Posted:5 hours ago|
Platform:
Work from Office
Full Time
He will be responsible for following activities-
1. CAD/Pick and Place Data extraction from Gerber using software tools.
2. Preparation of CAD file using pick and place data received from customer.
3. Pick and Place program generation using offline software from prepared CAD file.
4. Loading of Pick and Place program in Machine and verification of program.
5. Setup of machine feeder, Verification of loaded feeder, Defining packages, Testing all components, Mounting, Verification and Validation of first board.
6. Defining Temperature profile for different paste.
7. Taking profile at change over or start of production.
8. Verification and Validation of Temperature profile.
9. Knowledge of 24x7 profiling inf reflow.
10. Knowledge of designing of reflow pallets.
11. Setup of PCB Buffer and maintaining the FIFO.
12. Setting of Auto width adjustment/Follow me.
13. Programming of 3D SPI using stencil Gerber and CAD, defining Height, Area and Volume criteria as per IPC.
14. SPC/Data/Result analysis of SPI.
15. Setting up feedback system from SPI to Screen Printer.
16. Screen Printer setup, Verification of set parameters and program validation.
17. Locking of stencil, Paste, Squeeze and Program using QR code scanner.
18. Auto counting of strokes, Verification and Validation of stencils.
19. Solder paste storage, Readiness of solder Paste and maintaining logs.
20. Setting up link conveyors, PCB loaders and Unloaders.
21. Programming of 3D AOI, Setting of process parameters as per IPC standard, Review of AOI results/SPC. False call analysis.
22. Use of offline programming and review stations at AOI stage.
23. Knowledge of X ray inspection/Analysis, Defining new programs, setting up criteria as per IPC.
24. Review of AOI/SPI and X-rays results for improvements.
25. PCB Routing machine programming and setup.
26. Candidate must have ability to demonstrate all these activities to External/Internal interested parties(Customer/Visitors/Auditors etc.)
Preference to Diploma in Electronics Engineering and Graduate Electronic Engineers or MSc Electronics or B.Sc. Electronics.
Mechanical Engineers with 100% experience in electronics manufacturing in SMT may also be considered.
Deep Knowledge of IPC 610, ISO documentation, ANSI2020 soldering expert/specialist is an added advantage.
Fluency in English is definitely an advantage.
Walk in candidates will be given priority on a first come first serve basis.
Candidates from Competing EMS companies will be given priority. For exceptional candidates housing may be offered free of cost.
Frontline Electronics
Upload Resume
Drag or click to upload
Your data is secure with us, protected by advanced encryption.
Browse through a variety of job opportunities tailored to your skills and preferences. Filter by location, experience, salary, and more to find your perfect fit.
We have sent an OTP to your contact. Please enter it below to verify.
pune, bengaluru
7.5 - 10.0 Lacs P.A.
bengaluru
3.0 - 4.0 Lacs P.A.
6.5 - 8.5 Lacs P.A.
7.0 - 8.0 Lacs P.A.
4.0 - 5.0 Lacs P.A.
3.0 - 5.0 Lacs P.A.
4.0 - 6.0 Lacs P.A.
pune, bengaluru
7.5 - 10.0 Lacs P.A.
5.0 - 7.0 Lacs P.A.
7.0 - 14.0 Lacs P.A.