5 Semiconductor Foundry Jobs

As a member of Tata Electronics, a subsidiary of Tata Sons Pvt. Ltd., you will be part of a pioneering initiative to establish India's first AI-enabled state-of-the-art Semiconductor Foundry. This cutting-edge facility is dedicated to producing chips for a variety of applications, including power management IC, display drivers, microcontrollers (MCU), and high-performance computing logic. These chips cater to the increasing demands of sectors such as automotive, computing, data storage, wireless communications, and artificial intelligence. Your role will involve integration responsibilities for the transfer of 28-90nm technologies from partner facilities, focusing on feature enhancements and performance improvements while meeting reliability, yield, schedule, and cost objectives. You will also be responsible for leading the R&D efforts for new nodes and technology variants, designing and laying out test chips for device/technology optimization, reliability assessment, and SPICE model extraction. Additionally, you will be tasked with end-to-end project management, from the initial project justification to final qualification and yield ramp. This includes ensuring the achievement of desired performance, quality/yield, schedule, and cost targets. You will lead a diverse, cross-functional team across multiple geographies, fostering strong customer relationships based on confidence in Tata Electronics" technical capabilities. To excel in this role, you should possess a Master's or Ph.D. in Electrical Engineering, Materials Science, or equivalent, with a strong understanding of device physics, process modules, yield improvement, failure mechanisms, and analytical techniques. Your proven track record in developing and transferring technologies into high-volume manufacturing, along with deep knowledge of CMOS, SRAM, and eNVM parameters, will be crucial. Your ability to lead cross-functional teams effectively and achieve project completion within timeline and cost constraints is essential. Furthermore, your innovative mindset, problem-solving skills, and adaptability to different cultures and geographies will be key to success in this role. With over 15 years of experience in the semiconductor industry and a track record of successfully developing new technologies for high-volume production, you are expected to drive innovation, collaboration, and continuous improvement within the organization. If you are a self-motivated individual with leadership skills, a thirst for knowledge, and a passion for driving change in a dynamic industry, we invite you to join our team at Tata Electronics and be part of our journey towards technological excellence and global leadership in semiconductor manufacturing.,

As a Senior Director at Tata Electronics Private Limited (TEPL), you will play a crucial role in leading the construction of a cutting-edge semiconductor FAB facility. In this position, you will be responsible for ensuring safety, quality, and efficiency throughout the project execution process. Your duties will include overseeing the integration of procurement and design processes, managing relationships with key suppliers, and ensuring adherence to project indicators such as timelines, budgets, and quality benchmarks. Your key responsibilities will involve developing and enforcing safety protocols and quality standards, collaborating with design, procurement, and engineering teams for seamless integration, and managing relationships with suppliers and contractors to meet performance goals. You will also be responsible for monitoring project indicators and taking corrective actions to ensure project objectives are met. Additionally, you will need to proactively identify and mitigate program risks to ensure smooth execution. The ideal candidate for this role will have extensive experience in large-scale FAB construction, a proven track record in safety and quality management, and exceptional leadership skills to drive program success. If you are passionate about working in a dynamic environment and are committed to delivering high-quality results, we invite you to join our team at Tata Electronics and be part of this exciting venture in the semiconductor industry.,

You will be leading the Wafer Electrical Test (E-Test) and Wafer Sort Test module team for a 300mm Wafer Fab. Your role will involve ensuring quality compliance across 28nm to 110nm nodes with technology transfer partners. Collaborating with SCM and suppliers to procure top-tier tools, probe-cards, and consumables will be a crucial aspect of your responsibilities. Managing a 24x7 production test floor team of engineers and technicians will be part of your daily tasks. You will define floorplans and ensure capacity with Facilities and Industrial Engineering teams. Driving process improvements, test time reduction, and debug algorithm efficiency will also be under your purview. Coordination with integration and customer teams on test chip layouts and probe-card design will be essential. Your role will involve ensuring operational excellence, meeting performance KPIs, conducting competitor benchmarking, and developing technology roadmaps. Presenting updates to internal and customer senior executives will also be part of your responsibilities. Travel will be required as needed. To excel in this role, you should possess proven ability to lead large 24x7 production teams and mentor high-performing professionals. Being self-driven, independent, and results-oriented is key to success. Strong cross-functional collaboration skills across global teams, inclusive leadership style, and adaptability to diverse cultural norms are essential attributes. You should be a curious, data-driven, and resilient problem-solver. Open, humble, and relationship-focused communication style is important. Being creative and agile in exploring new ideas and adapting to change will be beneficial. Qualifications required for this role include a Bachelor's degree in electrical engineering, Engineering Physics, Materials Science, or equivalent; a Masters degree is preferred. A strong understanding of device physics, process modules, yield improvement, failure mechanisms, and hands-on experience with Etest Program and/or equipment is necessary. Deep experience with Wafer Electrical and Sort Test programs and tools such as HP-Agilent, Keithley, Keysight, Advantest, and TEL Probers is expected. You should be able to write E-test programs, familiar with load boards, probecards, SMUs, equipment hardware, and software. Understanding the equipment supplier landscape and which tools are appropriate for different technologies is crucial. An innovation mindset is desired. The ideal candidate will have 12+ years of experience in the semiconductor industry and leading cross-functional projects and teams to achieve organizational objectives. A proven track record of successfully developing and testing new technologies into high volume production, as well as structured problem-solving skills using design of experiments, 8D, and bench tools, are preferred.,

You will be joining Tata Electronics Private Limited (TEPL), a greenfield venture of the Tata Group specialized in manufacturing precision components. As a subsidiary of Tata Sons Pvt. Ltd., TEPL is at the forefront of establishing India's first AI-enabled state-of-the-art Semiconductor Foundry. This cutting-edge facility is dedicated to producing chips for various applications including power management IC, display drivers, microcontrollers (MCU), and high-performance computing logic to cater to the increasing demands in sectors such as automotive, computing, data storage, wireless communications, and artificial intelligence. Your primary responsibilities will revolve around the integration of RF-CMOS and RF-SOI technologies, enhancing existing technologies by adding features like active devices and passives, and developing new technologies to enhance performance and expand application capabilities. You may also lead projects related to Wide Band Gap RF technologies, design and layout test chips for optimization, assessment, and SPICE model extraction. Moreover, you will be involved in end-to-end project management, from the initial project justification to final qualification and yield ramp, ensuring the achievement of desired performance, quality, yield, schedule, and cost targets. Collaboration with the Design enablement team and CAD partners to create a user-friendly PDK with a well-characterized toolbox will be essential. You will also engage with universities, research labs, and commercial entities to drive a world-class roadmap and build strong customer relationships based on TEPL's technical capabilities. Essential attributes for this role include the ability to manage, mentor, and lead a team, work independently with a drive to succeed, collaborate effectively across diverse teams globally, and exhibit leadership skills to influence all levels of the organization. Additionally, you should be adaptable, inclusive, innovative, and resilient in the face of challenges, fostering a culture of learning, collaboration, and creativity. To qualify for this position, you should hold an M.S. or Ph.D. in Electrical Engineering, Physics, or equivalent, with a strong understanding of CMOS, SiGe BICMOS, RF power devices, and technology integration. Your expertise should include knowledge of RF technology parameters, competitive performance achievement, volume manufacturing delivery, integration feature impact assessment, basic circuit design and characterization, and familiarity with RF front end module trends and standards. The ideal candidate will have over 15 years of experience in the semiconductor industry, a proven track record of developing new technologies for high-volume production, problem-solving skills using design of experiments and analytical tools, and a history of publications and patents. Your ability to lead cross-functional teams, work across cultures and geographies, and maintain an innovative and competitive mindset will be key to success in this role.,

You will be responsible for integration tasks related to RF-CMOS and RF-SOI technologies, including adding features to existing technologies and developing new technologies to enhance performance and expand application range. Your duties may also involve leading Wide Band Gap RF technologies. Additionally, you will be involved in designing and laying out test chips for device optimization, reliability assessment, and SPICE model extraction. Your role will encompass end-to-end project management, from initial project justification to final qualification and yield ramp, ensuring achievement of performance, quality, schedule, and cost targets. Collaboration with the Design enablement team and CAD partners to facilitate a user-friendly Process Design Kit (PDK) will be essential. You will engage with universities, research labs, and commercial entities to drive a cutting-edge technology roadmap. Building and supervising a diverse cross-functional team will be a key aspect of your responsibilities. You will also establish and nurture strong customer relationships based on confidence in Tata Electronics Private Limited's technical capabilities. Regular travel, typically a few weeks per quarter, may be required. Essential Attributes: - Ability to effectively manage, mentor, and lead a team of highly motivated professionals. - Self-motivated with a strong drive to succeed and the capacity to work independently. - Capable of collaborating with diverse cross-functional teams globally. - Possess leadership skills to influence all organizational levels. - Inclusive and adaptable to various global norms and situations. - Enthusiastic learner who approaches challenges with curiosity and resilience. - Collaborative and innovative, open to new ideas and quick to adapt to change. Qualifications: - M.S. or PhD in Electrical Engineering, Physics, or equivalent field. - Profound understanding of CMOS (including SOI), SiGe BICMOS, and RF power devices and technology integration. - Deep knowledge of RF technology parameters and performance metrics. - Demonstrated track record in transitioning technologies to high-volume manufacturing. - Extensive familiarity with integration features impacting technology performance and costs. - Experience in designing and characterizing basic circuits and circuit elements/devices. - Prior publications and patents in relevant areas. - Familiarity with key modules related to RF technologies. - Understanding of RF front end module trends and standards. - Proven ability to lead cross-functional teams and deliver projects within timeline and cost constraints. - Comfortable working with diverse cultures and geographies. - Strong team player with an innovative and competitive mindset. Desired Experience Level: - Over 15 years of experience in the semiconductor industry. - Proven history of successfully introducing new technologies into high-volume production. - Strong problem-solving skills utilizing design of experiments and analytical tools.,