5.0 - 9.0 years

0 Lacs

pune, maharashtra

On-site

You are an accomplished Photonics Wire Bonding Engineer responsible for developing and implementing wire bonding procedures for silicon photonics devices like silicon dies, laser diodes, optical modulators, and photodiodes. Your main role involves collaborating with the global SME and R&D team to innovate new products and optimize wire bonding processes to achieve high yields and dependability. You will work autonomously to support process development until mass production. Your key responsibilities include designing and developing wire bonding processes for various silicon photonics devices using different methodologies like ribbon bond, ball bond, and wedge bond. You will optimize wire bonding processes with various wire types to ensure high yields and reliability. Evaluating bond capillary type selection, wire type, and controlling wire bonding processes will be essential. Collaborating with teams to design new products and scaling up wire bonding processes in a production setting is also crucial. Documenting processes, monitoring and improving wire bonding quality consistently, and analyzing data for corrective actions will be part of your routine tasks. You will work with quality and reliability teams to ensure customer requirements are met and industry standards are maintained. To qualify for this role, you should hold a Bachelor's degree in electrical engineering, materials science, or a related field with at least 5 years of experience in photonics wire bonding process development. Strong knowledge of wire bonding materials, processes, and equipment is required along with experience in automated wire bonding equipment and optical alignment techniques. Familiarity with high-volume manufacturing of photonics devices, statistical process control, and troubleshooting complex technical issues is vital. Effective communication, collaboration skills, and experience with process documentation and quality control methodologies are necessary. Keeping updated with the latest wire bonding technology developments and applying them to enhance processes and products is expected.,

Posted 2 weeks ago

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