RapidCircuitry (formerly Onivart Labs)

Job Title: Product & Industrial Design Intern (Wearables, Enclosures & 3D Printing) — 6 months Location: Hyderabad, India (On-site) Type: Full-time Internship (6 months) Reports To: Design Lead / Product Manager Stipend: Competitive; PPO opportunity based on performance About Rapid Circuitry Rapid Circuitry builds embedded systems, IoT devices, industrial electronics, and connected products end-to-end — from PCB and firmware to cloud dashboards and mobile apps. You’ll design rugged, manufacturable enclosures and wearable form-factors that bridge physical hardware with simple, reliable user interactions in the field. Role Overview You’ll focus on wearable devices and industrial casings : translating PCB outlines, batteries, sensors, antennas, and connectors into ergonomic, production-ready enclosures. Day-to-day includes CAD modeling, 3D-print iteration, DFM/DFX, basic environmental constraints (IP, drop, thermal) , and device-level UX (buttons, haptics, LEDs, labels). You’ll work closely with hardware/firmware to ship parts that assemble cleanly, protect electronics, and feel great on-body. Key Responsibilities Discover & Define Shadow users (field techs, operators, law-enforcement) to capture use context : gloves, sweat, dust, vibration, sunlight, rain, and charging workflows. Translate insights into requirements & constraints : ingress protection targets (e.g., IP54–IP67 prototypes), drop heights, strap/belt-clip use, allowable skin temperature, serviceability. Enclosure & Wearable Design Convert board keep-outs and component stack-ups into parametric CAD (bosses, ribs, fillets, draft, living hinges, snap-fits vs screws). Design for materials & processes : FDM/SLA/SLS/MJF for prototyping; guidance toward injection molding (gate/parting, ejectors, draft, knit lines) for production. Integrate seals & shielding : gaskets/O-rings, membranes/vents, standoffs, EMI paint/foils, light-pipes, strain relief, cable glands, and heat-set inserts. Plan antenna-safe geometry (BLE/LTE/GNSS): plastic windows, ground clearances, and reduced metallic mass near RF zones. 3D Printing & Rapid Iteration Own print-ready setup : orientation, tolerances, compensation, supports, and slicing (e.g., Bambu Studio/PrusaSlicer). Select materials by use: PLA/PETG (fit checks), ASA/ABS (UV/impact), PA12/CF-Nylon (rigidity), TPU (gaskets/straps/bumpers). Perform post-processing : thread tapping/inserts, sanding/bead-blast, dye/paint, basic assembly jigs/fixtures. Device-Level UX & Labeling Specify buttons, haptics, status LEDs, iconography, port layouts, and service labels for clear, glove-friendly operation. Create print-ready assets (silks/overlays/laser marks) and short interaction specs the firmware team can implement. Validation & Test Support Build fixtures and execute fit/finish checks with PCB+battery assemblies. Assist with basic environmental & mechanical checks : splash/dust trials, quick thermal probes, drop/vibration pre-tests, strap/buckle cycle tests. Document findings and drive design revisions with evidence. Collaboration & Delivery Keep tidy CAD, BOM, and 2D drawings with basic GD&T for vendor handoff. Work in sprints; partner with EE/FW on connector choices, pogo-pins/magsafe-style docks, charging orientation, and serviceability. Maintain organized Figma files for any companion UI states that touch the device (pairing flows, error states). Required Qualifications Final-year student or recent graduate in Industrial/Product Design , Mechanical/Mechatronics , HCI with hardware focus , or equivalent. Portfolio with at least 2 hardware-centric projects showcasing enclosure/wearable design, CAD, and physical prototypes (photos/videos preferred). Solid CAD skills (Fusion 360 or SolidWorks): assemblies, joints, drafts, interference checks , and 2D drawings. Working knowledge of tolerancing , fasteners, heat-set inserts, and snap-fit design . Comfort operating FDM printers end-to-end and iterating quickly. Nice-to-Have (Plus Points) Exposure to injection molding DFM , ultrasonic welding, adhesives (3M VHB, cyanoacrylates), and potting/conformal coatings . Basics of RF/antenna keep-outs , sensor windows (PPG/ECG, MIC vents), and on-body ergonomics/biocompatibility (ISO 10993 awareness). SLA/SLS/MJF experience; TPU strap/bumper design; light-pipe and gasket design. Understanding of IP ratings , thermal paths (pads, copper pours, sinks), and simple FEA or hand-calc sanity checks. Familiarity with small companion UI: pairing prompts, LED/haptic language, error copy. Tools You’ll Use CAD: Fusion 360 / SolidWorks 3D Printing: Bambu/Prusa FDM in-house; vendor SLA/SLS/MJF Slicers: Bambu Studio, PrusaSlicer Visualization: KeyShot / Blender Docs & Handoff: 2D drawings (PDF/DXF), BOMs, Notion/Jira/Confluence, Figma (for device UI/labels) What You’ll Learn Taking a device from PCB outline → enclosure → bench tests → pilot run . Process selection : when to keep printing vs prepare for tooling. Collaborating with EE/FW on connectorization, charging, antennas, and on-device UX . Building assembly jigs/fixtures and tightening feedback loops with the shop floor. Success Criteria (6-Month Outcomes) Ship 2–3 enclosure iterations that pass fit checks with live electronics. Demonstrate a prototype that meets a target ingress level (e.g., IP54) or validated drop threshold (agreed at kickoff). Deliver production-ready drawings (basic GD&T) and a small pilot batch via in-house printing/vendor support. Publish a capstone case study covering problem, constraints, iterations, and measurable outcomes (assembly time reduction, fewer field issues, or improved comfort). Application Process Apply: contact@rapidcircuitry.com with resume + portfolio (hardware prototypes/CAD links). Portfolio Discussion (30–45 min): Focus on an enclosure/wearable project; walk us through constraints and validation. Practical Exercise (48–72 hrs): Create/iterate an enclosure around a provided PCB outline (prints + brief CAD + rationale). Final Interview: Design reviews with Design + Engineering; calibration on DFM/iteration cadence. Eligibility & Duration Start Date: Rolling; specify availability. Duration: 6 months (full-time, on-site). PPO: High performers may receive a Pre-Placement Offer. 📧 Apply at: contact@rapidcircuitry.com 🌐 Website: www.rapidcircuitry.com/careers

Job Title: Business Development Intern (Sales & R&D Programs) — 6 months Location: Hyderabad, India (On-site) Type: Full-time Internship (6 months) Reports To: CEO / Head of Business Stipend: Competitive; performance incentives on qualified meetings & closures; PPO based on results ⸻ About Rapid Circuitry Rapid Circuitry provides end-to-end electronics and IoT product engineering—from electronics/PCB/RF design to embedded hardware, firmware, and production support—serving sectors such as healthcare, industrial automation, and consumer electronics. You’ll help take this expertise to market and turn opportunities into PoCs, pilots, and production programs.   ⸻ Role Overview Own a full-funnel growth charter across two motions: 1. Revenue / Services Sales: Build pipeline, run discovery, coordinate technical scoping with engineering, and drive proposals to closed-won. 2. R&D / NRE Programs: Convert fuzzy problem statements into SoWs with milestones, align IP/NDAs, and land PoC → pilot engagements that mature into production. Target segments (indicative): Industrial IoT & automation, healthcare/medtech devices, wearables & safety, drone/agri OEMs, smart city/public safety, electronics/PCB/RF projects—aligned to Rapid Circuitry’s design services and industrial solutions.  ⸻ Key Responsibilities Market Intelligence & ICP • Define Ideal Customer Profiles and buyer personas (Founder/CTO/Head of Ops/Procurement). • Build target account lists by segment/region; monitor competitor offerings and price bands. • Track tenders/RFPs (incl. GeM/e-proc) and summarize fit/no-fit. Pipeline Generation • Run multi-channel outbound (LinkedIn/email/phone/WhatsApp) with tailored value props referencing Rapid Circuitry’s electronics, PCB, RF, embedded hardware capabilities.  • Hit weekly top-of-funnel targets (new accounts & contacts added). Discovery & Scoping • Lead 30–45 min discovery to capture pain, constraints, budget, timeline, and success criteria. • Coordinate quick feasibility with engineering (rough BOM ranges, risks, timelines). Proposals & Deal Management • Draft commercial proposals (scope, deliverables, acceptance tests, commercials, payment milestones). • Drive SoWs for R&D/NRE (milestone billing, IP/foreground/background definitions) and manage NDA/MSA workflows. • Maintain CRM hygiene (stages, values, dates, next actions). Partnerships & Programs • Map channel/SI partners, incubators, accelerators, and OEM innovation teams; create partner plays for repeatable PoC → pilot pipelines. • Spot and prepare grant/challenge applications with required tech narratives. Events & Collateral • Pre-book meetings for events/expos; execute on-site lead capture; run post-event cadences. • Maintain one-pagers, case summaries, pricing sheets, intro decks aligned to our services (electronics/PCB/RF/embedded hardware; compliance/design review).  Handover & Expansion • Run structured handoffs to delivery with clear success criteria and timelines. • Identify upsell/cross-sell (pilot → rollout, additional SKUs/services such as compliance testing, production support). ⸻ Required Qualifications • Final-year student or recent graduate in Business/Engineering/Operations (or equivalent). • Demonstrated sales hustle (internships, campus sales, freelancing, or side projects). • Excellent written & spoken English/Hindi/Telugu; strong cold-outreach comfort. • Organization & follow-through: manage many accounts, cadences, and follow-ups in parallel. ⸻ Nice-to-Have (Plus Points) • Familiarity with electronics/IoT lifecycles (prototype → pilot → production) and PCB/RF/embedded basics.  • Experience with RFPs/tenders (GeM), vendor onboarding, NDAs, and basic contracts. • Ability to read block diagrams/BOMs to sanity-check scope and margins. • Tools experience: LinkedIn Sales Navigator, Apollo/Snov, HubSpot/Pipedrive. • Numbers-first mindset: Sheets/Excel for pricing and simple ROI models. ⸻ Tools You’ll Use • CRM: HubSpot / Pipedrive • Prospecting: LinkedIn Sales Navigator, Apollo/Snov • Comms: Gmail/Google Meet, WhatsApp Business, Zoom • Docs & Collateral: Google Workspace, Notion, Canva/Figma • Tracking: Sheets for quotes, margin calc, and forecast ⸻ What You’ll Learn • Taking a lead from first touch → discovery → technical scope → proposal → close → handover. • Shaping feasible, profitable offers with engineering (and knowing when to say no). • Building repeatable outbound and partner motions. • Forecasting, pipeline risk management, and exec reporting. ⸻ Application Process 1. Apply: contact@rapidcircuitry.com with resume + a short note on a sales/R&D win you’re proud of. 2. Exercise (24–48 hrs): Build a target list of 30 ICP accounts for one segment (e.g., industrial or medtech), draft a 5-touch cadence, and write a 1-page value prop mapped to Rapid Circuitry’s services.  3. Role-Play (30–45 min): Live discovery call + objection handling. 4. Final Interview: Review pipeline thinking, writing quality, and collaboration style. ⸻ Eligibility & Duration • Start Date: Rolling; specify availability. • Duration: 6 months (full-time, on-site). • PPO: Offered to top performers who hit targets and demonstrate ownership. ⸻ 📧 Apply at: contact@rapidcircuitry.com 🌐 Website: www.rapidcircuitry.com