Job
Description
Role Overview: Tata Semiconductor Manufacturing Pvt. Ltd. (TSMPL) is seeking an experienced BEOL Process Integration Lead to drive the development and optimization of embedded non-volatile memory (eNVM) technologies, including eFlash, RRAM, MRAM, and FeRAM across CMOS nodes from 130nm to 28nm, including BCD and FinFET platforms. As a BEOL Process Integration Lead, you will be responsible for leading integration setup, process development, and stabilization to meet performance, reliability, and manufacturability goals. Your role will involve guiding cross-functional teams, collaborating with tool and module owners, designing and executing experiments, analyzing data, defining process flows, and ensuring successful mass production ramp. Key Responsibilities: - Lead eNVM (eFuse, eFlash, RRAM, MRAM, and FeRAM) process integration across nodes (130nm to 28nm), including BCD and FinFET technologies - Guide cross-functional teams to execute lots and meet development, qualification, and ramp milestones - Collaborate with tool and module owners to optimize BEOL processes for eNVM cell integration - Design and execute experiments (DOE) to refine BEOL steps: deposition, patterning, etching, and interconnect formation - Analyze data to resolve integration issues and improve yield, reliability, and manufacturability - Define and implement process flows, design rules, test structures, and inline/ET specs during technology development - Lead prototyping activities from tapeout to execution - Ensure successful mass production ramp through safe launch procedures and qualification of customer samples - Transfer and standardize BEOL processes across manufacturing sites while maintaining quality and consistency - Collaborate with process, design, and test teams to ensure seamless BEOL integration - Characterize electrical and physical performance of interconnects - Apply statistical analysis to optimize process windows and control strategies - Innovate and continuously improve BEOL processes to meet evolving device and program requirements - Prolific in filing innovative solutions as disclosures Qualifications: - 5-15 years of experience in the semiconductor industry with eNVM BEOL - B.Tech, MS, or PhD in Physics, Electrical Engineering, or related field with strong CMOS process integration knowledge - Experience in process/device integration or engineering for embedded memories (eFlash, RRAM, MRAM, FeRAM) - Solid understanding of semiconductor wafer processing, device physics, and product engineering - Proven expertise in eNVM cell design and integration; familiarity with automotive-grade memory qualification (AEC-Q100) - Knowledge of key process modules, yield enhancement, DFM methodologies, and process variation constraints - Skilled in DOE, SPC, and data analysis for process optimization and issue resolution - Strong cross-functional collaboration with process, device, product, and fab operations teams (Note: Additional details of the company were not included in the provided job description.),
