Director/Head of RF Technologies Tata Electronics

15.0 - 19.0 years

0 Lacs

gujarat

On-site

Role Overview: You will be responsible for integration tasks related to RF-CMOS and RF-SOI technologies, including adding features to existing technologies and developing new technologies to enhance performance and expand application range. Your duties may also involve leading Wide Band Gap RF technologies. Additionally, you will be involved in designing and laying out test chips for device optimization, reliability assessment, and SPICE model extraction. Your role will encompass end-to-end project management, from initial project justification to final qualification and yield ramp, ensuring achievement of performance, quality, schedule, and cost targets. Collaboration with the Design enable...

Posted 1 month ago

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Sr. Director/Head of RF Technologies (Integration - RF-CMOS and RF-SOI technologies) Tata Electronics

15.0 - 19.0 years

0 Lacs

gujarat

On-site

You will be joining Tata Electronics Private Limited (TEPL), a greenfield venture of the Tata Group specialized in manufacturing precision components. As a subsidiary of Tata Sons Pvt. Ltd., TEPL is at the forefront of establishing India's first AI-enabled state-of-the-art Semiconductor Foundry. This cutting-edge facility is dedicated to producing chips for various applications including power management IC, display drivers, microcontrollers (MCU), and high-performance computing logic to cater to the increasing demands in sectors such as automotive, computing, data storage, wireless communications, and artificial intelligence. Your primary responsibilities will revolve around the integration...

Posted 3 months ago

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Director/Head of RF Technologies Tata Electronics

15.0 - 19.0 years

0 Lacs

gujarat

On-site

You will be responsible for integration tasks related to RF-CMOS and RF-SOI technologies, including adding features to existing technologies and developing new technologies to enhance performance and expand application range. Your duties may also involve leading Wide Band Gap RF technologies. Additionally, you will be involved in designing and laying out test chips for device optimization, reliability assessment, and SPICE model extraction. Your role will encompass end-to-end project management, from initial project justification to final qualification and yield ramp, ensuring achievement of performance, quality, schedule, and cost targets. Collaboration with the Design enablement team and C...

Posted 3 months ago

AI Match Score

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