Posted:4 days ago|
Platform:
On-site
Full Time
Plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems for cutting-edge products. Collaborate with cross-functional teams to develop solutions and meet performance requirements. Develop SoC thermal analysis methodologies encompassing SoC, package, and systems for various Qualcomm products (smartphones, laptops, automotive, VR headsets). Develop strategies to predict and improve thermally constrained scores (e.g., AnTuTu/Geekbench). Measure and tune thermal performance on post-silicon platforms, including infrared imaging. Improve thermal mitigation strategies through power and thermal management to achieve optimal system thermal performance. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Skills: Strong analytical skills and mathematical modeling abilities. Knowledge of SoC stack-up is essential. Good knowledge of scripting in PERL/Python is required; some exposure to Machine Learning algorithms/frameworks is a plus. Thorough knowledge of heat transfer mechanisms and Computational Fluid Dynamics (CFD). Proficiency with state-of-the-art thermal analysis tools (e.g., Ansys Icepak/Flotherm). Thermal measurement skills will be preferred.
Qualcomm
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