Photonics Die Attach Engineer

As a Photonics Die Attach Engineer, joining our team would be beneficial for you if you have previous expertise working in silicon photonics die attachment engineering. You will be responsible for creating and executing die attach methods for photonics devices such as silicon dies, laser diodes, optical modulators, lens, and photodiodes. Working closely with the global Subject Matter Expert (SME) team and research and development team, you will contribute to the creation and development of new products. Your role will involve optimizing the die attach process to achieve high yields and high reliability, along with supporting the process development independently all the way to mass production. **Key Responsibilities:** - Develop die attachment methods for silicon photonics devices using diverse methodologies such as eutectic bonding, epoxy dispensing, silver sintering, and soldering. - Improve die attachment techniques to ensure high yields and dependability. - Collaborate with the SME team and customers to support the development of new products. - Work with manufacturing teams to establish and scale up die attachment techniques in a production setting, ensuring mass production process capabilities are optimized. - Create and maintain documentation for die attachment processes. - Conduct Design of Experiment (DOE) and optimize process parameters and materials. - Monitor and enhance die attachment methods to maintain quality and performance consistency. - Evaluate process data, conduct corrective steps, and collaborate with quality and reliability teams to meet client specifications and industry standards. **Qualifications Required:** - Bachelor's degree in materials science, electrical engineering, or a related field. - At least 5 years of experience in developing and improving photonics die attach processes. - Deep understanding of materials, processes, and tools used for die attach. - Familiarity with automated die attach processes, flip-chip die attach, optical alignment techniques, statistical process control, and process optimization techniques. - Strong problem-solving skills, communication, teamwork, and documentation abilities. - Knowledge of industry standards for making photonics devices. - Stay updated on the latest advancements in die attach technology and apply this knowledge to enhance processes and products.,