Dynpro India Pvt. ltd logo

Title DynPro Chip Design Careers

5 - 12 years

0 Lacs

karnataka

Posted:4 days ago| Platform: Shine logo

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Skills Required

package design mcm 3d hdi ddr pcie serdes dfm flip chip package design cadence apd packagesubstrate design package assembly rules 25d blind buried via technologies pcb designs gddr hsio interfaces stackup design dfa rules constraint setting

Work Mode

On-site

Job Type

Full Time

Job Description

You are hiring for the position of IC Package Design Engineer with experience in Flip Chip package design. As an ideal candidate, you should have 5 to 12 years of experience in Cadence APD IC Package Design. Your responsibilities will include: - Good understanding of package/substrate design and package assembly rules related to flip chip designs. - Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., will be an added advantage. - Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies. - Hands-on expertise with PCB designs involving High-Speed Parallel Bus interfaces including DDR, GDDR, and HSIO interfaces like PCIe, SERDES. - Good Exposure to Stackup design, DFM, DFA rules, and adherence. - Should have expertise in constraint setting in layout tool. Qualifications required for this role: - Experience with Cadence APD IC Package Design. - Knowledge of High-Speed Complex Package and PCB designs. - Hands-on experience with PCB designs involving High-Speed Parallel Bus interfaces. - Understanding of package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc. The job location for this position is in Bengaluru. This is a great opportunity for multiple candidates with the relevant experience to join a dynamic team.,

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Dynpro India Pvt. ltd logo

Title DynPro Chip Design Careers

Dynpro India Pvt. ltd

karnataka