SOC Thermal engineer

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Job Function: SOC Thermal analysis methodology developmentencompassing SoC, package and systems, for various Qualcomm products going into smartphones, laptops, automotives and virtual reality headsets. Developing strategies to predict and improve thermally constrained scores (AnTuTu/Geekbench) and also measure/tune it on post-Si platforms, including infrared imaging. Thermal measurement The candidate will be responsible for improving thermal mitigation strategies through power and thermal management to achieve optimal system thermal performance. Skills: Should possess strong analytical skills and mathematical modeling abilities. Knowledge of SOC stack up is must Good knowledge of scripting in PERL/Python required; some exposure to Machine Learning algorithms/frameworks will be a plus. Need to have thorough knowledge of heat transfer mechanisms and CFD. Proficiency with state-of-the-art thermal analysis tools- Ansys Icepak/Flotherm Thermal Measurement will be preferred skill Experience: BE/ME graduates with 1 to 3 years of experience.