SOC Floorplanning Lead Intel Corporation

12.0 - 16.0 years

0 Lacs

karnataka

On-site

Foundry Services (FS) is an independent foundry business established to meet customers" unique product needs. With the first Open System Foundry model globally, combined offerings include wafer fabrication, advanced process, packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities. This helps customers build innovative silicon designs and deliver customizable products from Intel's secure, resilient, and sustainable supply source. This job opportunity in FS will be part of the Customer Solutions Engineering (CSE) group, responsible for bringing the best of Intel technologies to FS customers, accelerating solutions from architecture to post-silicon validation. We are seeking an experienced Floorplan Engineer to focus on floor plan, die estimation, and power planning for high-performance designs. Responsibilities include establishing integration plans for die with optimization for package and board constraints, bump planning, die file generation, collaborating with architects for IP or SoC placement optimization, clocking and dataflow collaboration, deriving specifications for IP blocks, coordinating with power delivery team, maximizing die-per-reticle/good-die-per-wafer, RDL routing knowledge, and package integration before tape-out. **Qualifications:** - 12+ years of experience after a Bachelor or Master of Engineering degree in Electrical/Electronic/VLSI Engineering or related field. - Led multiple SOCs as SOC Floorplan lead, expertise in design planning, die estimation, knowledge of clocking, high-speed design signal routing, industry protocols, IP architecture, library/memory/technology/submicron issues. - Strong teamwork, flexibility, ability to thrive in a dynamic environment. **Job Type:** Experienced Hire **Shift:** Shift 1 (India) **Primary Location:** India, Bangalore Intel Foundry is committed to transforming the global semiconductor industry by providing cutting-edge silicon process and packaging technology. Innovating under Moore's Law, fostering collaboration, and investing in geographically diverse manufacturing capacities. Intel Foundry enables the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, dedicated to customer success with full P&L responsibilities.,

Posted 1 day ago

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Bonding/RDL routing/Package Interface Aarna Hr Solutions

2.0 - 5.0 years

4 - 7 Lacs

Bengaluru, Karnataka, India

On-site

Description The Bonding/RDL Routing/Package Interface role is crucial for developing innovative packaging solutions in the semiconductor industry. The candidate will be responsible for designing and optimizing bonding and routing strategies, ensuring effective integration of package interfaces, and collaborating with various teams to deliver high-quality products. Responsibilities Design and optimize bonding and routing strategies for advanced packaging solutions. Collaborate with cross-functional teams to ensure seamless package interface integration. Analyze and troubleshoot issues related to RDL routing and bonding processes. Develop and maintain documentation for bonding and routing methodologies and best practices. Conduct testing and validation of package interfaces to ensure reliability and performance. Skills and Qualifications Bachelor's degree in Electrical Engineering, Electronics, or a related field. Strong understanding of semiconductor packaging processes and materials. Proficiency in CAD tools for layout design and simulation (e.g., Cadence, Mentor Graphics). Experience with RDL (Re-distribution Layer) design and bonding techniques. Knowledge of electrical and thermal performance analysis for package interfaces. Familiarity with IPC standards related to electronic packaging.

Posted 6 days ago

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