in shaping the future of advanced protocol validation solutions and be a part of our dedicated team of engineers.,

About The Role At Boeing, we innovate and collaborate to make the world a better place. Were committed to fostering an environment for every teammate thats welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us. Overview As a leading global aerospace company, Boeing develops, manufactures and services commercial airplanes, defense products and space systems for customers in more than 150 countries. As a top U.S. exporter, the company leverages the talents of a global supplier base to advance economic opportunity, sustainability and community impact. Boeings team is committed to innovating for the future, leading with sustainability, and cultivating a culture based on the companys core values of safety, quality and integrity. Technology for today and tomorrow The Boeing India Engineering & Technology Center (BIETC) is a 5500+ engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global markets, and leverage new-age technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive Manufacturing, shaping the future of aerospace. People-driven culture At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring together different perspectives and thoughts- enabling every voice to be heard and every perspective to be respected. No matter where or how our teammates work, we are committed to positively shaping peoples careers and being thoughtful about employee wellbeing. With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace. Position Overview Boeing India Engineering has an immediate opening for an Associate Electronics RF Design and Analysis Engineer to work in areas of RF design. This position offers a unique opportunity to work complex technical challenges in support of safety operation and return to service. This role will be based out of Bangalore, India. Position Responsibilities Responsible for RF and mixed signal designs. Design and simulate RF circuits for cellular modules including LNAs, filters, Diplexers, switching and matching networks. Perform testing and validation of RF components and systems - RF amplifiers, filters, and antennas - to validate performance against specifications. Perform RF validation, tuning, and debugging using tools such as VNA, spectrum analyzers, and signal generators Perform simulation of filters and antenna synthesis using tools like Ansys HFSS Perform circuit design, requirements and interface definition and design verification. Design to meetEMI/EMC, safety and environmental compliance. Develop and optimize RF systems supporting Wifi,4G LTE and 5G. Execute testing of designs in Labs for functional, performance and stress environments apart from system integration Basic Qualifications (Required Skills and Experience) Bachelors or Masters Degree is required as a basic qualification in Electronics and Communication Engineering with 4 to 8 years of relevant experience. Preferred Qualifications (Desired Skills/Experience) Candidate should have experience in RF Design integration capabilities for Wireless communications and 5G integration Candidate should have strong experience in high-speed design clocking, Ethernet/Serdes/MIPI designs Candidate should have strong experience in knowledge of using simulation tools like SABER RD and creating simulation models with MATLAB and SABER Candidate should have experience with Power Integrity analysis, Hyperlynx SI and Mentor suite of eCAD tools Candidate should have basic knowledge of cellular and Wi-Fi standards Relocation This position does offer relocation within INDIA. Applications for this position will be accepted until Aug. 29, 2025 Export Control Requirements This is not an Export Control position. Education Bachelor's Degree or Equivalent Required Relocation This position offers relocation based on candidate eligibility. Visa Sponsorship Employer will not sponsor applicants for employment visa status. Shift Not a Shift Worker (India) Equal Opportunity Employer: We are an equal opportunity employer. We do not accept unlawful discrimination in our recruitment or employment practices on any grounds including but not limited to; race, color, ethnicity, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military and veteran status, or other characteristics covered by applicable law. We have teams in more than 65 countries, and each person plays a role in helping us become one of the worlds most innovative, diverse and inclusive companies. We are proud members of the Valuable 500 and welcome applications from candidates with disabilities. Applicants are encouraged to share with our recruitment team any accommodations required during the recruitment process. Accommodations may include but are not limited toconducting interviews in accessible locations that accommodate mobility needs, encouraging candidates to bring and use any existing assistive technology such as screen readers and offering flexible interview formats such as virtual or phone interviews.

About The Role At Boeing, we innovate and collaborate to make the world a better place. Were committed to fostering an environment for every teammate thats welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us. Overview As a leading global aerospace company, Boeing develops, manufactures and services commercial airplanes, defense products and space systems for customers in more than 150 countries. As a top U.S. exporter, the company leverages the talents of a global supplier base to advance economic opportunity, sustainability and community impact. Boeings team is committed to innovating for the future, leading with sustainability, and cultivating a culture based on the companys core values of safety, quality and integrity. Technology for today and tomorrow The Boeing India Engineering & Technology Center (BIETC) is a 5500+ engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global markets, and leverage new-age technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive Manufacturing, shaping the future of aerospace. People-driven culture At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring together different perspectives and thoughts- enabling every voice to be heard and every perspective to be respected. No matter where or how our teammates work, we are committed to positively shaping peoples careers and being thoughtful about employee wellbeing. With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace. Position Overview The Boeing Company is seekingfor an Experienced Electronics Design and Analysis Engineer. Boeing India Engineeringoversees the design, development, manufacture, integration and testing of LRU designs for various Avionics systems. This position is located in Bangalore, Karnataka. Your dreams go beyond Planet Earth. You are innovative, creative, and challenge the status quo. You work well in teams while also having the ability to work assignments autonomously. Here at Boeing India Engineering you will collaborate with leaders inelectronics innovation and pave the way in creating the worlds best avionics solutions. Primary Responsibilities: Leads Card Design and development of state-of-the art electronics using DO254 processes and necessary documentation for the same. Duties will be architecting and creating Hardware design and verification plans, detailed design, requirements decomposition and testing and integration of hardware. Setup, review and release Hardware Design Plan, Hardware Validation Plan, Hardware Verification Plan and align them to Plan for Hardware Aspects of Certification Responsible fordigital design, timing, worst case circuit analysis, and communications systems Ability to simplify circuits containing flash, processors, FPGAs and memories to explain the underlying concepts clearly Develop architecture with circuits involving SERDES, Audio-Video and Intel architectures Develop high speed interface-based circuit designs and work with mechanical teams for thermal analysis and electromechanical packaging. Basic Qualifications (Required Skills and Experience) Bachelor's in engineeringdegree or higher 10or more years' in Electrical Engineering experience Experience with digital board design Preferred Qualifications (Desired Skills/Experience): Defined Hardware Design workflow with integration of PLDs and its usage in DO254 life cycle Experience on processor-based architectures and design interfaces. Experience as a design architect to contribute towards safety and reliability design and analysis requirements Electromagnetic Interference (EMI)Analysis experience. Good understanding of grounding and shielding concepts, chassis design. Experience managing component/system level-electronics design and development Design and Testing of DDR3/4, PCIe gen3, USB3, LPDP, MIPI, SATA, Ethernet and I2C/SPI/UART buses Selection of components to be used in Avionics Electronics Designs, like but not limited to, DDR, memory, storage media flash, ethernet controllers. Good understanding of ARINC 429, ARINC 818 and MIL 1553. Experience with Power Integrity analysis, Hyperlynx SI, Timing Analysis. Experience with Mentor suite of eCAD tools Experience with Manufacturing of Electronic Assemblies (manufacturing readiness assessments, Rapid Prototyping, dfmat, electronics manufacturing) Preferred to have candidates who have knowledge upon high reliability system designs (redundancy, single event failures, safety flow analysis and similar concepts) Experience and development and certification to DO-160, DO-254, MIL-STD 810 Experience in Giving inputs and accepting designs for electromechanical packaging, reviewing concepts like thermal, structural, interference, CG, material, human factor analysis outputs. Basic understanding on electronic manufacturing processes which include PCB fabrication, component assembly, ICT, FCT, EOL etc. Typical Education & Experience: Degree and typical experience in engineering classificationBachelor's and10 or more years' experience, Master's degree with9 or more years' experience or PhD degree with experience. Bachelor, Master or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry. ABET is the preferred, although not required, accreditation standard. Relocation: This position does offer relocation within INDIA. Applications for this position will be accepted until Aug. 29, 2025 Export Control Requirements This is not an Export Control position. Education Bachelor's Degree or Equivalent Required Relocation This position offers relocation based on candidate eligibility. Visa Sponsorship Employer will not sponsor applicants for employment visa status. Shift Not a Shift Worker (India) Equal Opportunity Employer: We are an equal opportunity employer. We do not accept unlawful discrimination in our recruitment or employment practices on any grounds including but not limited to; race, color, ethnicity, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military and veteran status, or other characteristics covered by applicable law. We have teams in more than 65 countries, and each person plays a role in helping us become one of the worlds most innovative, diverse and inclusive companies. We are proud members of the Valuable 500 and welcome applications from candidates with disabilities. Applicants are encouraged to share with our recruitment team any accommodations required during the recruitment process. Accommodations may include but are not limited toconducting interviews in accessible locations that accommodate mobility needs, encouraging candidates to bring and use any existing assistive technology such as screen readers and offering flexible interview formats such as virtual or phone interviews.

Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. The Power & Signal Integrity Group (PSIG) resides in the CHS (Central Hardware Systems) unit of Qualcomm Technologies, Inc., a leader in wireless communication technology. Engineers in the Power & Signal Integrity Group work with the various business units across Qualcomm to help bring leading edge mobile, ARVR, IoT, Automotive and various others products to market. The candidate will work in a team-oriented environment with cross functional leads to provide electrical design expertise in the areas of signal integrity and power integrity for the design of wireless products and development systems. The engineer will be located in Bangalore, India and will be closely working with the Product architects, Platform HW teams, IOPHY, IC Packaging, and other teams. The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Responsibilities Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 2+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models The following experience is a plus: DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Education Requirements: Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree

About the Role: We're looking for an experienced PCB Design Engineer Module Lead to lead innovative projects in high-speed digital and RF PCB layouts for advanced electronic systems, including radar and electronic warfare systems. As a Module Lead, you will: Oversee the design, development, and implementation of RF and digital PCB layouts. Lead end-to-end design processes, ensuring technical excellence and quality standards. Mentor and guide a dynamic team of engineers to deliver outstanding results. Key Responsibilities Design and develop RF and digital PCB layouts from concept to production. Collaborate with cross-functional teams to gather and evaluate design requirements. Optimize PCB designs for signal integrity, power integrity, and thermal performance. Ensure adherence to industry standards (IPC, MIL-STD) and organizational guidelines. Guide component selection, ensuring compatibility and cost-effectiveness. Perform DFM (Design for Manufacturability), DFT (Design for Testability), and EMI/EMC compliance checks. Conduct simulations and testing to validate PCB performance. Mentor junior engineers and drive team success. Maintain project timelines, allocate resources, and ensure on-time delivery.

Description: DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Requirements: The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Job Responsibilities: Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 4+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models What We Offer: Exciting Projects: We focus on industries like High-Tech, communication, media, healthcare, retail and telecom. Our customer list is full of fantastic global brands and leaders who love what we build for them. Collaborative Environment: You Can expand your skills by collaborating with a diverse team of highly talented people in an open, laidback environment — or even abroad in one of our global centers or client facilities! Work-Life Balance: GlobalLogic prioritizes work-life balance, which is why we offer flexible work schedules, opportunities to work from home, and paid time off and holidays. Professional Development: Our dedicated Learning & Development team regularly organizes Communication skills training(GL Vantage, Toast Master),Stress Management program, professional certifications, and technical and soft skill trainings. Excellent Benefits: We provide our employees with competitive salaries, family medical insurance, Group Term Life Insurance, Group Personal Accident Insurance , NPS(National Pension Scheme ), Periodic health awareness program, extended maternity leave, annual performance bonuses, and referral bonuses. Fun Perks: We want you to love where you work, which is why we host sports events, cultural activities, offer food on subsidies rates, Corporate parties. Our vibrant offices also include dedicated GL Zones, rooftop decks and GL Club where you can drink coffee or tea with your colleagues over a game of table and offer discounts for popular stores and restaurants!