Cadence APD Package Design

5 - 10 years

7 - 17 Lacs

Posted:1 week ago| Platform: Naukri logo

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Job Type

Full Time

Job Description

  • IC Package Design Engineer
  • Experience with Cadence APD IC Package Design experience with Cadence APD
  • Good understanding of package/substrate design and package assembly rules related to flip chip designs.
  • Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage
  • Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies.
  • Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES.
  • Good Exposure to Stackup design, DFM, DFA rules and adherence.
  • Should have expertise in constraint setting in layout tool.

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