4 High-Speed Design Jobs

About the Role: We're looking for an experienced PCB Design Engineer Module Lead to lead innovative projects in high-speed digital and RF PCB layouts for advanced electronic systems, including radar and electronic warfare systems. As a Module Lead, you will: Oversee the design, development, and implementation of RF and digital PCB layouts. Lead end-to-end design processes, ensuring technical excellence and quality standards. Mentor and guide a dynamic team of engineers to deliver outstanding results. Key Responsibilities Design and develop RF and digital PCB layouts from concept to production. Collaborate with cross-functional teams to gather and evaluate design requirements. Optimize PCB designs for signal integrity, power integrity, and thermal performance. Ensure adherence to industry standards (IPC, MIL-STD) and organizational guidelines. Guide component selection, ensuring compatibility and cost-effectiveness. Perform DFM (Design for Manufacturability), DFT (Design for Testability), and EMI/EMC compliance checks. Conduct simulations and testing to validate PCB performance. Mentor junior engineers and drive team success. Maintain project timelines, allocate resources, and ensure on-time delivery.

Role & responsibilities High-speed design FPGA Based design experience (Xilinx/Intel) Intel Based Server designs Interfaces like (JESD, SFP, QSFP, I2C, SPI, USB, PCIe, etc) Memory (DDR3/4, eMMC, QSPI etc) Testing, Bring-up, and debug RF Basics (Power Amplifiers High power or Small signal RF) ADC/DAC basics SI/PI Analysis Documentation skills like Design Document Layout Guidelines creation RCA/ CAPA Block diagram creations etc.

Job Overview As a manager in the Signal Integrity team you will lead the SI engineers focusing on aspects of electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industry targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to drive development teams in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will assign resources to work on the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will be expected to coordinate to drive the advancement of simulation tools and capabilities, identifying potential areas of process improvement, and solving complex problems and ensuring product development success. Responsibilities: Align the technology roadmap with front end / customer, and implement accordingly Familiar with signal integrity design, simulation and validation activities through product development cycles Coordinate to define signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers Guide the team to preform signal integrity simulations for multiple high-speed standards on each product, including determining the correct simulation methodology, as well as a good understanding of the criteria for each interface. Driving product development for business success Engaging in innovative simulation and test tool improvement and process enhancement Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint. Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positions Mandate Skills: Bachelor s degree in electrical engineering or equivalent work experience; Master s degrees highly recommended Minium of 10 years of relevant work experience in electrical design, RF design, or PCB design, with 3+ years managerial experience in leading an electrical or SI engineering team Familiar with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Good analytical capabilities to interpret simulation and lab data to identify issues and provide guidance to team to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Strong background to work in a global environment - able to accommodate varying time zones and capable of collaborating with individuals across geographies. Ability to, and experience with, teaching and training peers in applying software tools and methodologies, and in the use of electrical test equipment, including VNA s and TDR s Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques

Key Responsibilities: Understand customer requirements and translate them into hardware specifications. Select appropriate electronic components based on performance and cost. Perform circuit design analysis thermal, timing, load, and signal integrity. Schematic design using OrCAD, and BOM optimization. Work closely with PCB layout team to ensure: EMI/EMC compliance DFM guidelines Board bring-up, debugging, testing, and validation. Conduct EMI/EMC pre-compliance testing in certified labs. Coordinate with production for mass manufacturing and resolve production issues. Plan and support test-jig design for production testing. Preferred candidate profile Willing to relocate to Chennai (Preference for Tamil-speaking candidates). Notice period: Immediate joiners or within 60 days. Candidates should disclose recent interview activity (within last 3-6 months). Candidates serving notice period will be prioritized. If you are interested kindly share me your updated CV at jeevabvr@gmail.com