9 High-Speed Design Jobs

We are seeking an experienced and detail-oriented PCB Layout Engineer to join our engineering team. The ideal candidate should possess a solid understanding of PCB design principles, manufacturing processes, and electronic systems with experience in high-speed digital and analog designs. The role involves working with cross-functional teams including Signal Integrity (SI), Power Integrity (PI), and Mechanical Engineering teams to deliver robust, production-ready PCB layouts. Key Responsibilities: Apply extensive knowledge of PCB layout engineering, manufacturing processes, and IPC standards Ensure adherence to DFM (Design for Manufacturing), DFA (Design for Assembly), and DFT (Design for Testability) guidelines Prepare and deliver fabrication and assembly documentation for PCB manufacturing Execute high-speed, multi-layer PCB designs using Cadence Allegro Collaborate with SI/PI teams to ensure signal and power integrity Design with consideration for EMI/EMC, thermal performance, and mechanical constraints Handle complex board layouts including x86-based computing, server, and storage systems Provide technical leadership and guidance to junior team members Automate design processes and contribute to EDA tool automation efforts Manage and maintain library databases for components Work collaboratively with cross-functional teams to ensure design quality and project timelines Maintain documentation and ensure successful handoff to manufacturing Required Qualifications & Skills: 5+ years of experience in PCB Layout for computers, servers, or storage applications Proficiency in Cadence Allegro; knowledge of Mentor Graphics, Altium is a plus Technical expertise in High-Speed Digital, Analog, and Power Supply Design Experience with Intel processor platforms (e.g., Sandy Bridge) and DDRx memory, Ethernet interfaces Familiarity with Signal Integrity (SI) and Power Integrity (PI) principles Solid understanding of DFx, Valor, CAM350, and other DFM/DFA tools Proven record of project participation from design to production Proficient in Microsoft Office tools and basic project management concepts Knowledge in EDA tool scripting/automation (preferred) Strong organizational, analytical, and multi-tasking abilities Effective verbal and written communication skills Strong team player with a collaborative mindset

Job Overview As a manager in the Signal Integrity team you will lead the SI engineers focusing on aspects of electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industry targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to drive development teams in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will assign resources to work on the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will be expected to coordinate to drive the advancement of simulation tools and capabilities, identifying potential areas of process improvement, and solving complex problems and ensuring product development success. Responsibilities: Align the technology roadmap with front end / customer, and implement accordingly Familiar with signal integrity design, simulation and validation activities through product development cycles Coordinate to define signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers Guide the team to preform signal integrity simulations for multiple high-speed standards on each product, including determining the correct simulation methodology, as well as a good understanding of the criteria for each interface. Driving product development for business success Engaging in innovative simulation and test tool improvement and process enhancement Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint. Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positions Mandate Skills: Bachelor s degree in electrical engineering or equivalent work experience; Master s degrees highly recommended Minium of 10 years of relevant work experience in electrical design, RF design, or PCB design, with 3+ years managerial experience in leading an electrical or SI engineering team Familiar with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Good analytical capabilities to interpret simulation and lab data to identify issues and provide guidance to team to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Strong background to work in a global environment - able to accommodate varying time zones and capable of collaborating with individuals across geographies. Ability to, and experience with, teaching and training peers in applying software tools and methodologies, and in the use of electrical test equipment, including VNA s and TDR s Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques

Job Overview As a manager in the Signal Integrity team you will lead the SI engineers focusing on aspects of electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industry targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to drive development teams in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will assign resources to work on the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will be expected to coordinate to drive the advancement of simulation tools and capabilities, identifying potential areas of process improvement, and solving complex problems and ensuring product development success. Responsibilities: Align the technology roadmap with front end / customer, and implement accordingly Familiar with signal integrity design, simulation and validation activities through product development cycles Coordinate to define signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers Guide the team to preform signal integrity simulations for multiple high-speed standards on each product, including determining the correct simulation methodology, as well as a good understanding of the criteria for each interface. Driving product development for business success Engaging in innovative simulation and test tool improvement and process enhancement Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint. Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positions Mandate Skills: Bachelor s degree in electrical engineering or equivalent work experience; Master s degrees highly recommended Minium of 10 years of relevant work experience in electrical design, RF design, or PCB design, with 3+ years managerial experience in leading an electrical or SI engineering team Familiar with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Good analytical capabilities to interpret simulation and lab data to identify issues and provide guidance to team to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Strong background to work in a global environment - able to accommodate varying time zones and capable of collaborating with individuals across geographies. Ability to, and experience with, teaching and training peers in applying software tools and methodologies, and in the use of electrical test equipment, including VNA s and TDR s Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques

Job Description Job Description Overview As a leading global aerospace company, Boeing develops, manufactures and services commercial airplanes, defense products and space systems for customers in more than 150 countries. As a top U.S. exporter, the company leverages the talents of a global supplier base to advance economic opportunity, sustainability and community impact. Boeing's team is committed to innovating for the future, leading with sustainability, and cultivating a culture based on the company's core values of safety, quality and integrity. Technology for today and tomorrow The Boeing India Engineering & Technology Center (BIETC) is a 5500+ engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global markets, and leverage new-age technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive Manufacturing, shaping the future of aerospace. People-driven culture At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring together different perspectives and thoughts - enabling every voice to be heard and every perspective to be respected. No matter where or how our teammates work, we are committed to positively shaping people's careers and being thoughtful about employee wellbeing. With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace. Position Overview Boeing India Engineering has an immediate opening for an Associate Electronics RF Design and Analysis Engineer to work in areas of RF design. This position offers a unique opportunity to work complex technical challenges in support of safety operation and return to service. This role will be based out of Bangalore, India. Position Responsibilities: Responsible for RF and mixed signal designs. Design and simulate RF circuits for cellular modules including LNAs, filters, Diplexers, switching and matching networks. Perform testing and validation of RF components and systems - RF amplifiers, filters, and antennas - to validate performance against specifications. Perform RF validation, tuning, and debugging using tools such as VNA, spectrum analyzers, and signal generators Perform simulation of filters and antenna synthesis using tools like Ansys HFSS Perform circuit design, requirements and interface definition and design verification. Design to meetEMI/EMC, safety and environmental compliance. Develop and optimize RF systems supporting Wifi,4G LTE and 5G. Execute testing of designs in Labs for functional, performance and stress environments apart from system integration Basic Qualifications (Required Skills and Experience) Bachelor's or Master's Degree is required as a basic qualification in Electronics and Communication Engineering with 4 to 8 years of relevant experience. Preferred Qualifications (Desired Skills/Experience): Candidate should have experience in RF Design integration capabilities for Wireless communications and 5G integration Candidate should have strong experience in high-speed design clocking, Ethernet/Serdes/MIPI designs Candidate should have strong experience in knowledge of using simulation tools like SABER RD and creating simulation models with MATLAB and SABER Candidate should have experience with Power Integrity analysis, Hyperlynx SI and Mentor suite of eCAD tools Candidate should have basic knowledge of cellular and Wi-Fi standards Relocation: This position does offer relocation within INDIA. Applications for this position will be accepted until Aug. 29, 2025 Export Control Requirements: This is not an Export Control position. Education Bachelor's Degree or Equivalent Required Relocation This position offers relocation based on candidate eligibility. Visa Sponsorship Employer will not sponsor applicants for employment visa status. Shift Not a Shift Worker (India) Equal Opportunity Employer: We are an equal opportunity employer. We do not accept unlawful discrimination in our recruitment or employment practices on any grounds including but not limited to race, color, ethnicity, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military and veteran status, or other characteristics covered by applicable law. We have teams in more than 65 countries, and each person plays a role in helping us become one of the world's most innovative, diverse and inclusive companies. We are proud members of the and welcome applications from candidates with disabilities. Applicants are encouraged to share with our recruitment team any accommodations required during the recruitment process. Accommodations may include but are not limited to: conducting interviews in accessible locations that accommodate mobility needs, encouraging candidates to bring and use any existing assistive technology such as screen readers and offering flexible interview formats such as virtual or phone interviews.

About the Role: We're looking for an experienced PCB Design Engineer Module Lead to lead innovative projects in high-speed digital and RF PCB layouts for advanced electronic systems, including radar and electronic warfare systems. As a Module Lead, you will: Oversee the design, development, and implementation of RF and digital PCB layouts. Lead end-to-end design processes, ensuring technical excellence and quality standards. Mentor and guide a dynamic team of engineers to deliver outstanding results. Key Responsibilities Design and develop RF and digital PCB layouts from concept to production. Collaborate with cross-functional teams to gather and evaluate design requirements. Optimize PCB designs for signal integrity, power integrity, and thermal performance. Ensure adherence to industry standards (IPC, MIL-STD) and organizational guidelines. Guide component selection, ensuring compatibility and cost-effectiveness. Perform DFM (Design for Manufacturability), DFT (Design for Testability), and EMI/EMC compliance checks. Conduct simulations and testing to validate PCB performance. Mentor junior engineers and drive team success. Maintain project timelines, allocate resources, and ensure on-time delivery.

About the Role: We're looking for an experienced PCB Design Engineer Module Lead to lead innovative projects in high-speed digital and RF PCB layouts for advanced electronic systems, including radar and electronic warfare systems. As a Module Lead, you will: Oversee the design, development, and implementation of RF and digital PCB layouts. Lead end-to-end design processes, ensuring technical excellence and quality standards. Mentor and guide a dynamic team of engineers to deliver outstanding results. Key Responsibilities Design and develop RF and digital PCB layouts from concept to production. Collaborate with cross-functional teams to gather and evaluate design requirements. Optimize PCB designs for signal integrity, power integrity, and thermal performance. Ensure adherence to industry standards (IPC, MIL-STD) and organizational guidelines. Guide component selection, ensuring compatibility and cost-effectiveness. Perform DFM (Design for Manufacturability), DFT (Design for Testability), and EMI/EMC compliance checks. Conduct simulations and testing to validate PCB performance. Mentor junior engineers and drive team success. Maintain project timelines, allocate resources, and ensure on-time delivery.

Role & responsibilities High-speed design FPGA Based design experience (Xilinx/Intel) Intel Based Server designs Interfaces like (JESD, SFP, QSFP, I2C, SPI, USB, PCIe, etc) Memory (DDR3/4, eMMC, QSPI etc) Testing, Bring-up, and debug RF Basics (Power Amplifiers High power or Small signal RF) ADC/DAC basics SI/PI Analysis Documentation skills like Design Document Layout Guidelines creation RCA/ CAPA Block diagram creations etc.

Job Overview As a manager in the Signal Integrity team you will lead the SI engineers focusing on aspects of electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industry targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to drive development teams in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will assign resources to work on the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will be expected to coordinate to drive the advancement of simulation tools and capabilities, identifying potential areas of process improvement, and solving complex problems and ensuring product development success. Responsibilities: Align the technology roadmap with front end / customer, and implement accordingly Familiar with signal integrity design, simulation and validation activities through product development cycles Coordinate to define signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers Guide the team to preform signal integrity simulations for multiple high-speed standards on each product, including determining the correct simulation methodology, as well as a good understanding of the criteria for each interface. Driving product development for business success Engaging in innovative simulation and test tool improvement and process enhancement Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint. Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positions Mandate Skills: Bachelor s degree in electrical engineering or equivalent work experience; Master s degrees highly recommended Minium of 10 years of relevant work experience in electrical design, RF design, or PCB design, with 3+ years managerial experience in leading an electrical or SI engineering team Familiar with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Good analytical capabilities to interpret simulation and lab data to identify issues and provide guidance to team to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Strong background to work in a global environment - able to accommodate varying time zones and capable of collaborating with individuals across geographies. Ability to, and experience with, teaching and training peers in applying software tools and methodologies, and in the use of electrical test equipment, including VNA s and TDR s Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques

Key Responsibilities: Understand customer requirements and translate them into hardware specifications. Select appropriate electronic components based on performance and cost. Perform circuit design analysis thermal, timing, load, and signal integrity. Schematic design using OrCAD, and BOM optimization. Work closely with PCB layout team to ensure: EMI/EMC compliance DFM guidelines Board bring-up, debugging, testing, and validation. Conduct EMI/EMC pre-compliance testing in certified labs. Coordinate with production for mass manufacturing and resolve production issues. Plan and support test-jig design for production testing. Preferred candidate profile Willing to relocate to Chennai (Preference for Tamil-speaking candidates). Notice period: Immediate joiners or within 60 days. Candidates should disclose recent interview activity (within last 3-6 months). Candidates serving notice period will be prioritized. If you are interested kindly share me your updated CV at jeevabvr@gmail.com