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2.0 - 6.0 years
0 Lacs
delhi
On-site
As an R&D Engineer specializing in bonding wires, you will play a crucial role in analyzing the market for bonding wire products, identifying trends, and providing valuable insights for product development and enhancement. Your expertise in the OSAT industry or semiconductor packaging and assembly lines will be highly beneficial in this role. Your responsibilities will include conducting in-depth market research and competitive analysis to pinpoint trends and customer requirements in bonding wire technology. You will also delve into bonding wire materials and processes to propose enhancements and improvements. Collaboration with the manufacturing team will be essential to ensure that market demands align with production capabilities. Additionally, you will work closely with cross-functional teams to introduce new bonding wire solutions and drive innovation. Supporting R&D initiatives through technical analysis and product optimization will also be part of your role. To excel in this position, you should possess 2-4 years of experience in R&D or production support, preferably within the OSAT or semiconductor packaging sector. A solid understanding of bonding wires and their applications in electronics packaging is crucial. Experience in packaging and assembly processes would be an added advantage. Strong analytical skills and the ability to interpret market data for effective product development are key requirements. Furthermore, excellent communication skills will be essential for seamless collaboration with various teams. If you are passionate about leveraging your expertise in bonding wires to contribute to product development and innovation, this role offers an exciting opportunity to make a significant impact in the field.,
Posted 1 month ago
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