Senior Package Layout Engineer - Hardware

Role Overview: As a Senior Package Layout Engineer at NVIDIA, you will play a crucial role in collaborating with the Technical Package Lead and various design teams to develop detailed layout of IC substrates for NVIDIA products. Your responsibilities will involve working on high-speed/density ASIC packages, optimizing package pinout, performing package routing and placement, proposing layout design trade-offs, and developing methodologies to enhance layout productivity. Key Responsibilities: - Collaborate with the Layout team to implement high speed/density ASIC packages - Perform substrate breakout patterns for ASIC packages - Optimize package pinout considering system level trade-offs - Assist in package routing, placement, stack-up, and power distribution using Cadence APD or SiP tool suite - Propose layout design trade-offs to the Technical Package Lead - Conduct design feasibility studies to evaluate Package design goals - Develop symbols and CAD library databases using Cadence APD design tools - Enhance layout productivity through the development of methodologies Qualifications Required: - Hold a B.S. Electrical Engineering or equivalent experience - 5+ years of experience in PCB Layout of graphics cards, motherboards, line cards, or related technology - Experience in substrate layout of wire bond and flip chip packages is preferred - Proficiency with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager) - Solid understanding of high-speed design signal integrity practices - Experience with Virtuoso and Calibre is advantageous - Familiarity with Valor is beneficial Join NVIDIA, a globally recognized employer known for its innovation and dedicated workforce. If you are a creative and autonomous individual looking to make a difference, we invite you to be a part of our team.,