Senior /Lead Analog Design - Multi Phase Power

Why Multi Phase Power

MPP product line offers high performance, innovative and cost-effective power solutions for a broad range of customer applications in enterprise, communications and automotive which include multiple phase DC/DC controllers, smart power stages. In MPP, our mission is to power the processors that power AI & future servers. Target platforms include Intel, AMD, ARM, NVidia and custom ASIC/FPGAs from various vendors.

We are looking for an Analog Design Lead / Senior Design Engineers who have the passion and excitement to grow, innovate, take an active role in designing high current Power stage ICs. This is a fast paced, results driven environment that requires broad knowledge, creativity and excellent interpersonal skills on a daily basis. The engineers have to collaborate with the broader IC development teams (Layout, DV, Test, System Validation & Product Engineers) to deliver products to the market which are compelling, competitive, cost-conscious, manufacturable, and importantly, successful in growing TI's business

Basic Qualifications:

Bachelor's/Master's Degree in EE

5+ Years experience in Analog Design

Basic Job Qualifications:

• Strong competency in transistor level design and implementation of various Analog functions.
• Strong track record of taping out multiple complex IPs to manufacturing.
• Experience in designing analog circuits like operational amplifiers, Band-gap references, comparators, chargepump, level shifters.
• Experience on working with digital designers, providing and defining specs and state machine
• Experience on leading a full chip development /owning a sub-system for a complex chip.
• Top-level integration, Block-level verification across PVT, Statistical Mismatch, layout guidance.
• Strong silicon debugging skill to solve complex silicon problems through simulation and bench testing.
• Good communication, presentation skills and should be a team player.

Preferred qualification:

• Experience on BCD process is a plus.
• Experience in switching DC-DC converter design, buck, buck-boost, control loop is preferred.
• Experience on design and layout of gate drivers, LDMOS, fault systems is highly desirable.
• Understanding of chip level ESD/LU, EM requirements.
• Good knowledge of IC Packaging and production test methodologies.

Primary responsibilities:

• Lead the full chip development with product ownership from definition to release to manufacturing.
• Work closely with marketing and systems teams to define product specifications.
• Work closely with other designers and technologist in defining various architecture.
• Derive block level specification and select the topology based on product requirements.
• Generate top-level simulation plan and collaborate with verification engineer for best coverage.
• Work closely with Layout engineer to get optimized IC layout by minimizing parasitic elements.
• Validate Silicon, assist characterization and participate in De-bug process
• Mentor 1-2 people