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2.0 - 5.0 years

2 - 5 Lacs

Gurugram, Bhiwadi

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Design, simulate, test, and debug analog/digital/RF circuits Create schematics Work closely with PCB layout engineers and manage design flow Selection of components, create & optimize BOM Perform hardware testing & debugging Use Oscilloscope, Logic Analyzer, Multimeter, Function Generator Ensure RoHS, IEC, ISO, EMI/EMC compliance Perform thermal and signal integrity analysis

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2.0 - 4.0 years

6 - 10 Lacs

Bengaluru

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Role & responsibilities High-Speed PCB Design: Develop PCB layouts for high-speed systems, including DDR, PCIe, USB, Ethernet, and other high-frequency interfaces. Signal and Power Integrity: Perform signal and power integrity analysis to ensure optimal design performance. Layer Stack-up Design: Define PCB stack-ups and impedance-controlled designs for high-speed and high-density applications. Simulation and Validation: Use simulation tools to validate designs for crosstalk, impedance matching, and high-speed signals. Component Placement and Routing: Optimize placement and routing strategies to meet performance, manufacturability, and cost requirements. Design for Manufacturing (DFM) and Test (DFT): Collaborate with fabrication and assembly teams to ensure manufacturability and testability of designs. Documentation: Generate detailed design files, BOMs, and fabrication documentation. Compliance: Ensure designs adhere to industry standards (e.g., IPC-6012, ISO 9001) and regulatory requirements. Collaboration: Work closely with hardware, firmware, and system engineering teams to meet project requirements. Preferred candidate profile Bachelors degree in Electrical Engineering, Electronics, or a related field. 3+ years of experience in PCB design with a focus on high-speed digital and RF designs. Expertise in Altium for PCB Design Strong knowledge of signal integrity, power integrity, and EMI/EMC design principles. Proficiency in high-speed interfaces (DDR3/DDR4/DDR5, PCIe, SerDes, etc.). Familiarity with simulation tools like HyperLynx, Ansys, or SIwave for signal and power integrity analysis. Hands-on experience with impedance-controlled designs and differential pair routing. Solid understanding of PCB fabrication and assembly processes.

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5 - 10 years

7 - 12 Lacs

Bengaluru

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Power Management Designer About Applied Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible the technology shaping the future. To achieve this, we employ some of the best, brightest, and most talented people in the world who work together as part of a winning team. While virtually every nationality, culture, and background are currently represented within Applied Materials, we strive for a more robust Culture of Inclusion (COI) and diversity. Leveraging our COI vision helps drive innovation, build organizational capabilities, create equal opportunities for everyone, and achieve our companys definition of Winning. Our Team Interested in accelerating the AI and Big Data inflection across industries? Are you customer-obsessed, experienced, entrepreneurial, and looking for your next challenge? You will be joining a team of highly accomplished engineers and architects with a diverse background from across the computing industry. As a member of this group, you will work on developing specifications from system to materials and developing solutions that require innovations from Systems to materials. As the computing requirements across IoT, Big Data and AI are increasing, we believe we need optimizations and innovations across all the layers of design and optimizations at the algorithm, software and silicon design level is not enough anymore. Drive improvements in PPACt (power, performance, area, cost, and Time) for the future cloud and edge workloads, we need to come up with new architectures that will require us to take a new approach to the system design. We are looking for engineers who are technically fearless and drive solutions to its conclusion. Your Opportunity The Applied Materials Systems to Materials Group team is actively recruiting for a highly motivated, energetic, and accomplished Analog Circuit design engineer to lead and drive innovative Analog circuit design. The ideal candidate will design Power management subsystem and circuits that are tightly coupled with product related considerations like PD/ID, thermals, reliability, power, performance, and PCB floor planning while taking into consideration for system efficiency, noise, ripple, load regulation, EMI/EMC, integration, size, and cost. This role also requires interpersonal skills like effective communication, dealing with ambiguities and collaboration with cross-functional teams across system architects, software, firmware, and other hardware engineers. Candidate will have the opportunity to contribute for the best standards, methodologies, and practices in system development and grow in this high pace environment. Roles and Responsibility Technical lead for full Power system development lifecycle, from Concept, electrical specifications, process node selection, die size estimation, architecture, IC design, and test execution phases. Gather Power system-level requirements for AI/HPC, Automotive and 5G/6G applications; translate requirements into technical specifications for design that are competitive and scalable. Research new ideas and concepts for power topologies such as buck, boost, buck-boost, charge pumps, LDOs for differentiated value for the customers. Deep understanding of control architectures such as current mode, voltage mode, and hysteretic mode for applications include DC/DC converters. Strong understanding of semiconductor device physics, device safe-operating area (SOA), and power transistors used for high frequency switching. Solid understanding of DC/DC power converter modeling techniques using any of the following simulation tools such as MATLAB, Virtuoso, Hyperlynx, PSIM, or Spectre. Understanding of Analog IC circuit design as it relates to power conversion architecture requirements, design tools and methodologies. Circuit blocks include bandgap references, op amps, OTAs, bias circuits, comparators, oscillators, DACs, ADCs, level- shifters, switching power stages, LDOs, charge pumps, glue logic. Key parameters include voltage and current accuracy, load and line transient response, DC gain, bandwidth, phase, and gain margin, slew rate, efficiency, offset, PSRR, CMRR, noise, propagation delay, input and output common mode range, supply headroom. Knowledge of IC/package level considerations, including component selection, PCB/package layout, packaging technologies and thermal analysis. IC process technologies, reliability design rules, ESD and reliability design rules. Design and simulate for optimal Power Integrity parameters such as steady state, transient states, system efficiency, PDN impedance, EMI/EMC, slew rate di/dt, PSRR, Jitter/noise on power supply, gate propagation delay, control loop response (gain and phase), static/dynamic current loads, average power consumption, thermal performance at the chip and package level. Mentor others for the best practices and methodologies in system development. Our Ideal Candidate BS/MS/PhD in electrical engineering or computer engineering 5+ years of experience in architecting or implementing Analog power circuit designs. Strong fundamentals in Analog and power architectures. Background in SoC/Silicon/PCB understanding of technology. Proficient with simulation skills in PI tools Keysight ADS or Mentor Graphics Hyperlynx and analog circuit transient and stead state simulation using HSPICE or Spectre. Proficient in reviewing design (Schematics and layout/Gerber) files using PCB design tools like Cadence Allegro Proficient in lab measurement skills using basic test and measurement equipment like digital oscilloscope, DMM, function generators, differential probes, passive/active probes, voltage, and current probes. Strong communication skills & ability to clearly document technical solutions.

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5 - 10 years

7 - 12 Lacs

Bengaluru

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TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsbilties: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Should have total work experience of 3-8+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork

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3 - 6 years

12 - 15 Lacs

Chennai

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Your Role Perform Highspeed simulations (SI/PI) using Hyperlynx and Ansys tools. Create comprehensive reports with results and solutions EMI/EMC, Math and circuit SPICE based simulations Co-operation with local and remote engineering teams. Active participation in peer reviews. On-time execution of assigned tasks in compliance with APTIV quality standards. Follow Electrical Design Process. Continuous development of professional qualifications. Secure confidential information and companys property. On-time execution of assigned tasks in compliance with the valid quality system Create business impact through cost saving and participating in Business critical reviews Your Background Key ingredients for succeeding in this role are your : Qualified with Bachelors in Electronic Engineering 5-10 years of experience in High speed simulations focusing on Signal & Power integrity analysis Hands on experience in simulation tools like Hyperlynx / Ansys tool suits Hands on experience with simulations like LPDDR4 and above, PCIe Gen3 and above, CSI-2, OSPI, QSPI etc., Sound knowledge on simulation models like IBIS, SPICE, touchstone etc., Sound knowledge of electronics design & EMC EMI/EMC simulation (CE, RE, ESD, BCI..) experience is an added advantage Automotive industry experience is an added advantage Good English skills (both spoken and written) Communication skills Problem Solving Skills. Why join us? You can grow at Aptiv.Aptiv provides an inclusive work environment where all individuals can grow and develop, regardless of gender, ethnicity or beliefs. You can have an impact. Safety is a core Aptiv value; we want a safer world for us and our children, one with: Zero fatalities, Zero injuries, Zero accidents. You have support. We ensure you have the resources and support you need to take care of your family and your physical and mental health with a competitive health insurance package.

Posted 3 months ago

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