Chip Design Engineer Dynpro India Pvt. ltd

5.0 - 12.0 years

0 Lacs

karnataka

On-site

You are looking for an IC Package Design Engineer with experience in Flip Chip package design. As an IC Package Design Engineer, your responsibilities will include: - Having experience with Cadence APD IC Package Design, specifically with Flip Chip package design. - Demonstrating a good understanding of package/substrate design and package assembly rules related to flip chip designs. - Being exposed to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D, etc., which would be an added advantage. - Showcasing expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies. - Having hands-on expertise with PCB designs involving High-Sp...

Posted 2 days ago

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Title DynPro Chip Design Careers Dynpro India Pvt. ltd

5.0 - 12.0 years

0 Lacs

karnataka

On-site

You are hiring for the position of IC Package Design Engineer with experience in Flip Chip package design. As an ideal candidate, you should have 5 to 12 years of experience in Cadence APD IC Package Design. Your responsibilities will include: - Good understanding of package/substrate design and package assembly rules related to flip chip designs. - Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., will be an added advantage. - Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies. - Hands-on expertise with PCB designs involving High-Speed Parallel Bus interfaces including DDR, GDDR, and HSIO interfaces...

Posted 4 days ago

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APD Package Design Cerebra

5.0 - 10.0 years

8 - 18 Lacs

bengaluru

Hybrid

Job Description: Role: Cadence APD Package Design Experience: 5+ Years Location: Bangalore IC Package Design Engineer Experience with Cadence APD IC Package Design experience with Cadence APD Good understanding of package/substrate design and package assembly rules related to flip chip designs. Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies. Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES. Good Exposure to Stackup design, DFM, DFA rules ...

Posted 1 week ago

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Senior Package Layout Engineer - Hardware NVIDIA

5.0 - 9.0 years

0 Lacs

karnataka

On-site

Role Overview: As a Senior Package Layout Engineer at NVIDIA, you will play a crucial role in collaborating with the Technical Package Lead and various design teams to develop detailed layout of IC substrates for NVIDIA products. Your responsibilities will involve working on high-speed/density ASIC packages, optimizing package pinout, performing package routing and placement, proposing layout design trade-offs, and developing methodologies to enhance layout productivity. Key Responsibilities: - Collaborate with the Layout team to implement high speed/density ASIC packages - Perform substrate breakout patterns for ASIC packages - Optimize package pinout considering system level trade-offs - A...

Posted 1 month ago

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Semiconductor IC Package Design Engineer Izmo Microsystems Pvt Ltd.

5.0 - 7.0 years

10 - 20 Lacs

Bengaluru

Work from Office

Job Title: System-in-Package (SiP) Engineer - Semiconductor IC Package Design Location: Whitefield, Bangalore, India Tools Experience : Cadence APD/SIP MUST HAVE HAVE SYSTEM-IN-PACKAGE DESIGN EXPERIENCE. Company Overview: izmo Microsystems Pvt. Ltd. (www.izmomicro.com) is a pioneering semiconductor and systems company specializing in System-in-Package (SiP) miniaturization. With state-of-the-art facilities in Bangalore, we offer advanced 3D packaging solutions to meet the demands of high-density, high-performance systems across various industries, including consumer electronics, automotive, telecommunications, and green energy. Position Overview: We are seeking an experienced System-in-Packa...

Posted 4 months ago

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