Job
Description
Skills/Experience: Experience in Analog Mixed-signal DDR/HBM IP layout and verification of high-speed digital layout and solid understanding of high speed signal Experience in managing the technical aspects of project execution, ensuring timely delivery maintaining high quality standards, Advanced understanding of Deep submicron effects and mitigation, Advanced tool usage, Advanced floorplanning techniques, understand digital flow, Advanced strategies, Solid understanding of CMOS and FinFET layouts and process technology in 28nm and smaller, Good understanding of ESD and latchup layout design considerations, Familiarity with ASIC physical design flow: LEF generation, Place & Route & understanding of top level verification flow, DRC/LVS, LPE, Good understanding of IO frame and pitch requirements, power rail routings, IO abutment rules and requirements, bondpad layout, EM and IR considerations, DFM, etc Scripting skills for layout automation is a plus Responsibilities: High Speed DDR/HBM Layout design Lead the layout design, development and implement technical solutions, Provide subject matter expertise & technical leadership in High Speed design such as DDR/HBM, Work with DDR PHY team, package engineers and system engineers to meet design specs, Perform scheduling duties, Remote site interaction etc Work with local team to support critical layout and floorplanning requirements Coordination duties with other layout teams both in Bangalore and globally, to detail out layout activities and obtain layout deliverables This includes reviewing and quality checking from remote Layout teams, Strict flow adherence and policing of internal policies to secure schedules,
