Chip Design Engineer

Dynpro India Pvt. ltd

5 - 12 years

0 Lacs

karnataka

Posted:2 days ago| Platform: Shine logo

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Skills Required

package design mcm 3d hdi ddr pcie serdes dfm flip chip package design cadence apd packagesubstrate design package assembly rules wire bond 25d blind buried via technologies pcb designs gddr hsio interfaces stackup design dfa rules constraint setting

Work Mode

On-site

Job Type

Full Time

Job Description

You are looking for an IC Package Design Engineer with experience in Flip Chip package design. As an IC Package Design Engineer, your responsibilities will include: - Having experience with Cadence APD IC Package Design, specifically with Flip Chip package design. - Demonstrating a good understanding of package/substrate design and package assembly rules related to flip chip designs. - Being exposed to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D, etc., which would be an added advantage. - Showcasing expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies. - Having hands-on expertise with PCB designs involving High-Speed Parallel Bus interfaces including DDR, GDDR, and HSIO interfaces like PCIe, SERDES. - Having good exposure to Stackup design, DFM, DFA rules, and adherence. - Demonstrating expertise in constraint setting in the layout tool. Qualifications required for this position include: - 5 to 12 years of experience in IC Package Design. - Experience with Cadence APD. - Strong knowledge of package design principles and rules. - Familiarity with various package technologies. - Expertise in High-Speed Complex Package and PCB designs. - Hands-on experience with PCB designs involving High-Speed Parallel Bus interfaces. - Proficiency in constraint setting in layout tools. Please note that the job is based in Bengaluru and there are multiple positions available for this role.,

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