4 Q3D Jobs

Job Overview Executes complex simulations in CFD and Thermal to optimize design and manufacturing. Develops complex Multiphysics simulation methods that meets design requirements in thermal management of Electronic Systems, especially in high-speed transceivers, connectors, and their assemblies. KEY RESPOSBILITIES: 10 years of industry experience, Expertise in Ansys Workbench. Experience on connector products (Plastic and Sheet Metal parts). Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Leading the development and implementation of complex Thermal simulation models to optimize manufacturing, designs or processes. Perform calculation & simulation on temperature distribution over system. Conducted thermo-mechanical and structural simulations to support design optimization, material selection, and validation from concept to production. Proficient in simplifying complex CAD geometries for efficient structural and thermal simulation analyses In-depth knowledge of mechanical design, conductive, convective, & radiation heat transfer, and fluid flow mechanics. Collaborate with designer, manufacturing, and testing teams to correlate CFD & Thermal Simulation results with physical testing Experience with DOE (Design of Experiments) and optimization techniques Directing cross-functional teams to address and resolve intricate design and manufacturing issues. Analyzing complex simulation results to identify areas for improvement and driving design or process changes. Ensuring the maintenance and updating of simulation models to achieve optimal accuracy and relevance. Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Deploy CFD Techniques steady, transient, conjugate heat transfer, internal & external flows, electronics cooling, electro-thermal analysis using Software tools like Ansys Work Bench, Fluent, CFX, Icepak, AEDT, Q3D etc. DESIRED SKILLS BE/ B.Tech (Mechanical) M Tech (Mechanical) (preferred)/ PHD Knowledge of products, design processes and methodology. Proficiency in state-of-the-art o CFD Ansys Fluent, Icepak, CFX, AEDT, & Q3D. o CAD tools- PTC Creo, Space Claim, Ansys Discovery. o Programming language Python (preferred) Proficiency in use of MS Office tools. Knowledge of associated manufacturing processes (molding, stamping, plating, crimping & assy). Knowledge about the Soldering, crimping & welding technologies. Knowledge on technical paper publications & applying for patents

JOB OVERVIEW Executes complex simulations in CFD and Thermal to optimize design and manufacturing. Develops complex Multiphysics simulation methods that meets design requirements in thermal management of Electronic Systems, especially in high-speed transceivers, connectors, and their assemblies. KEY RESPOSBILITIES: 5 to 8 years of industry experience. Expertise in Ansys Workbench. Experience on connector products (Plastic and Sheet Metal parts). Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Expertise on CAE tools, Optimization techniques, and testing methods. Development & execution of complex Thermal simulation models to optimize manufacturing, designs or processes for high-speed IO products in data center, telecom and allied applications. Perform calculation & simulation on temperature distribution over system. Proficient in simplifying complex CAD geometries for efficient structural and thermal simulation analyses In-depth knowledge of mechanical design, conductive, convective, & radiation heat transfer, and fluid flow mechanics. Collaborate with designer, manufacturing, and testing teams to correlate CFD & Thermal Simulation results with physical testing Experience with DOE (Design of Experiments) and optimization techniques Ensuring the maintenance and updating of simulation models to achieve optimal accuracy and relevance. Execute CFD Techniques steady, transient, conjugate heat transfer, internal & external flows, electronics cooling, electro-thermal analysis using Software tools like Ansys Work Bench, Fluent, CFX, Icepak, AEDT, Q3D etc. Translate actual problem to Thermal model, interpret analysis results and select best solution. Monitor and evaluate simulation software capabilities and industry trends. Collaborate with design & validation teams to enhance the design optimization. Understanding the influence/impact activities on financial decision.

As a member of Qualcomm Customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in Mobile, PC, IoT, Automotive and consumer electronics markets. Experience in designing industry Standard form factor modules like SMARC, COM Express, COM HPC, Single Sided LGA, OSM etc Proficient in schematic capture tools like OrCAD and Siemens Mentor Graphics Designer. Proficient in PCB layout tools like Cadence Allegro and Siemens Mentor Graphics Expedition. Proficient in Power Distribution Network (PDN) methodologies and schemes. Proficient in routing topologies for PC-DDR, DDR, and termination schemes. Proficient in routing schemes of high-speed interfaces like USB 3, PCIe 3+, Ethernet (1 Gbps or higher) and other SERDES interfaces Knowledge of high-speed simulation tools like Ansys Q3D, Cadence Sigrity, and Sentinel is necessary Candidates should have excellent communication skills (oral and written), to handle external customers across the geographies Hands on knowledge of running PDN (power distribution network) simulations of a PCB is desired Experience in analog, power, digital, and RF PCB layout aspects. Hands-on experience with multilayer PCBs (at least 12 layers, at least 10 cm x 10 cm, with a processor or FPGA having > 500 pins and pitch smaller than 0.5 mm) and upto 2.00mm thickness. Knowledge of PCB layout tools like Altium Designer and Mentor PADS is a plus. Knowledge of thermal impacts and mechanical constraints on a PCB. Experience in documenting PCB guidelines, checklists, and rules. Candidate should have 5-8 years of relevant experience. Past expertise in interacting with multiple teams in HW, domain skills in Digital/High Speed/SoC is desirable. Candidates should be proficient in reviewing schematics & PCB layout of customer designs, in accordance with Qualcomm and general electrical guidelines and checks Hands-on with electrical test & measurement equipments like oscilloscopes, power supplies, multimeters, data loggers are a plus Exposure to general purpose prototyping platforms like Arduino, Raspberry Pi are a plus Preferred Qualifications Sound understanding of HW and PCB design. Strong understanding of signal integrity and electromagnetic compatibility (EMC) principles. Experience with Design for Manufacturability (DFM) and Design for Testability (DFT) practices. Familiarity with IPC standards for PCB design and manufacturing. Ability to perform design reviews and provide constructive feedback. Excellent problem-solving skills and attention to detail. Effective communication skills for collaborating with cross-functional teams. Ability to manage multiple projects and meet deadlines.

Role & responsibilities Summary / Role Purpose The Product Specialist (m/f/d) joins the Ansys Electronics Business Unit to conduct software testing of Ansys Electronics applications such as HFSS, SIwave, Q3D Extractor, Maxwell and Icepak on Cloud environment. This role helps to assess how well the product meets customers needs both in terms of functionality and usability and ensures that product requirements and quality standards are satisfied per the company’s quality procedures. The individual works closely with other members of the product creation and field engineering team and communicates with technical specialists on product issues. In this position, the engineer contributes to the quality of tools that are used throughout the industry to develop electronics products in a wide range of industries. Key Duties and Responsibilities • Test Ansys Electronics Products on Cloud and HPC (High Performance Computing) Environment Perform benchmark of projects on different HPC and Hardware configuration Develop/contribute to automation scripts • Apply standard techniques and procedures and comply with the company's overall development and testing processes • Work in a variety of computing environments: Windows, Linux, AWS, Azure, Any programming or scripting language – C++/Python/.. • Work closely with product owners, documentation and development in an agile environment. • Support the team in following the Ansys software development life cycle • Analyze defect reports from customers Minimum Education/Certification Requirements and Experience • BS in Engineering, Electronics and Communication, Electrical and Electronics or related field Preferred Qualifications and Skills Electromagnetic simulation experience (HFSS highly preferred) • Experience with HPC (including GPU) and Cloud environment • Familiarity with Python and automation scripts • Basic understanding of software testing and verification processes • Good communication and interpersonal skills • Ability to learn quickly and to collaborate with others in a geographically distributed team • Fluent English, both written and spoken Preferred candidate profile